• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.31-32
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• 2012

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.1
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• pp.172-180
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• 2005

Dynamic slicing method decomposes a program into slices and supports to be understood programs easily by software developer or maintainer. In this paper, we propose dynamic slicing algorithm to reduce time to decompose a program. We produce reference-variable set used in right and modify-variable set used in left on the basis of the assignment operator of all sentences and extract Inter-Variable Relationship(VV) for all variables of variable declaration. Proposed algorithm extracts dynamic slices by using them and execution trace of program. In conclusion, proposed algorithm improved the performance by reducing the time to extract dynamic slices by decreasing average comparison count of sentence when the number of criterion variables is three or more.

• KIPS Transactions on Software and Data Engineering
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• v.4 no.1
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• pp.1-8
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• 2015

Safety critical systems require exhaustive verification of safety properties, because even a single corner-case fault can cause a critical safety failure. However, existing verification approaches are too costly in terms of time and computational resource required, making it hard to be applied in practice. In this paper, we implemented a tool for minimizing the size of the verification target w.r.t. verification properties to check, based on program slicing technique[1]. The efficacy of program slicing using our tool is demonstrated in a case study with a verification target Trampoline[3], which is an open source automotive operating system compliant with OSEK/VDX[2]. Experiments have shown enhanced performance in verification, with a 71% reduction in the size of the code.

• The Transactions of the Korea Information Processing Society
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• v.5 no.10
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• pp.2556-2566
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• 1998

Program slicing is a technique to extract the statements which influence the value of a variable at a particular point of the program. It has been proposed that this technique is useful in debugging, iptimization, program maintenance, testing, extraction reusable components and other applications including the understanding of the program behavior. This paper aims to address the problem of slicing programs with Jump goto, break, continue in C statements, It was found that previous slicing algorithms do not always generate semantically correct slices when applied to such programs. We, therefore, point out why the previous methods do not work in this more general setting, and describe our eficient solutions that compate more correctly executable slices for such programs.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.9 no.6
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• pp.9-14
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• 2009

In this paper, we proposed spreading code slicing technique for efficient transmitter detection in AT-DMB system with single frequency network. At the transmitter, the spreading code for transmitter identification inserted using slicing technique on forehead of null symbol and then transmitted. In this point, it requires high correlation characteristic spreading code. At the receiver, peak to peak value calculated by correlation process before signal demodulation. The transmitter information by proposed technique is employed to implement the single frequency network (SFN) which is proposed for solving a frequency inefficiency problem of the MFN. The results of the paper can be applied to wireless multimedia digital broadcasting system.

• The KIPS Transactions:PartD
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• v.10D no.6
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• pp.999-1010
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• 2003

Program slicing is s method to extract the statements from the program which have an influence on the value of a variable at a paricular point of the program. Program slicing is applied for many applications, such as program degugging, program testing, program integration, parallel program execution, software metrics, reverse engineering, and software maintenance, etc. This paper is the study to create the exact slice in the presence of Object Reference State Graph to generate more exactly static analysis information of objects in the program of the presence of complicated data structure.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.05a
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• pp.461-465
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• 2002

When general software system wants to need continuous Dept of Software Engineering by discovery of specification imperative sentence in some program, programmer analyzes program through practice orbit chase of program about value of input data. This paper that see therefore applies object intention program Slicing to existent program Slicing method, and express practice orbit of program in object intention subordination graph and show process that become Slicing. Proposed algorithm defenses crab extension is possible and can be used advantageously in case program is developed gradually as well as.

• Journal of Internet Computing and Services
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• v.23 no.5
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• pp.17-23
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• 2022

Network slicing is a promising paradigm and significant evolution for adjusting the heterogeneous services based on different requirements by placing dynamic virtual network functions (VNF) forwarding graph (VNFFG) and orchestrating service function chaining (SFC) based on criticalities of Quality of Service (QoS) classes. In system architecture, software-defined networks (SDN), network functions virtualization (NFV), and edge computing are used to provide resourceful data view, configurable virtual resources, and control interfaces for developing the modified deep reinforcement learning agent (MDRL-A). In this paper, task requests, tolerable delays, and required resources are differentiated for input state observations to identify the non-critical/critical classes, since each user equipment can execute different QoS application services. We design intelligent slicing for handing the cross-domain resource with MDRL-A in solving network problems and eliminating resource usage. The agent interacts with controllers and orchestrators to manage the flow rule installation and physical resource allocation in NFV infrastructure (NFVI) with the proposed formulation of completion time and criticality criteria. Simulation is conducted in SDN/NFV environment and capturing the QoS performances between conventional and MDRL-A approaches.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.2
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• pp.424-435
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• 1991

To develop the photoelastic experiment method for the orthotropic material under pure torsional moment is the main objective of this research. In the development of photoelastic experiment for orthotropic material under pure torsional moment, the important problems and their solutions are the same as following. In the model material for photoelastic experiment, it was found that C.F.E.C.(Copper Fiber Epoxy Composite) can be used as the model material of photoelastic experiment for orthotropic material. In the stress freezing cycle, it was assured that stress freezing cycle for epoxy can be used as the stress freezing cycle of the photoelastic experiment for orthotropic material. In the slicing method, it was found that the negative oblique slicing method can be effectively used as slicing method in 3-dimensional photoelastic experiment. In the measuring method of stress fringe values and physical properties in the high temperature, it was found that stress fringe values can be directly measured by experiment and physical properties can be directly or indirectly by equation between stress fringe values and physical properties developed by author. In the stress analysis method of orthotropic material under pure torsional moment by photoelastic experiment, it will be studied in the second paper.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.5
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• pp.301-306
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• 2017

Wire electrical discharge machining (WEDM) process was evaluated to slice Silicon (Si) for various applications. Specifically, various Si workpieces with various resistances, such as single and multi crystalline Si bricks and wafers were used. As conventional slicing processes, such as slurry-on or diamond-on wire slicing, are based on mechanical abrasions between Si and abrasive, there is a limitation to decrease the wafer thickness as well as kerf-loss. Especially, when the wafer thickness is less than $150{\mu}m$, wafer breakage increases dramatically during the slicing process. Single crystalline P-type Si bricks and wafers were successively sliced with considerable slicing speed regardless of its growth direction. Also, typical defects, such as microcracks, craters, microholes, and debris, were introduced when Si was sliced by electrical discharge. Also, it was found that defect type is also dependent on resistance of Si. Consequently, this study confirmed the feasibility of slicing single crystalline Si by WEDM.