• Title/Summary/Keyword: Single-phase Immersion Liquid

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A Study on Heating Characteristics of Li-ion Battery Applicated Single-phase Immersion Cooling Technology (단상계 침지냉각 기술이 적용된 Li-ion계 배터리 발열특성에 관한 연구)

  • Kim, Woonhak;Kang, Seokwon;Shin, Giseok
    • Journal of the Society of Disaster Information
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    • v.18 no.1
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    • pp.163-172
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    • 2022
  • Purpose: To secure efficient thermal management technology for Li-ion batteries, the applicability of the system applied with single-phase immersion technology was checked through an experiment. Method: Using JH3 pouch cells produced by LG-Chem, Korea, A 14S2P module was manufactured and immersed in a vegetable-based cooling fluid produced by Cargill, USA, and then charged and discharged at a rate of 0.3C to 1C to check the heat distribution. Result: It was possible to manage and there was no change in the molecular structure of the immersion solution. Conclusion: It was confirmed that the immersion cooling method can be applied to the thermal management of Li-ion batteries.

Heat Dissipation Trends in Semiconductors and Electronic Packaging (반도체 및 전자패키지의 방열기술 동향)

  • S.H. Moon;K.S. Choi;Y.S. Eom;H.G. Yun;J.H. Joo;G.M. Choi;J.H. Shin
    • Electronics and Telecommunications Trends
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    • v.38 no.6
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    • pp.41-51
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    • 2023
  • Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

Stability of the growth process at pulling large alkali halide single crystals

  • V.I. Goriletsky;S.K. Bondarenko;M.M. Smirnov;V.I. Sumin;K.V. Shakhova;V.S. Suzdal;V.A. Kuznetzov
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.13 no.1
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    • pp.5-14
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    • 2003
  • Principles of a novel pulse growing method are described. The method realized in the crystal growing on a seed from melts under raw melt feeding provided a more reliable control of the crystallization process when producing large alkali halide crystals. The slow natural convection of the melt in the crucible at a constant melt level is intensified by rotating the crucible, while the crystal rotation favors a more symmetrical distribution of thermal stresses over the crystal cross-section. Optimum rotation parameters for the crucible and crystal have been determined. The spatial position oi the solid/liquid phase interface relatively to the melt surface, heaters and the crucible elements are considered. Basing on that consideration, a novel criterion is stated, that is, the immersion extent of the crystallization front (CF) convex toward the melt. When the crystal grows at a <> CF immersion, the raised CF may tear off from the melt partially or completely due to its weight. This results in avoid formation in the crystal. Experimental data on the radial crystal growth speed are discussed. This speed defines the formation of a gas phase layer at the crystal surface. The layer thickness il a function of time a temperature at specific values of pressure in the furnace and the free melt surface dimensions in the gap between the crystal and crucible wall. Analytical expressions have been derived for the impurity component mass transfer at the steady-state growth stage describing two independent processes, the impurity mass transfer along the <> path and its transit along the <> one. The heater (and thus the melt) temperature variation is inherent in any control system. It has been shown that when random temperature changes occur causing its lowering at a rate exceeding $0.5^{\circ}C/min$, a kind of the CF decoration by foreign impurities or by gas bubbles takes place. Short-term temperature changes at one heater or both result in local (i.e., at the front) redistribution of the preset axial growth speed.