• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1225-1230
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• 2004

In this paper, the pressure drops were investigated according to the sintered porous wick structure in loop heat pipe(LHP) by theoretical analysis. LHP has the wick only in evaporator for the circulation of working fluid, so utilizes porous wick structure which pore diameter is very small for large capillary force. This paper investigates the effects of different parameters on the pressure drops of the LHP such as particle diameter of sintered porous wick, wick porosity, vapor line diameter, thickness of wick and heating capacity. Working fluid is water and the material of sintered porous wick is copper. According to the these different parameters, capillary pressure, pressure drop in wick were analized by theoretical design method of LHP.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.12
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• pp.1107-1116
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• 2004

In this paper, the effects of diverse parameters on the operation of loop heat pipe (LHP), such as particle diameter of sintered porous wick, wick porosity, vapor line diameter, thickness of wick and heating capacity were investigated by a theoretical analysis. A LHP has a wick only in its evaporator for the circulation of working fluid, and utilizes a porous wick structure of which pore size is very small to obtain a large capillary force. The working fluid is water and the material of sintered porous wick is copper. For these different parameters, capillary pressure, pressure drop in wick, pressure drops and temperature distribution were analyzed by a theoretical design method of LHP.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2357-2362
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• 2008

LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1241-1246
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• 2004

The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.