• 제목/요약/키워드: Silicon mold

검색결과 116건 처리시간 0.023초

A Study on Resin Flow to Make a Replica Using a Silicone Mold

  • Bae, Kum-Soo;Rhee, Sang-Yong;Kim, Young-Baek
    • International Journal of Fuzzy Logic and Intelligent Systems
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    • 제8권2호
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    • pp.94-99
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    • 2008
  • The replica of silicone mold which can produce the test samples and the market-displayable products without making expensive metallic patterns is advantageous because it incurs less cost than the ordinary method that manufactures the products from the metallic patterns. However, the production of the products using silicone mold should require a technician with professional knowledge about the metallic patterns every time. Thus we tried to judge whether a forming analysis software for iron molding can be applied to silicon molding in this paper. In other words, this paper suggests a method to use a computer simulator from the designing step of the silicone mold, which is the most important part in making replica using simple silicone molds to the step of pouring the cast. The paper shows that if the know-how of a professional worker is provided in advance, an amateur worker can easily produce silicone molds of the best quality, the defective rate of the products will be decreased, and the replica will have a more complete status. By doing so, we suggested a possibility for reducing the delivery time at the production sites and for improving the product quality.

A study on the fabrication of poly crystalline Si wafer by vacuum casting method and the measurement of the efficiency of solar cell

  • Lee, Geun-Hee;Lee, Zin-Hyoung
    • 한국결정성장학회지
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    • 제12권3호
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    • pp.120-125
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    • 2002
  • Si-wafers for solar cells were cast in a size of $50{\times}46{\times}0.5{\textrm}{mm}^3$ by vacuum casting method. The graphite mold coated by BN powder, which was to prevent the reaction of carbon with the molten silicon, was used. Without coating, the wetting and reaction of Si melt to graphite mold was very severe. In the case of BN coating, SiC was formed in the shape of tiny islands at the surface of Si wafer by the reaction between Si-melt and carbon of the graphite mold on the high temperature. The grain size was about 1 mm. The efficiency of Si solar cell was lower than that of Si solar cell fabricated on commercial single and poly crystalline Si wafer. The reason of low efficiency was discussed.

Permanent Mold Casting of Copper-Base Alloys for Plumbing Applications

  • Sahoo, M.;Sadayappan, M.;Fasoyinu, F.A.
    • 한국주조공학회지
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    • 제20권1호
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    • pp.3-12
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    • 2000
  • The lead content of drinking water has been restricted to less than 15 ppb by Environmental Protection Agency (EPA) in USA. This has led to extensive research and development work at the Materials Technology Laboratory (MTL) of CANMET, a Canadian Government research laboratory, on the development of low-lead and lead-free copper alloys for plumbing applications. Attentionhas also been focused on the environmentally friendly and energy efficient permanent mold casting process to minimize the disposal of foundry sand contaminated by lead due to the use of leaded alloys in the non-ferrous foundries. A new series of alloys called SeBiLOY contaning Bi and Se been introduced to replace lead in the leaded alloys. This paper addresses some important casting characteristics such as fluidity, hot tear resistance, mechanical properties and microstructure of lead-free alloys such as SeBiLOY III and low-lead alloys such as silicon brass, silicon bronze and yellow brass in gravity permanent mold casting.

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AFM기반 기계적 TNL 패터닝을 통한 PDMS 몰드제작 (Fabrication of PDMS Mold by AFM Based Mechanical TNL Patterning)

  • 정윤준;박정우
    • 한국생산제조학회지
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    • 제22권5호
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    • pp.831-836
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    • 2013
  • This study demonstrates the process of fabricating patterns using tribonanolithography (TNL),with laboratory-made micro polycrystalline diamond (PCD) tools that are attached to an atomic force microscope (AFM). The various patterns are easily fabricated using mechanical scratching, under various normal loads, using the PCD tool on single crystal silicon, which is the master mold for replication in this study. Then, polydimethylsiloxane (PDMS) replica molds are fabricated using precise pattern transfer processes. The transferred patterns show high dimensional accuracy as compared with those of TNL-processed silicon micro molds. TNL can reduce the need for high cost and complicated apparatuses required for conventional lithography methods. TNL shows great potential in that it allows for the rapid fabrication of duplicated patterns through simple mechanical micromachining on brittle sample surfaces.

슬립 캐스팅을 이용한 통기성 세라믹형의 쾌속 제작 (Rapid Tooling of Porous Ceramic Mold Using Slip Casting)

  • 정성일;정두수;임용관;정해도;조규갑
    • 한국정밀공학회지
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    • 제16권5호통권98호
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    • pp.98-103
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    • 1999
  • The application field of porous mold is more and more expended. A mixture of alumina and cast iron is used for making porous mold using slip and vacuum casting method in this study. Slip casting is a process that slurry is poured into silicon rubber mold, dried in vacuum oven, debinded and sintered in furnace, In this procedure, slurry is composed of powder, binder, dispersion agent, and water. Vacuum casting is a technique for removing air bubbles existed in the slurry under vacuum condition. Since ceramics has a tendency of over-shrinkage after sintering, cast iron is used to compensate dimensional change. The results shows that sintering temperature has a great effect on characteristics of alumina-cast iron composite sintered parts. Finally ceramic-metal composite sintered mold can be used for aluminum alloy casting of shoe mold using this process.

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Effect on the Residual Stress of Cure Profiles, Fillers and Mold Constraints in an Epoxy System

  • Moon, Chang-Kwon;Nam, Ki-Woo
    • 한국해양공학회지
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    • 제23권4호
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    • pp.1-5
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    • 2009
  • A dilatometer was used to investigate the effect of cure conditions, mold types and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with the number of cyclic cures. Post cured samples outside the mold led to less shrinkage compared with samples in the mold. Sample cured in a silicon mold represented less shrinkage than sample cured in an aluminum mold. Sample containing kaolin filler showed less shrinkage than unfilled sample.

주조용 B390 알루미늄합금의 조직과 기계적 성질에 대한 각종 주조법의 영향 (Effect of Casting Processes on the Microstructures and Mechanical Properties of B390 Aluminium Alloy)

  • 한요섭;이호인;김성수;김정식
    • 한국주조공학회지
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    • 제13권3호
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    • pp.259-267
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    • 1993
  • The effects of casting processes-direct and indirect squeeze casting, permanent mold casting and die casting on the microstructure and mechanical properties were studied for the hypereutectic B390 aluminium alloy. The effects of T5 and T6 heat treatment were also examined. The direct and indirect squeeze casting showed no casting defects such as porosity and shrinkage were observed in permanent mold castings and die castings. The primary silicon phase was refined and homogeneously distributed in the order of indirect squeeze casting, diecasting, direct squeeze casting and permanent mold casting. Depletion of primary silicon phase in die casting surface was disappeared in indirect squeeze casting. Tensile strength of cast and heat treated specimens were increased in the order of direct squeeze casting, permanent mold casting, indirect squeeze casting and die casting. Hardness of indirect squeeze castings was larger than that of other castings. As indirect squeeze casting of B390 aluminium alloy, the time of T6 heat treatment to achieve high strength can be reduced.

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나노임프린트 리소그래피 적용을 위한 CHF3 플라즈마를 이용한 실리콘 몰드 표면 처리 특성 (A Study of the Silicon Mold Surface Treatment Using CHF3 Plasma for Nano Imprint Lithography)

  • 김용근;김재현;유반석;장지수;권광호
    • 한국전기전자재료학회논문지
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    • 제24권10호
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    • pp.790-793
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    • 2011
  • In this study, the surface modification for a silicon(Si) mold using $CHF_3$ inductively coupled plasma(ICP). The conditions under that plasma was treated a input ICP power 600 W, an operating gas pressure of 10 mTorr and plasma exposure time of 30 sec. The Si mold surface became hydrophobic after plasma treatment in order to $CF_x$(X= 1,2,3) polymer. However, as the de-molding process repeated, it was investigated that the contact angle of Si surface was decreased. So, we attempted to investigate the degradation mechanism of the accurate pattern transfer with increasing the count of the de-molding process using scanning electron microscope (SEM), contact angle, and x-ray photoelectron spectroscopy (XPS) analysis of Si mold surface.

실리콘 카바이드의 초정밀 연삭 가공에 관한 연구 (Research on Ultra-precision Grinding Work of Silicon Carbide)

  • 박순섭;원종호
    • 한국정밀공학회지
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    • 제26권9호
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    • pp.58-63
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    • 2009
  • Silicon carbide (SiC) has been used for many engineering applications because of their high strength at high temperatures and high resistances to chemical degradation. SiC is very useful especially for a glass lens mold whose components demanded to the machining with good surface finish and low surface damage. The performance and reliability of optical components are strongly influenced by the surface damage of SiC during grinding process. Therefore, the severe process condition optimization shall be necessary for the highly qualified SiC glass lens mold. Usually the major form of damage in grinding of SiC is a crack occurs at surface and subsurface. The energy introduced in the layers close to the surface leads to the formation of these cracks. The experimental studies have been carried out to get optimum conditions for grinding of silicon carbide. To get the required qualified surface finish in grinding of SiC, the selection of type of the wheel is also important. Grinding processes of sintered SiC work-pieces is carried out with varying wheel type, depth of cut and feed using diamond wheel. The machining result of the surface roughness and the number of flaws, have been analyzed by use of surface profilers and SEM.

Effects of SPS Mold on the Properties of Sintered and Simulated SiC-ZrB2 Composites

  • Lee, Jung-Hoon;Kim, In-Yong;Kang, Myeong-Kyun;Jeon, Jun-Soo;Lee, Seung-Hoon;Jeon, An-Gyun;Shin, Yong-Deok
    • Journal of Electrical Engineering and Technology
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    • 제8권6호
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    • pp.1474-1480
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    • 2013
  • Silicon carbide (SiC)-zirconium diboride ($ZrB_2$) composites were prepared by subjecting a 60:40 vol% mixture of ${\beta}$-SiC powder and $ZrB_2$ matrix to spark plasma sintering (SPS) in 15 $mm{\Phi}$ and 20 $mm{\Phi}$ molds. The 15 $mm{\Phi}$ and 20 $mm{\Phi}$ compacts were sintered for 60 sec at $1500^{\circ}C$ under a uniaxial pressure of 50 MPa and argon atmosphere. Similar composites were simulated using $Flux^{(R)}$ 3D computer simulation software. The current and power densities of the specimen sections of the simulated SiC-$ZrB_2$ composites were higher than those of the mold sections of the 15 $mm{\Phi}$ and 20 $mm{\Phi}$ mold simulated specimens. Toward the centers of the specimen sections, the current densities in the simulated SiC-$ZrB_2$ composites increased. The power density patterns of the specimen sections of the simulated SiC-$ZrB_2$ composites were nearly identical to their current density patterns. The current densities of the 15 $mm{\Phi}$ mold of the simulated SiC-$ZrB_2$ composites were higher than those of the 20 $mm{\Phi}$ mold in the center of the specimen section. The volume electrical resistivity of the simulated SiC-$ZrB_2$ composite was about 7.72 times lower than those of the graphite mold and the punch section. The power density, 1.4604 $GW/m^3$, of the 15 $mm{\Phi}$ mold of the simulated SiC-$ZrB_2$ composite was higher than that of the 20 $mm{\Phi}$ mold, 1.3832 $GW/m^3$. The $ZrB_2$ distributions in the 20 $mm{\Phi}$ mold in the sintered SiC-$ZrB_2$ composites were more uniform than those of the 15 $mm{\Phi}$ mold on the basis of energy-dispersive spectroscopy (EDS) mapping. The volume electrical resistivity of the 20 $mm{\Phi}$ mold of the sintered SiC-$ZrB_2$ composite, $6.17{\times}10^{-4}{\Omega}cm$, was lower than that of the 15 $mm{\Phi}$ mold, $9.37{\times}10^{-4}{\Omega}{\cdot}cm$, at room temperature.