• 전자공학회논문지A
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• 제30A권6호
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• pp.22-30
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• 1993

An integrated silicon pressure sensor with frequency output has been fabricated, measured, and tested. The standard bipolar process is applied and thin diaphragm was formed using EDP anisotropic etchant. Output frequency was 769 Hz-3.1 kHz at the pressure range of 0-10 psi. It operates at the temperature range of 0-50$^{\circ}C$. The frequency sensitivity was 233 Hz/psi and temperature sensitivity was 0.3 Hz/$^{\circ}C$. The power dissipation was 50mW.

• 센서학회지
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• 제9권6호
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• pp.424-429
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• 2000

실리콘 고무 멤브레인(membrane)에 실리콘 빔(beam)들이 삽입된 형태의 저차압센서를 개발하였다. 제작된 저차압센서는 실리콘 고무(silicone rubber)를 멤브레인으로 사용함으로써 열악한 환경에서도 다양한 응용분야에 적용 가능하도록 하였다. 실리론 고무 멤브레인을 사용한 압저항형 저차압센서는 선택적으로 도핑(doping)된 (100) n/n+/n 웨이퍼 상에 다공질 마이크로머시넝(micro-machining) 기술을 이용하여 제작되었다. 제조된 센서의 감도(sensitivity)는 $0.66{\mu}V/mmHg$이고, 0.1% 이하의 비선형성(non-linearity)을 보였다.

• 센서학회지
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• 제5권5호
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• pp.31-37
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• 1996

본 연구에서는 LPCVD(저압화학기상증착)로 형성된 폴리실리콘의 전단 압저항 효과를 이론적으로 분석하고, 전단 압저항체를 응용한 압력센서를 설계 제작하여 그 특성을 연구하였다. 제작된 센서는 $1kgf/cm^{2}$의 압력과 $-20{\sim}+125^{\circ}C$의 온도범위에서 3.1mV/V의 압력감도, ${\pm}0.012%FS/^{\circ}C$의 오프셀온도계수(TCO), ${\pm}0.08%FS/^{\circ}C$의 감도온도계수(TCS)를 나타내었다. 또한, 같은 온도범위에서 ${\pm}0.2%FS$의 히스테리시스, ${\pm}1.5%FS$의 비직선성 변화를 보였다. 전단형 압력센서는 브리지형과는 달리 하나의 저항체로 이루어져 있어 브리지의 각 저항값 불일치로 인한 특성의 오차를 줄일 수 있고, 절연층 위에 폴리실리콘이 형성되어 있으므로 온도범위를 확장할 수 있는 장점을 가진다.

• 한국전기전자재료학회논문지
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• 제19권4호
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• pp.328-333
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• 2006

In this paper, we developed a pressure measurement apparatus with the parallel structure to improve the measurement efficiency of pressure sensors by reducing the measurement time of pressure. The developed system has two parallel positions for loading Silicon pressure sensor and has a dual valve structure. The semiconductor pressure sensors prepared by Copal Electronics were used to confirm the performance of the developed measurement system. Two stage differential amplifier circuit was employed to amplify the weak output signal and the amplified output signal was improved utilizing a low-pass filter. New apparatus shows the measurement time of pressure two times shorter than that of conventional one with the serial structure, while both structures show the similar linear output versus pressure characteristics.

• 센서학회지
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• 제14권5호
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• pp.357-361
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• 2005

Low-stress silicon nitride (LSN) thin films with embedded metal line have been developed as free standing structures to keep microspheres in proper locations and localized heat source for application to a chip-based sensor array for the simultaneous and near-real-time detection of multiple analytes in solution. The LSN film has been utilized as a structural material as well as a hard mask layer for wet anisotropic etching of silicon. The LSN was deposited by LPCVD (Low Pressure Chemical Vapor Deposition) process by varing the ratio of source gas flows. The residual stress of the LSN film was measured by laser curvature method. The residual stress of the LSN film is 6 times lower than that of the stoichiometric silicon nitride film. The test results showed that not only the LSN film but also the stack of LSN layers with embedded metal line could stand without notable deflection.

• 센서학회지
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• 제26권3호
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• pp.186-191
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• 2017

In this study, we investigated the simultaneous detection properties of organic vapor, pressure difference, and magnetic field using a single rugate-structured free-standing porous silicon (RFPS) thin film. Both the wavelength and the intensity of the rugate peaks were changed in the reflectivity spectrum measured at the thin film surface while the organic vapor was exposed to the RFPS thin film. However, when the pressure difference and the magnetic field were exposed to the film, only the rugate peak intensity was changed. Therefore, it is possible to distinguish whether or not the organic vapor is detected by simultaneously changing the rugate peak wavelength and intensity. In addition, a method of distinguishing between the pressure difference and the magnetic field detection signal has been derived by rapidly modulating the direction of the magnetic field. This study shows that it is possible to simultaneously detect and distinguish various objects using a single RFPS thin film, and it is found that porous silicon can be utilized as a sensor sufficiently.

• 한국전기전자재료학회논문지
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• 제33권5호
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• pp.350-354
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• 2020

In this study, a pressure sensor for each displacement was fabricated based on the silicon-based pressure sensor obtained through simulation results. Wires were bonded to the pressure sensor, and a piezoresistive pressure sensor was inserted into the printed circuit board (PCB) base by directly connecting a micro-electro-mechanical system (MEMS) sensor and a readout integrated circuit (ROIC) for signal processing. In addition, to prevent exposure, a non-conductive liquid silicone was injected into the sensor and the entire ROIC using a pipette. The packaging proceeded to block from the outside. Performing such packaging, comparing simple contact with strong contact, and confirming that the measured pulse wavelength appears accurately.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1978.1_1979.1
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• 2009

In this paper, we have proposed and demonstrated a tonometry sensor array for measuring arterial pulse pressure. A sensor module consists of 7 piezoresistive pressure sensor array. Wire-bonded connection was provided between silicon chip and lead frame. PDMS(poly-dimethylsiloxane) was coated on the sensor array to protect fragile sensor while faithfully transmitting the pressure of radial artery to the sensor. Tonometric pulse pressure can be measured by this packaged sensor array that provides the pressure value versus the output voltage.

• 전기전자학회논문지
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• 제1권1호
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• pp.1-10
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• 1997

It is well-known that rectangular bulk-Si sensors prepared by etch or epi etch-stop micromachining technology are already in practical use today, but the conventional bulk-Si sensor shows some drawbacks such as large chip size and limited applications as silicon sensor device is to be miniaturized. We consider a circular-shape SOI(Silicon-On-Insulator) micro-cavity technology to facilitate multiple sensors on very small chip, to make device easier to package than conventional sensor like pressure sensor and to provide very high over-pressure capability. This paper demonstrates the cross-functional results for stress analyses(targeting $5{\mu}m$ deflection and 100MPa stress as maximum at various applicable pressure ranges), for finding permissible diaphragm dimension by output sensitivity, and piezoresistive sensor theory from two-type SOI structures where the double SOI structure shows the most feasible deflection and small stress at various ambient pressures. Those results can be compared with the ones of circular-shape bulk-Si based sensor$^{[17]}. The SOI micro-cavity formed the sensors is promising to integrate with calibration, gain stage and controller unit plus high current/high voltage CMOS drivers onto monolithic chip.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1872-1874
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• 2001

This paper presents an implantable telemetry LC resonance-type pressure sensor to measure the cerebral ventricle pressure. The sensor consists of an inductor and a capacitor. The LC resonant circuit consists of the sensor and an external antenna coil that are coupled magnetically. The resonance frequency of the circuit decreases as the applied pressure increases the capacitance of the sensor. The sensor is designed in consideration of the biocompatibility and long lifetime for continuous monitoring of the ventricle pressure. The sensor is simple to fabricate and small in comparison with others reported previously. The inductor is fabricated by electroplating and the variable capacitor is constructed with a flexible p+ diaphragm. Also, the deflection of the diaphragm, the variation of the capacitance and the resonance frequency are analyzed and calculated.