• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.363-366
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• 2003

In nanomachining processes, chemical effects are more dominant factor compared with physical deformation. For example, during the nanoscratch on a silicon surface in the atmosphere, micro protuberances are formed due to the mechanochemical reaction between the diamond tip and the surface. On the contrary, in case of chemically stable materials, such as ceramics or glasse, the surface protuberance are not formed. The purpose of this study is to understand effects of the mechanochemical reaction between tip and surfaces on deformation behaviors of hard-brittle materials. Nanometerscale elasoplastic deformation behavior of single crystal silicon (100) was characterized with the surface protuberance phenomena, and compared with that of borosilicate (Pyrex glass 7740).

• Journal of the Korean Society for Precision Engineering
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• v.28 no.5
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• pp.606-613
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• 2011

In this paper, patterns of laser scattering and detection of micro defects have been investigated based on Rayleigh criterion for silicon wafer in solar cell. Also, a new laser scattering mechanism is designed using characteristics of light scattering against silicon wafer surfaces. Its parameters are to be optimally selected to obtain effective and featured patterns of laser scattering. The optimal parametric ranges of laser scattering are determined using the mean intensity of laser scattering. Scattering patterns of micro defects are investigated at the extracted parameter region. Among a lot of pattern features, both maximum connected area and number of connected component in patterns of laser scattering are regarded as the important information for detecting micro defects. Their usefulness is verified in the experiment.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.5
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• pp.451-457
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• 2014

Surface roughness of mechanical components is an important factor which affects the tribological phenomena. Various surface patterns have been applied to surfaces to improve the tribological characteristics of mechanical components. In this work, the friction reduction effect of micropatterns on silicon was investigated. For this purpose, micro-dimple patterns were fabricated on silicon wafer by DRIE process. In the friction experiments silicone oil was used as lubricant. Also, the lubricant was cleaned to simulate a lubricant depleted condition. In depleted lubricated condition, friction coefficient of micro-pattern specimens was lower than specimens without micro-patterns. It was found that friction reduction effect of micro-pattern could be successfully maintained even after cleaning the lubricant on the surface.

• Journal of Integrative Natural Science
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• v.3 no.1
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• pp.33-37
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• 2010

The functionalized photonic crystals of porous silicon biosensor was prepared for the application as a label-free biosensor based on distributed Bragg reflector interferometer. Prepared distributed Bragg reflector of porous silicon biosensor displayed sharp reflection in the optical reflective spectra. The mean of construction of molecular architectures on distributed Bragg reflector of porous silicon surfaces was investigated for the step-by-step binding interaction with amines, biotin, avidin, and biotinylated protein A. The subsequent introduction of avidin, and biotinylated protein A resulted in the reflectivity shifted to longer wavelengths, indicative of a change in refractive indices induced by binding of biomolecules.

• Bulletin of the Korean Chemical Society
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• v.26 no.7
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• pp.1071-1074
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• 2005

A variable-low temperature scanning tunneling microscope (VT-STM), which operates from 77 to 350 K in ultrahigh vacuum, was built and used to study imaging and manipulation of benzene molecules on Si surfaces. Four types of benzene adsorption structures were first imaged on the Si(5 5 12)-2x1 surface. Desorption process of benzene molecules by tunneling electrons was studied on the Si(001)-2xn surface.

• Tribology and Lubricants
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• v.19 no.2
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• pp.109-115
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• 2003

Nanotribological characteristics between a Si$_3$N$_4$ AFM tip and hydrophobic thin films were experimentally studied. Tests were performed to measure the nano adhesion and friction in both AFM (atomic force microscope) and LFM (lateral force microscope) modes in various .ranges of normal load. Plasma-modified thin polymeric films were deposited on Si-wafer (100). Results showed that wetting angle of plasma-modified thin polymeric film increased with the treating time, which resulted in the hydrophobic surface and the decrease of adhesion and friction. Nanotribological characteristics of these surfaces were compared with those of other hydrophobic surfaces, such as DLC, OTS and IBAD-Ag coated surfaces. Those of OTS coated surface were superior to those of others, though wetting angle of plasma-modified thin polymeric film is higher.

• The Journal of Korea Robotics Society
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• v.17 no.3
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• pp.282-287
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• 2022

High shear adhesion on wet and rough surfaces and tactile feedback of gripping forces are highly important for realizing robotic gripper systems. Here, we propose a bioinspired robotic gripper with highly shear adhesion and sensitive pressure sensor for tactile feedback systems. To achieve them, we fabricated multi-walled carbon nanotube sensing layer on a thin polymeric adhesive layer of polydimethylsiloxane. With densely hexagonal-packed microstructures, the pressure sensor achieved 9 times the sensing property of a sensor without microstructures. We then assembled hexagonal microstructures inspired by the toe pads of a tree frog, giving strong shear adhesion under both dry and wet surfaces such as silicon (42 kPa for dry and ~30 kPa for underwater conditions) without chemical-residues after detachment. Our robotic gripper can prevent damage to weak or smooth surfaces that can be damaged at low pressure through pressure signal feedback suggesting a variety of robotic applications.

• Korean Journal of Materials Research
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• v.16 no.2
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• pp.80-84
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• 2006

The removal efficiency of Cu and Fe contaminants on the silicon wafer surface was examined to investigate the effect of cleaning solutions on the behavior of metallic impurities. Silicon wafers were intentionally contaminated with Cu and Fe solutions by spin coating and cleaned in different types of cleaning solutions based on $NH_4OH/H_2O_2/H_2O\;(SC1),\;H_2O_2/HCl/H_2O$ (SC2), and/or HCl/$H_2O$ (m-SC2) mixtures. The concentration of metallic contaminants on the silicon wafer surface before and after cleaning was analyzed by vapor phase decomposition/inductively coupled plasma-mass spectrometry (VPD/ICP-MS). Cu ions were effectively removed both in alkali (SC1) and in acid (SC2) based solutions. When $H_2O_2$ was not added to SC2 solution like m-SC2, the removal efficiency of Cu impurities was decreased drastically. The efficiency of Cu ions in SC1 was not changed by increasing cleaning temperature. Fe ions were soluble only in acid solution like SC2 or m-SC2 solution. The removal efficiencies of Fe ions in acid solutions were enhanced by increasing cleaning temperature. It is found that the behavior of metallic contaminants as Cu and Fe from silicon surfaces in cleaning solutions could be explained in terms of Pourbaix diagram.

• Korean Journal of Metals and Materials
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• v.49 no.9
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• pp.726-731
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• 2011

The present work shows how the flexural displacement-induced fracture strength of silicon devices, whose back surfaces have wafer grinding-induced scratch marks, depends on the crystallographic orientation. Experimental results indicate that silicon devices with scratch marks parallel to their lateral direction (i.e. reference axis in this work) are very susceptible to flexural fracture, as compared to devices with marks which deviated from the direction. The 3-point bending test shows that the fracture strength of silicon devices having marks which are oriented away from the reference axis is 2.6 times higher than that of devices with marks parallel to the axis. It was particularly interesting to see that silicon devices with identical preferred marks even reveal different fracture strengths, depending on whether the marks are involved in specific crystal planes such as {111} or {011}, called cleavage planes. This work demonstrates that silicon devices with the reference axis-aligned scratch marks not existing on such cleavage planes can have higher fracture strength approximately 20% higher than those existing on the planes.

• Tribology and Lubricants
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• v.11 no.4
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• pp.21-27
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• 1995

The effects of interface boundary strength on wear and wear transition during sliding have been investigated in silicon carbide ceramics. Three different microstructures, i.e., solid state sintered silicon carbide, liquid phase sintered silicon carbide and liquid phase sintered silicon carbide composite reinforced with TiB$_{2}$ particulates, were designed by hot pressing. Examinations of crack patterns and fracture modes indicated that interface boundaries were relatively strong between silicon carbide grains in the solid state sintered silicon carbide, intermediate in the liquid phase sintered silicon carbide and weak between silicon carbide grains and TiB$_{2}$ particles in the composite. Wear data and examinations of worn surfaces revealed that the wear behavior of these silicon carbide ceramics could be significantly affected by the interface strength. In the solid state sintered silicon carbide, the wear occurred by a grooving process. In the liquid phase sintered silicon carbide and composite, on the other hand, an abrupt transition in wear mechanism from initial grooving to grain pull-out process occurred during the test. The transition occurred significantly earlier in the composite than in the carbide.