• 제목/요약/키워드: Silicon etching

검색결과 740건 처리시간 0.028초

국부증착용 마이크로 샤도우 마스크 제작 (Fabrication of Miniaturized Shadow-mask for Local Deposition)

  • 김규만;유르겐부르거
    • 한국정밀공학회지
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    • 제21권8호
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    • pp.152-156
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    • 2004
  • A new tool of surface patterning technique for general purpose lithography was developed based on shadow mask method. This paper describes the fabrication of a new type of miniaturized shadow mask. The shadow mask is fabricated by photolithography and etching of 100-mm full wafer. The fabricated shadow mask has over 388 membranes with apertures of micrometer length scale ranging from 1${\mu}{\textrm}{m}$ to 100s ${\mu}{\textrm}{m}$ made on each 2mm${\times}$2mm large low stress silicon nitride membrane. It allows micro scale patterns to be directly deposited on substrate surface through apertures of the membrane. This shadow mask method has much wider choice of deposit materials, and can be applied to wider class of surfaces including chemical functional layer, MEMS/NEMS surfaces, and biosensors.

실리콘 웨이퍼의 고정밀 단면 연삭에 관한 연구 (A Study on Precision Infeed Grinding for the Silicon Wafer)

  • 안대균;황징연;최성주;곽창용;하상백
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.1-5
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    • 2005
  • The grinding process is replacing lapping and etching process because significant cost savings and performance improvemnets is possible. This paper presents the experimental results of wafer grinding. A three-variable two-level full factorial design was employed to reveal the main effects as well as the interaction effects of three process parameters such as wheel rotational speed, chuck table rotational speed and feed rate on TTV and STIR of wafers. The chuck table rotaional speed was a significant factor and the interaction effects was significant. The ground wafer shape was affected by surface shape of chuck table.

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자기 조립 분자막의 표면파손특성 및 미세 금속 구조물 제작에의 응용 (Surface Damage Characteristics of Self-Assembled Monolayer and Its Application in Metal Nano-Structure Fabrication)

  • 성인하;김대은
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2002년도 제35회 춘계학술대회
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    • pp.40-44
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    • 2002
  • The motivation of this work is to use SAM(Self-Assembled Monolayer) for developing a rapid and flexible non-photolithographic nano-structure fabrication technique which can be utilized in micro-machining of metals as well as silicon-based materials. The fabrication technique implemented in this work consists of a two-step process, namely, mechanical scribing followed by chemical etching. From the experimental results, it was found that thiol on copper surface could be removed even under a few nN normal load. The nano-tribological characteristics of thiol-SAM on various metals were largely dependent on the native oxide layer of metals. Based on these findings, nano-patterns with sub-micrometer width and depth on metal surfaces such as Cu, Au and Ag could be obtained using a diamond-coated tip.

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광 포획 태양전지 모듈 커버용 유리기판 기술 현황 (Current status of light trapping in module cover glass for PV module)

  • 박형식;정재성;신명훈;김선보;이준신
    • Current Photovoltaic Research
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    • 제4권3호
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    • pp.119-123
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    • 2016
  • We discussed various cover glass substrates available for photovoltaic (PV) modules, and investigated the fabrication methods of light trapping structures for the efficiency enhancement of PV modules: wet and dry etching or laser and direct patternings. We also introduced the analysis of haze at etched glass surfaces as a function of wavelength and also presented a anti-reflection coating technology for PV module.

ZnO 바리스터의 단입계면 분석을 위한 마이크로 전극 제작과 전기적 특성 해석 (The Fabrication of Micro-electrodes to Analyze the Single-grainboundary of ZnO Varistors and the Analysis of Electrical Properties)

  • 소순진;임근영;박춘배
    • 한국전기전자재료학회논문지
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    • 제18권3호
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    • pp.231-236
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    • 2005
  • To investigate the electrical properties at the single grainboundary of ZnO varistors, micro-electrodes were fabricated on the surface which was polished and thermally etched. Our micro-electrode had 2000 $\AA$ silicon nitride layer between micro-electrode and ZnO surface. This layer was deposited by PECVD and etched by RIE after photoresistor pattering process using by mask 1. The metal patterning of micro-electrodes used lift-off method. We found that the breakdown voltage of single grainboundary is about 3.5∼4.2 V at 0.1 mA on I-V curves. Also, capacitance-voltage measurement at single grainboundary gave several parameters( $N_{d}$, $N_{t}$, $\Phi$$_{b}$, t) which were related with grainboundary.ary.

플라즈마 화학 증착법을 이용한 탄소나노튜브의 촉매 성장에 관한 연구 (Catalytic growth of carbon nanotubes using plasma enhanced chemical vapor deposition(PECVD))

  • 정성회;장건익
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.935-938
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    • 2001
  • Carbon nanotubes(CNTs) was successfully grown on Ni coated silicon wafer substrate by applying PECVD technique(Plasma Enhanced Chemical Vapor Deposition). As a catalyst, Ni thin film of thickness ranging from 15∼30nm was prepared by electron beam evaporator method. In order to find the optimum growth condition, the type of the gas mixture such as C$_2$H$_2$-NH$_3$was systematically investigated by adjusting the gas mixing ratio in temperature of 600$^{\circ}C$ under the pressure of 0.4 torr. The diameter of the grown CNTs was 40∼150nm. As NH$_3$etching time increased the diameters of the nanotubes decreased whereas the density of nanotubes increased. TEM images clearly demonstrated synthesized nanotubes was multiwalled. We investigated electrical properties for the application of FED.

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자기변형 박막을 이용한 마이크로 펌프의 제작과 시험 (Fabrication and Test of a Micro Pump with a Magnetostrictive diaphragm)

  • 서지훈;정옥찬;양상식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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    • pp.1017-1019
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    • 1998
  • In this paper, the fabrication of a micropump with two giant magnetostrictive films of Sm-Fe and Tb-Fe is presented. The pump consist of one silicon wafer and one cover glass. The micropump consists of an actuator diaphragm, a paired nozzle and diffuser, and two through holes. The Structure of the micropump is fabricated by the chemical vapor deposition, the etching and the sputtering of the magnetostrictive films. The deflection of the actuator measured diaphragm is measured by using the laser vibrometer and the flow rate of the micro pump is observed by using a video microscope.

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웨이브릿과 X-ray 광전자 분광법을 이용한 반도체 플라즈마 공정 감시 기법 (Monitoring of semiconductor plasma process using wavelet and X-ray photoelectron spectroscopy)

  • 박경영;김병환
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2005년도 심포지엄 논문집 정보 및 제어부문
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    • pp.281-283
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    • 2005
  • Processing Plasmas are very sensitive to a variation in process parameters, To maintain process quality and device field, plasma malfunction should be tightly monitored with high sensitivity. A new monitoring method is presented and this was accomplished by applying discrete wavelet transformation to X-ray photoelectron spectroscopy. XPS data were collected during a plasma etching of silicon carbide. Various effects of DWT factor on fault sensitivity were optimized experimentally. Compared to raw data, total percent sensitivity for DWT data demonstrated a significantly improved sensitivity to plasma faults induced by bias power.

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표면 텍스쳐된 ZnO:Al 투명전도막 증착 및 특성 (The Deposition and Properties of Surface Textured ZnO:Al Films)

  • 유진수;이정철;김석기;윤경훈;박이준;이준신
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제52권9호
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    • pp.378-382
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    • 2003
  • Transparent conductive oxides (TCO) are necessary as front electrode for most thin film solar cell. In our paper, transparent conducting aluminum-doped Zinc oxide films (ZnO:Al) were prepared by rf magnetron sputtering on glass (Corning 1737) substrate as a variation of the deposition condition. After deposition, the smooth ZnO:Al films were etched in diluted HCI (0.5%) to examine the electrical and surface morphology properties as a variation of the time. The most important deposition condition of surface-textured ZnO films by chemical etching is the processing pressure md the substrate temperature. In low pressures (0.9mTorr) and high substrate temperatures ($\leq$$300^{\circ}C$), the surface morphology of films exhibits a more dense and compact film structure with effective light-trapping to apply the silicon thin film solar cells.

Surface Textured ZnO:Al 투명전도막 제작 및 특성 (The fabrication and properties of surface textured ZnO:Al films)

  • 유진수;이정철;강기환;김석기;윤경훈;송진수;박이준
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집
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    • pp.391-394
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    • 2002
  • Transparent conductive oxides (TCO) are necessary as front electrode for most thin film solar cell. In our paper, transparent conducting aluminum-doped Zinc oxide films (ZnO:Al) were prepared by rf magnetron sputtering on glass (Corning 1737) substrate as a variation of the deposition condition. After deposition, the smooth ZnO:Al films were etched in diluted HCl (0.5%) to examine the electrical and surface morphology Properties as a variation of the time. The most important deposition condition of surface-textured ZnO films by chemical etching is the processing pressure and the substrate temperature. In low pressures (0.9 mTorr) and high substrate temperatures ($\leq$30$0^{\circ}C$), the surface morphology of films exhibits a more dense and compact film structure with effective light-trapping to apply the silicon thin film solar cells.

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