• Journal of the Korean Society of Safety
• /
• v.38 no.3
• /
• pp.43-50
• /
• 2023

Silicone tetrachloride (SiCl₄) leak accidents cause enormous human and environmental damage because it is highly toxic. Some handling facilities use water curtains to reduce the impact range of SiCl₄. Although the water curtain is known as one of the most efficient technologies for post-release mitigation, its effect on reducing SiCl₄ concentration needs to be investigated scientifically and quantitatively. In this study, three-dimensional computational fluid dynamics (CFD) was used to investigate the physical and chemical effects of water curtains as a release-mitigation system for SiCl₄. SiCl₄ is released and dispersed five seconds prior to the operation of the water curtain. Once the water curtain works, the SiCl₄ reacts chemically with the water and its concentration decreases rapidly; it reaches an emergency response planning guidelines level 2 (ERPG-2) of 5 parts per million (ppm) at about 570 m. We observed, however, that the physical effect of water curtains on reducing SiCl₄ concentration is insignificant when the chemical effect is eliminated. These results are crucial since they can be a scientific and quantitative basis for the 'technical guidelines for estimating the accident affected range'. In order to protect the public from chemical accidents, more toxic gas mitigation technologies need to be developed.

• Journal of the Korean Vacuum Society
• /
• v.12 no.4
• /
• pp.263-268
• /
• 2003

Precise thickness control and excellent properties of silicon nitride thin films are essential for the next-generation semiconductor and display devices. In this study, silicon nitride thin films were deposited by batch-type atomic layer deposition (ALD) method using $SiC1_4$ and $NH_3$ as the precursors at temperatures ranging from 500 to $600^{\circ}C$. Thin film deposition using a batch-type ALD reactor was a layer-by-layer atomic growth by self-limiting surface reactions, and the thickness of the deposited film can be controlled by the number of deposition cycles. The silicon nitride thin films deposited by ALD method exhibited composition, refractive index and wet etch rate similar with those of the thin films deposited by low-pressure chemical vapor deposition method at $760^{\circ}C$. The addition of pyridine mixed with precursors increased deposition rate by 50%, however, the films deposited with pyridine was readily oxidized owing to its unstable structure, which is unsuitable for the application to semiconductor or display devices.

• Korean Chemical Engineering Research
• /
• v.51 no.3
• /
• pp.407-410
• /
• 2013

The chlorination of a metallurgical-grade silicon was carried out in a fluidized bed reactor, 25 mm in diameter. The flow rate of the chlorine admitted into the reactor was 0.2 L/min and that of the carrier nitrogen was 0.8~1.0 L/min. The reactor temperature was maintained at $450^{\circ}C$ and the temperature of the coolant at the $SiCl_4$ condenser was at $-5^{\circ}C$. The $SiCl_4$ yield increased with increasing the mole fraction of chlorine in the feed gas, exhibiting 28% at the mole fraction of 0.2. Further increase of the chlorine mole fraction was not attempted in a worry that the reactor might be failed due to the high exothermicity of the reaction. The production of $SiCl_4$ from silicon by fluidized bed chlorination was demonstrated on a laboratory scale, which is a stepping stone for future studies under more severe conditions toward industrial application.

• Fire Science and Engineering
• /
• v.34 no.2
• /
• pp.49-53
• /
• 2020

This study aimed to identify the characteristics of 40 chemical accidents that occurred in Jeollabuk-do from 2004 to 2019. During this time, there were 2.5 accidents per year on average in the province; their types were classified as spill/leak, fire, explosion, adverse reaction, and complex. There were 34 leaks and six explosions, and they are categorized as follows: 12 by worker error, 16 from facility defects, and 12 by transport vehicle accidents. The substances involved in these accidents were ammonia (15%), sulfuric acid (12.5%), and silicon tetrachloride (7.5%). Notably, the rate of chemical accidents (75%) is the highest during spring and summer. In order to reduce chemical accidents, first, there should be compliance with the relevant laws. Second, the quality of safety education and training of workers should be improved. Finally, valuable government support is also necessary to improve facilities.