• Title/Summary/Keyword: Sintering process

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Screen-printed carbonaceous matrrials for photocapacitor electrode (스크린 프린터에 의한 광캐패시터용 카본 전극 제작)

  • Choi, Woo-Jin;Kwak, Dong-Joo;Sung, Youl-Moon;Ha, Soon-Ho
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2009.10a
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    • pp.411-414
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    • 2009
  • Photo-capacitor electrodes are attracting great attention because of their high capacitance and potential applications in electronic devices. Carbon capacitor, active carbon capacitor and its combination will be fabricated using simple sandwich capacitor electrode method as carbonaceous material on each type of capacitor electrodes with 20 ${\times}$ 15 mm cell size. Carbon/active carbon cell was fabricated using sol-gel process with 120oC dry temperature in l hour and using sintering process with 500oC in 2 hour. The effect of sintering temperature on carbon properties was also investigated with X-ray diffraction technique to get the best sintering temperature. The detail of fabrication process will be explained. Elemental composition in electrode material can be measured using quantitative spectroscopic as and a cyclic voltammetric technique was used to study the combined effects of electrode material and effect of annealing temperature and also time on the capacitance of thermally treated in capacitor electrode. In this work, characterization impedance technique is used to measurement of capacitance and giving complementary results. Active carbon as carbonaceous material has a better capacitance in charge/discharge process with mean thickness $32{\mu}m$ and with particle size $1{\mu}m$ to $4.5{\mu}m$ in 20 ${\times}$ 15 mm sample size of capacitor electrode.

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Optimization of Process Condition for Fe Nano Powder Injection Molding

  • Oh, Joo Won;Lee, Won Sik;Park, Seong Jin
    • Journal of Powder Materials
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    • v.24 no.3
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    • pp.223-228
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    • 2017
  • Nanopowders provide better details for micro features and surface finish in powder injection molding processes. However, the small size of such powders induces processing challenges, such as low solid loading, high feedstock viscosity, difficulty in debinding, and distinctive sintering behavior. Therefore, the optimization of process conditions for nanopowder injection molding is essential, and it should be carefully performed. In this study, the powder injection molding process for Fe nanopowder has been optimized. The feedstock has been formulated using commercially available Fe nanopowder and a wax-based binder system. The optimal solid loading has been determined from the critical solid loading, measured by a torque rheometer. The homogeneously mixed feedstock is injected as a cylindrical green body, and solvent and thermal debinding conditions are determined by observing the weight change of the sample. The influence of the sintering temperature and holding time on the density has also been investigated. Thereafter, the Vickers hardness and grain size of the sintered samples have been measured to optimize the sintering conditions.

Characteristics of Pure Mg Powder Compacts Prepared by Spark Plasma Sintering Process (방전플라즈마 소결법으로 제작된 순 마그네슘 분말 소결체의 특성평가)

  • Hong, Ji-Min;Son, Hyeon-Taek;Chang, Se-Hun;Lee, Jae-Seoul;Cha, Yong-Hun;Oh, Ik-Hyun
    • Korean Journal of Materials Research
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    • v.17 no.6
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    • pp.331-336
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    • 2007
  • The pure Mg powder compacts were successfully fabricated using SPS process. The machined chip powder showed flake shaped morphology with coarse surfaces, while gas atomized powders were spherical in morphology with smooth surfaces. In this study, SPS process was used to consolidate the pure Mg powder because this process allows high density consolidation in a short time. The results showed that increased sintering temperature from $350^{\circ}C$ to $500^{\circ}C$ with pressure of 30MPa, the maximum values of the density was increased from 98.1% to 99.8% of theoretical density, respectively. However, density of the sintered chip powders was higher than that of gas-atomized powder due to larger contact areas between particles.

The Development of Aluminium Alloy Piston by Powder Forging Method (분말단조법에 의한 알루미늄 합금 피스톤 개발)

  • Kang, Dae-Yong;Park, Jong-Ok;Kim, Kil-Jun;Kim, Young-Ho;Cho, Jin-Rae;Lee, Jong-Heon
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.8
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    • pp.87-93
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    • 2000
  • Powder Forging technology is being developed rapidly because of its economic merits and the possibility of lightening parts by replacing steel parts with aluminum ones especially in automotive parts manufacturing. Recently Powder Forging process is widely used for manufacturing primary mechanical parts as a combined technology of P/M and precision hot forging. This paper describes the process conditions for the powder forging of Aluminium alloy piston. For example powder alloy design preform design by FEM simulation cold of compaction of specimens and preform sintering of preform powder forging process. The characteristics of sintered compaction of specimens and preform sintering of preform powder forging process. The characteristics of sintered products and final forged piston ones are investigated with tensile strength hardness ductility and so on. Eventually its results prove the improve mechanical properties of the piston produced by powder forging.

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Analysis of Ni/Cu Metallization to Investigate an Adhesive Front Contact for Crystalline-Silicon Solar Cells

  • Lee, Sang Hee;Rehman, Atteq ur;Shin, Eun Gu;Lee, Doo Won;Lee, Soo Hong
    • Journal of the Optical Society of Korea
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    • v.19 no.3
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    • pp.217-221
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    • 2015
  • Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

Mechanical Property Evaluation of WC-Co-B4C Hard Materials by a Spark Plasma Sintering Process (방전플라즈마 소결 공정을 이용한 WC-Co-B4C 소재의 기계적 특성평가)

  • Lee, Jeong-Han;Park, Hyun-Kuk
    • Korean Journal of Materials Research
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    • v.31 no.7
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    • pp.397-402
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    • 2021
  • In this study, binderless-WC, WC-6 wt%Co, WC-6wt% 1 and 2.5 B4C materials are fabricated by spark plasma sintering process (SPS process). Each fabricated WC material is almost completely dense, with a relative density up to 99.5 % after the simultaneous application of pressure of 60 MPa. The WC added Co and Co-B4C materials resulted in crystalline growth. The WC with HCP crystal structure has respective interfacial energy (basal facet direction: 1.07 ~ 1.34 J·m-2, prismatic direction: 1.43 ~ 3.02 J·m-2) that depends on the grain growth direction. It is confirmed that the continuous grain growth, biased by the basal facet, which has relatively low energy, is promoted at the WC/Co interface. As abnormal grain growth takes place, the grain size increases more than twice from 0.37 to 0.8 um. It is found through analysis that the hardness property also greatly decreases from about 2661.4 to 1721.4 kg/mm2, along with the grain growth.