• Title/Summary/Keyword: Silicon nitride-boron nitride-silicon carbide

Search Result 7, Processing Time 0.026 seconds

Effect of Silicon Nitride Whisker Content on the Flexural Strength of Silicon Nitride-Boron Nitride-Silicon Carbide Multi-Layer Composites

  • Park, Dong-Soo;Cho, Byung-Wook
    • Journal of the Korean Ceramic Society
    • /
    • v.40 no.9
    • /
    • pp.832-836
    • /
    • 2003
  • Multi-layer ceramic composites were prepared by tape casting followed by hot pressing using silicon nitride layer with silicon nitride whiskers, silicon nitride layer with silicon carbide particles and boron nitride-alumina layer. The whiskers were aligned during the casting. As the whisker content of the silicon nitride layer was increased up to 10 wt%, the flexural strength of the multi-layer composite was increased. However, further increase of the whisker content in the layer resulted in a rapid decrease of the strength of the composite. The results suggest that the strength of multi-layer ceramic composite showing non-catastrophic failure behavior can be significantly improved by incorporating the aligned whiskers in the layers.

Fracture Behavior of Silicon Nitride-silicon Carbide-boron Nitride Multi-layer Composites with Different Layer Thickness

  • Cho, Byoung-Uk;Park, Dong-Soo;Park, Hong-Chae
    • Journal of the Korean Ceramic Society
    • /
    • v.39 no.7
    • /
    • pp.622-627
    • /
    • 2002
  • Multi-layer composites consisting of silicon nitride, silicon nitride-silicon carbide and boron nitride-alumina layers were prepared fly stacking the corresponding ceramic tapes. The composites demonstrated self-diagnostic capability and non-catastrophic failure behavior. The composites consisting of many thin layers exhibited high strength and stepwise increase of the electrical resistance during the flexure test. The strength of the composite with too thick silicon nitride layers was low and the electrical resistance was abruptly increased to the detection limit of the digital multi-meter during the test. An extensive crack branching was observed in the weak (BN + Al$_2$O$_3$)layer.

Removal of Cd(II) from water using carbon, boron nitride and silicon carbide nanotubes

  • Azamat, Jafar;Hazizadeh, Behzad
    • Membrane and Water Treatment
    • /
    • v.9 no.1
    • /
    • pp.63-68
    • /
    • 2018
  • Molecular dynamics simulations were used to study the removal of Cd(II) as a heavy metal from wastewater using armchair carbon nanotube, boron nitride nanotube and silicon carbide nanotubes under applied electric field. The system contains an aqueous solution of $CdCl_2$ as a heavy metal and a (7,7) nanotube as a nanostructured membrane, embedded in a silicon nitride membrane. An external electric field was applied to the considered system for the removal of $Cd^{2+}$ through nanotubes. The simulation results show that in the same conditions, considered armchair nanotubes were capable to remove $Cd^{2+}$ from wastewater with different ratios. Our results reveal that the removal of heavy metals ions through armchair carbon, boron nitride and silicon carbide nanotubes was attributed to the applied electric field. The selective removal phenomenon is explained with the calculation of potential of mean force. Therefore, the investigated systems can be recommended as a model for the water treatment.

Thermal Conductivity of Thermally Conductive Ceramic Composites and Silicon Carbide/Epoxy Composites through Wetting Process (세라믹 방열 복합체의 열전도도 분석 및 Wetting Process를 이용한 SiC/에폭시 복합체)

  • Hwang, Yongseon;Kim, Jooheon;Cho, WonChul
    • Polymer(Korea)
    • /
    • v.38 no.6
    • /
    • pp.782-786
    • /
    • 2014
  • Various kinds of thermal conductive ceramic/polymer composites (aluminum nitride, aluminum oxide, boron nitride, and silicon carbide/epoxy) were prepared by a casting method and their optical images were observed by FE-SEM. Among these, SiC/epoxy composite shows inhomogeneous dispersion features of SiC and air voids in the epoxy matrix layer, resulting in undesirable thermal conductive properties. To enhance the thermal conductivities of SiC/epoxy composites, the epoxy wetting method which can directly infiltrate the epoxy droplet onto filtrated SiC cake was employed to fabricate the homogeneously dispersed SiC/epoxy composite for ideal thermal conductive behavior, with maximum thermal conductivity of 3.85W/mK at 70 wt% of SiC filler contents.

Production of Fine ZnO Powders by Carbothermal Reduction

  • Choi, Heon-Jin;Lee, June-Gunn;Jung, Kwang-Taik;Kim, Ki-Hwan
    • The Korean Journal of Ceramics
    • /
    • v.4 no.4
    • /
    • pp.304-310
    • /
    • 1998
  • Carbothermal reduction has been one of the important processes for the production of ceramic raw materials such as silicon carbide, silicon nitride, boron carbide, etc. The process has also been one of several trials for the recovery of ZnO from ZnO-containing waste. It usually involves two consecutive steps: the evolution of Zn vapor and its oxidation with air. In this study a ZnO-containing raw material is reduced by carbon at $1250^{\circ}C$ and the evolved Zn vapor is oxidized with air, resulting in fine powders of ZnO. computer programs, THERMO and PYROSIM developed by MINTEK, are used to simulate the process thermodynamically and the results are compared with the experimental results. It is shown that the ZnO-containing raw material can be reduced and can form fine ZnO with the yield as high as 98.7% under a proper condition. Based on these results, a process is engineered for the production of ZnO in a rotary kiln at a rate of 3 tons/day. The produced ZnO powders show properties suitable to the usual applications in ceramic industries with a purity of > 95wt% and an average particle size of ∼3${\mu}m$.

  • PDF

Hot Pressing and Spark Plasma Sintering of AlN-SiC-TiB2 Systems using Boron and Carbon Additives (보론과 카본 조제를 사용한 AlN-SiC-TiB2계의 고온가압 및 Spark Plasma Sintering)

  • Lee, Sea-Hoon;Kim, Hai-Doo
    • Journal of the Korean Ceramic Society
    • /
    • v.46 no.5
    • /
    • pp.467-471
    • /
    • 2009
  • Effects of boron and carbon on the densification and thermal decomposition of an AlN-SiC-$TiB_2$ system were investigated. $SiO_2$ was mostly removed by the addition of carbon, while $Al_2O_3$ formed $Al_4O_4C$ and promoted the densification of the systems above $1850^{\circ}C$. Rather porous specimens were obtained without the additives after hot pressing at $2100^{\circ}C$, while densification was mostly completed at $2000^{\circ}C$ by using the additives. The sintering temperature decreased further to $1950^{\circ}C$ by applying spark plasma sintering. The additives promoted the shrinkage of AlN by forming a liquid phase which was originated from the carbo- and boro-thermal reduction of $Al_2O_3$ and AlN.

Comparative Analysis of Heat Sink and Adhesion Properties of Thermal Conductive Particles for Sheet Adhesive (열전도성 입자를 활용한 시트용 점착제의 점착 특성과 방열특성 연구)

  • Kim, Yeong Su;Park, Sang Ha;Choi, Jeong Woo;Kong, Lee Seong;Yun, Gwan Han;Min, Byung Gil;Lee, Seung Han
    • Textile Coloration and Finishing
    • /
    • v.28 no.1
    • /
    • pp.48-56
    • /
    • 2016
  • Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AlN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at $80^{\circ}C$ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA(Netzsch/LFA 447 Nano Flash) and adhesion strength by UTM(Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%.