• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.5
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• pp.399-402
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• 2007

The effects of heat treatment on the electrical properties of strained-Si/SiGe-on-insulator (SGOI) devices were examined. We proposed the optimized heat treatment processes for improving the back interfacial electrical properties in SGOI-MOSFET. By applying the additional pre-RTA (rapid thermal annealing) before gate oxidation step and the post-RTA after source/drain dopant activation step, the electrical properties of strained-Si channel on $Si_{1-x}Ge_x$ layer were greatly improved, which resulting the improvement of the driving current, transconductance, and leakage current of SGOI-MOSFET.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.237.2-237.2
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• 2014

이번 연구는 system-on-panel에 적용하기 위한 비휘발성 메모리의 전하보유시간 및 메모리 윈도우 특성 향상에 관한 연구이다. 이를 위해 SiO2/SiOX/SiOXNY의 메모리 구조를 이용하였으며, 채널층으로 결정화 온도에 따른 수소화된 미세결정 실리콘-게르마늄을 이용하였다. 채널 층으로 사용된 수소화된 미세결정 실리콘-게르마늄은 비정질 실리콘-게르마늄보다 더 낮은 bandgap과 더 적은 defect density로 인하여 더 향상된 전하보유시간 및 메모리 윈도우를 얻을 수 있었다. 결정화가 거의 이루어지지 않은 실리콘-게르마늄 비휘발성 메모리의 경우 약 4.9V의 메모리 윈도우를 얻을 수 있었다. 반면 300oC에서 약 43.4%의 결정화가 이루어진 실리콘-게르마늄의 메모리 윈도우는 약 5.9V로 약 17%의 향상이 있으며, 10년 후 74.5%의 높은 전하보유시간을 가졌다.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1028-1031
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• 2009

High quality poly-SiGe thin films were prepared on 6-inch substrates using Reactive-thermal CVD with $Si_2H_6$ and $GeF_4$ around at $500^{\circ}C$ directly. Its thickness uniformity was ~ 3% on the entire substrate area. N-channel mobility of ~30 nm thick bottom-gate TFTs exceeded 20 $cm^2$/Vs without any further crystallization.

• Proceeding of EDISON Challenge
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• 2016.03a
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• pp.295-298
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• 2016

Future logic device over the FinFET generation requires a complete electrostatics and transport characteristic for low-power and high-speed operation as extremely scaled devices. Silicon, Germanium and III-V based nanowire-based MOSFET devices and few-layer TMDC (Transition metal dichalcogenide monolayers) based multi-gate devices have been brought attention from device engineers due to those excellent electrostatic and novel device characteristic. In this study, we simulated ultrascaled Si/Ge/InAs gate-all-around nanowire MOSFET and MoS2 TMDC based DG MOSFET and TFET device by tight-binding NEGF method. As a result, we can find promising candidates of the future logic device of each channel material and device structures.

• Polymer(Korea)
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• v.34 no.6
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• pp.588-593
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• 2010

New seven acrylic monomers with covalently bonded silicon, germanium, and tin were prepared for high refractive index materials. The monomers were copolymerized with a cross-linkable comonomer (Trimer) to prepare UV-films for optical characterization. The refractive index of the copolymers increased in proportion to the monomer content and extrapolated to determine that of homopolymer. $Ph_3Si$, $Ph_3Ge$, and $Ph_3Sn$ groups contributed to increase the refractive index of acrylic polymer, in which $Ph_3Sn$ was more effective than $Ph_3Ge$. The index increment confidently occurred with $Bu_3Sn$ attachment in comparison with aliphatic acrylic polymers. $Ph_3SnS$-attached acrylate polymer showed a refractive index of 1.671 at 589 nm. The index change was similarly observed at various different wavelengths (656, 830, 1310, and 1550 nm).

• Journal of Sensor Science and Technology
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• v.24 no.4
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• pp.264-269
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• 2015

An infrared (IR) bolometer measures the change of resistance by absorbing incident IR radiation and generates a signal as a function of the radiation intensity. Since a bolometer requires temperature stabilization and light filtering except for the infrared rays, it is essential for the device to be packaged meeting conditions that above mentioned. Minimization of heat loss is needed in order to stabilize temperature of bolometer. Heat loss by conduction or convection requires a medium, so the heat loss will be minimized if the medium is a vacuum. Therefore, vacuum packaging for bolometer is necessary. Another important element in bolometer packaging is germanium (Ge) window, which transmits IR radiation to heat the bolometer. To ensure a complete transmittance of IR light, anti-reflection (AR) coatings are deposited on both sides of the window. Although the transmittance of Ge window is high for IR rays, it is difficult to use frequently in low-price IR bolometer because of its high price. In this paper, we fabricated IR window by utilizing silicon (Si) substrate instead of Ge in order to reduce the cost of bolometer packaging. To enhance the IR transmittance through Si substrate, it is textured using Reactive Ion Etching (RIE). The texturing process of Si substrate is performed along with the change of experimental conditions such as gas ratio, pressure, etching time and RF power.

• Applied Chemistry for Engineering
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• v.25 no.1
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• pp.1-13
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• 2014

Lithium ion batteries (LIBs) are the state-of-the-art technology among electrochemical energy storage and conversion cells, and are still considered the most attractive class of battery in the future due to their high specific energy density, high efficiency, and long cycle life. Rapid development of power-hungry commercial electronics and large-scale energy storage applications (e.g. off-peak electrical energy storage), however, requires novel anode materials that have higher energy densities to replace conventional graphite electrodes. Germanium (Ge) and silicon (Si) are thought to be ideal prospect candidates for next generation LIB anodes due to their extremely high theoretical energy capacities. For instance, Ge offers relatively lower volume change during cycling, better Li insertion/extraction kinetics, and higher electronic conductivity than Si. In this focused review, we briefly describe the basic concepts of LIBs and then look at the characteristics of ideal anode materials that can provide greatly improved electrochemical performance, including high capacity, better cycling behavior, and rate capability. We then discuss how, in the future, Ge anode materials (Ge and Ge oxides, Ge-carbon composites, and other Ge-based composites) could increase the capacity of today's Li batteries. In recent years, considerable efforts have been made to fulfill the requirements of excellent anode materials, especially using these materials at the nanoscale. This article shall serve as a handy reference, as well as starting point, for future research related to high capacity LIB anodes, especially based on semiconductor Ge and Si.

• Journal of the Korean Society of Radiology
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• v.12 no.1
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• pp.17-22
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• 2018

Multilayer mirrors are optical elements that can replace single crystal optical elements such as silicon or germanium, and they have artificial diffraction plane of a thickness of several nanometers. We examined the first Bragg angle and the reduction of reflectivity by variation of layer thickness in a W/Si multilayer mirror of small d-spacing. A W/Si multilayer mirror for an incidence angle of $0.55^{\circ}$ and an energy of 17.5 keV was designed and showed a maximum reflectivity of 72.67%. When the thickness of tungsten or silicon layer was simultaneously changed, the first Bragg angle was shifted and the reflectivity was reduced. When there was a change in thickness for one layer of W/Si multilayer, no change in the reflectivity was showed but the unevenness of the envelope was observed. Reduction of reflectivity was also observed at random Gaussian thickness variations. It is possible to predict the tolerance of multilayer mirror by examining the reflectivity degradation according to the thickness change in the W/Si multilayer mirror of small d-spacing.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.320-320
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• 2014

Amorphous silicon alloy (a-Si) solar cells and modules have been receiving a great deal of attention as a low-cost alternate energy source for large-scale terrestrial applications. Key to the achievement of high-efficiency solar cells using the multi-junction approach is the development of high quality, low band-gap materials which can capture the low-energy photons of the solar spectrum. Several cell designs have been reported in the past where grading or buffer layers have been incorporated at the junction interface to reduce carrier recombination near the junction. We have investigated profiling the composition of the a-SiGe alloy throughout the bulk of the intrinsic material so as to have a built-in electrical field in a substantial portion of the intrinsic material. As a result, the band gap mismatch between a-Si:H and $a-Si_{1-x}Ge_x:H$ creates a barrier for carrier transport. Previous reports have proposed a graded band gap structure in the absorber layer not only effectively increases the short wavelength absorption near the p/i interface, but also enhances the hole transport near the i-n interface. Here, we modulated the GeH4 flow rate to control the band gap to be graded from 1.75 eV (a-Si:H) to 1.55 eV ($a-Si_{1-x}Ge_x:H$). The band structure in the absorber layer thus became like a U-shape in which the lowest band gap was located in the middle of the i-layer. Incorporation of this structure in the middle and top cell of the triple-cell configuration is expected to increase the conversion efficiency further.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.5
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• pp.366-371
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• 2012

In this paper, fabricated by MEMS uncooled micro-bolometer detector for the study in the infrared sensitivity enhancement. Absorption layer SiOx-Metal series MDTF (metal-dielectric thin film) by high absorption rate and has a high thermal coefficient of resistance, low noise characteristics were implemented. Then MDTF were made in a vacuum deposition method. And MDTF for the analysis of the physical properties of silicon wafers were fabricated, TCR (temperature coefficient of resistance) value was made in order to measure the glass wafer and FT-IR (Fourier Transform Infrared spectroscopy) values were made in order to measure the germanium window. The analyzed results of MDTF -3 [%/K] has more characteristics of the TCR. And 8~12 um wavelength region close to 70% in the absorption characteristic.