• Journal of the Korean Ceramic Society
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• v.24 no.6
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• pp.561-571
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• 1987

In case of glass ceramics and powder preparation from the metalakoxide solutions, metalakoxide solutions with a various species of alkoxy groups have unique characteristics. Therefore, in this study, the mixing ability of homogeneous sol, gel morphology and physical properties of gels were investigated by the changes in terms of the different four alkoxy groups, CH3-, C2H5-, i-C3H7-n-C4H9-, along with the catalyst for the purpose of the observation about the homogenous transition range from sol to gel. As a result, when the fixed condition was mol ratio of H2O/Si(OR)4=2.0 and variables were batch composition and addition amount of catalyst, the characteristics of Tetra-normal-Butoxysilane and Tetra-iso-propoxysilane systems had very narrow sol-gel conversion region than Tetramethoxysilane and Tetraethoxysilane system. And silicon-alkoxide, systems having narrow sol-gel conversion region were enlarged by addition of catalyst. In viewpoint of the weight loss of gel produced by hydrolysis of silicon alkoxide systems with different four alkoxy groups, the amounts of weight loss of gel containing large molecular alkoxy groups were much more than those of small molecular alkoxy group.

• Journal of the Korean Ceramic Society
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• v.45 no.2
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• pp.99-104
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• 2008

Zeta potential, sedimentation bulk density and rheology in the dispersion system have been studied in terms of solid loading (40-55 vol%), and types of additives. Ammonium polymethacrylate, glycerol, ethoxylated acetylenic diol, and polyvinyl alcohol have been used as the dispersant, cryo-protectant, surfactant, and binder, respectively. Sedimentation density greatly increased upon adding dispersant; the effect was more pronounced with ionic alumina suspension compared with covalent silicon carbide. With further addition of cryo-protectant and surfactant to dispersant, the sedimentation density increased somewhat. The suspension viscosity generally behaviored in an opposite manner to the sedimentation density, i.e., high sedimentation gave low high-shear viscosity, indicative of low order structure formation in the suspended particles. Shear rate rheology in shear rate of $2-300\;sec^{-1}$ showed a shear thinning and its onset began at similar shear rate (${\sim}100\;sce^{-1}$), regardless of solid loading.

• Ceramist
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• v.22 no.4
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• pp.452-463
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• 2019

A quartz glass crucible is the essential material for manufacturing silicon ingots such as semiconductors and solar cells. Quartz glass crucibles for semiconductors and solar cells are made similar, but differ in surface purity, structure and durability. Recently, ultra high purity synthetic glass crucibles for semiconductors have become more important due to foreign problems. In Korea, it has succeeded in producing 28-inch quartz glass crucibles through the past 10 years. However, 32-inch synthetic quartz glass for the production of silicon ingots for semiconductors is not up to the level of advanced technology, and the technology gap is expected to be 2 to 3 years. In order to overcome these technological gaps and localize synthetic quartz glass ware, close cooperation between production companies and demand companies and localization of synthetic quartz glass powder must also be made. In addition, if government support can be added, faster results can be expected.

• Journal of the Korea Concrete Institute
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• v.22 no.3
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• pp.287-295
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• 2010

In this study, ordinary Portland cement was used and the air void was minimized by using minute quartz as the filler. In addition, steel fibers were used to mitigate the brittle failure problem associated with high strength concrete. This study is in progress to make an Ultra-high strength powdered concrete (UHSPC) which has compressive strength over 300 MPa. To increase the strength of concrete, we have compared and analyzed the compressive strengths of the concretes with different mix proportions and curing conditions by selecting quartz sand, dolomite, bauxite, ferro silicon which have diameters less than 0.6 mm and can increase the bond strength of the transition zone. Ultra-high strength powdered concrete, which is different from conventional concrete, is highly influenced by the materials in the mix. In the study, the highest compressive strength of the powdered concrete was obtained when it is prepared with ferro silicon, followed in order by Bauxite, Dolomite, and Quartz sand. The amount of ferro silicon, when the highest strength was obtained, was 110%, of the weight of the cement. SEM analysis of the UHSPC showed that significant formation of C-S-H and Tobermorite due to high temperature and pressure curing. Production of Ultrahigh strength powdered concrete which has 28-day compressive strength upto 341MPa has been successfully achieved by the following factors; steel fiber reinforcement, fine particled aggregates, and the filling powder to minimize the void space, and the reactive materials.

• Clean Technology
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• v.22 no.4
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• pp.274-280
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• 2016

In this study, it was to develop a chemical method that can recycle the cutting oil which accounts for about 25% of the cost of the process among containing materials of silicon waste sludge generated in the process for producing a solar cell wafer. The 7 types of reagents have been used, including acetone, HCl, NaOH, KOH, $Na_2CO_3$, HF, $CH_2Cl_2$, etc. for this experiment. And It was carried out at a speed of 3000 rpm for 60 minutes centrifugation after performing a reaction with a waste sludge at various concentrations. As a result, the best reagents and conditions for separating the solid such as a silicon powder and a metal powder and liquid cutting oil were identified as 0.3 N NaOH. It is found to be pH 6.05 in a post-processing recycled cutting oil with 0.3 N NaOH after reaction of waste sludge and 0.1 N HCl which is effective to remove metal powder in order to adjust the pH to suit the properties of the weak acid is a commercially available cutting oil and it showed excellent turbidity than when applied to sludge with 0.3 N NaOH alone. The results of FT-IR analysis which can compare the properties of the commercially available cutting oil shows it has a possibility of recycling oil. The cutting oil recovery rate obtained through the experiment was found to be 86.9%.

• Journal of Powder Materials
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• v.16 no.6
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• pp.416-423
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• 2009

Diamond/SiC composites are appropriate candidate materials for heat conduction as well as high temperature abrasive materials because they do not form liquid phase at high temperature. Diamond/SiC composite consists of diamond particles embedded in a SiC binding matrix. SiC is a hard material with strong covalent bonds having similar structure and thermal expansion with diamond. Interfacial reaction plays an important role in diamond/SiC composites. Diamond/SiC composites were fabricated by high temperature and high pressure (HPHT) sintering with different diamond content, single diamond particle size and bi-modal diamond particle size, and also the effects of composition of diamond and silicon on microstructure, mechanical properties and thermal properties of diamond/SiC composite were investigated. The critical factors influencing the dynamics of reaction between diamond and silicon, such as graphitization process and phase composition, were characterized. Key factor to enhance mechanical and thermal properties of diamond/SiC composites is to keep strong interfacial bonding at diamond/SiC composites and homogeneous dispersion of diamond particles in SiC matrix.

• Journal of Ocean Engineering and Technology
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• v.29 no.1
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• pp.94-99
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• 2015

Lead zirconate titanate (PZT) thick films with thicknesses of ㎛ were fabricated on silicon substrates using an aerosol deposition method. A PZT powder solution was prepared using a sol-gel process. The average diameters (d50) obtained were 1.67, 1.98, and 2.40μm when the pyrolysis temperatures were 300℃, 350℃, and 450℃ respectively. The as-deposited film had a uniform microstructure without any cracks or pores. The as-deposited films on silicon were annealed at a temperature of 700℃. The 20-㎛-thick PZT film showed good adherence between the PZT film and substrate, with no tearing observed in the conventional solid phase process. This was probably because the presence of pores produced from organic residue during annealing relieved the residual stresses in the deposited film.

• Journal of Powder Materials
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• v.15 no.1
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• pp.58-62
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• 2008

Reaction bonded silicon carbide (RBSiC) is an important engineering ceramic because of its high strength and stability at elevated temperatures, and it is currently fabricated using reasonably cheap manufacturing processes, some of which have been used since the 1960s. However, forming complicated shapes from these materials is difficult because of their poor workability. The purpose of this work is to join the reaction-bonded SiC parts using a preceramic polymer as joint material. The manufacturing of ceramic material in the system Si-O-C from preceramic silicon containing polymers such as polysiloxanes has attained particular interest. The mixtures of preceramic polymer and filler materials, such as SiC, Si and MoSi, were used as a paste for the joining of reaction sintered SiC parts. The joining process during the annealing in Ar atmosphere at $1450^{\circ}C$ were described. The maximum strength of the joints was 63 MPa for the specimen joined with 10 vol.% of $MoSi_2$ and 30 vol.% of SiC as filler materials. Fracture occurred in the joining layer. This indicates that the joining strength is limited by the strength of the joint materials.

• ETRI Journal
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• v.34 no.5
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.101.3-101.3
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• 2010

Glass frit은 실리콘 태양전지의 Ag/Si contact을 위해 필수적이다. 태양전지의 고효율 특성 구현 때문에, Contact resistance(Rc)가 우수한 Pb-frit의 사용이 불가피한 상황이다. 본 연구는 기존의 Pb계를 무연화함과 동시에 동등수준의 효율을 목표로 하였다. Ag 분말 size 및 glass frit의 열적 거동 특성이 SiNx 코팅층 침투와 Ag re-crystallites에 미치는 영향에 대해 평가하였다. 6 inch 다결정 실리콘 웨이퍼를 사용하였으며, softening temperture(Sp)별로 4종의 Bi계 glass frit을 제조 하였고, 분말 size가 다른 3종의 Ag powder를 선정하였다. Glass frit Sp가 $460^{\circ}C$ 이상의 경우에는 효율이 10% 미만이였으나 Sp $460^{\circ}C$ 이하에서는 16% 수준의 효율을 확인할 수 있었다.