• 제목/요약/키워드: Silicon Carbide

검색결과 745건 처리시간 0.025초

Preparation of Silicon Nitride-silicon Carbide Composites from Abrasive SiC Powders

  • Kasuriya, S.;Thavorniti, P.
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.1091-1092
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    • 2006
  • Silicon nitride - silicon carbide composite was developed by using an abrasive SiC powders as a raw material. The composites were prepared by mixing abrasive SiC powder with silicon, pressing and sintering at $1400^{\circ}C$ under nitrogen atmosphere in atmosphere controlled vacuum furnace. The proportion of silicon in the initial mixtures varied from 20 to 50 wt%. After sintering, crystalline phases and microstructure were characterized. All composites consisted of ${\alpha}-Si_3N_4$ and ${\beta}-Si_3N_4$ as the bonding phases in SiC matrix. Their physical and mechanical properties were also determined. It was found that the density of the obtained composites increased with an increase in the $Si_3N_4$ content formed in the reaction.

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SiC 증착물의 형상에 미치는 과포화도의 영향 (Effect of Supersaturation on Morphology of Silicon Carbide Deposits)

  • 소명기
    • 산업기술연구
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    • 제6권
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    • pp.13-17
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    • 1986
  • The effect of supersaturation on morphology of silicon carbide by chemical vapor deposition using $CH_3SiCl_3-H_2$ gas mixture system was investigated. The experimental results show that the final structure of silicon carbide deposits is coarser as total pressure increases or ${\alpha}$-ratio decreases. It is believed because supersataration of Si-source decreases as total pressure increases or ${\alpha}$-ratio decreases.

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화학증착된 실리콘 카바이드 박막의 속도론적 모델 및 기계적 성질에 미치는 반응가스 분압의 영향 (Effect of Partial Pressure of the Reactant Gas on the Kinetic Model and Mechanical Properties of the Chemical Vapor Deposited Silicon Carbide)

  • 어경훈;소명기
    • 한국세라믹학회지
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    • 제28권6호
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    • pp.429-436
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    • 1991
  • Silicon carbide has been grown by a chemical vapor deposition (CVD) technique using CH3SiCl3 and H2 gaseous mixture onto a graphite substrate. Based on the thermodynamic equilibrium studies and the suggestion that the deposition rate of SiC is controlled by surface reaction theoretical kinetic equation for CVD of silicon carbide has been proposed. The proposed theoretical kinetic equation for CVD of silicon carbide agreed well with the experimental results for the variation of the deposition rate as a function of the partial pressure of reactant gases. The Vikers microhardness of the SiC layer was about 3000∼3400 kg/$\textrm{mm}^2$ at room temperature.

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Photoluminescence of Porous Silicon Carbide in Solvents

  • Lee, Ki-Hwan;Lee, Tae-Ho;Yoon, Seok-Won;Lee, Seung-Koo;Jeon, Hae-Kwon;Choi, Chang-Shik
    • Journal of Photoscience
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    • 제12권3호
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    • pp.171-174
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    • 2005
  • The relationship between porous surfaces and photoluminescence (PL) behavior of porous silicon carbide (PSC) in various solvents has been studied. The porous surfaces of p-type silicon carbide can be fabricated by electrochemical anodization from the 6H, 15R, 4H-${\alpha}$-SiC substrates in dark-current mode (DCM) condition. We have been investigated the dependence of the PL spectra of PSC under the medium having the different dielectric constants. It has been found that PL depends sensitively on the environment surrounding the surface. The extent of chemically stability on the surface of PSC due to the various solvents was confirmed by reflectance Fourier transform infrared (FTIR) spectroscopy. Detailed IR experiments on the PSC samples were carried out before and after various solvents immersion. These results will be offered important information on the origin of PL in porous structure.

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반도체 플라즈마 식각 장치의 부품 가공 연구 (A Study of Machining Optimization of Parts for Semiconductor Plasma Etcher)

  • 이은영;김문기
    • 반도체디스플레이기술학회지
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    • 제19권4호
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    • pp.28-33
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    • 2020
  • Plasma etching process employs high density plasma to create surface chemistry and physical reactions, by which to remove material. Plasma chamber includes silicon-based materials such as a focus ring and gas distribution plate. Focus ring needs to be replaced after a short period. For this reason, there is a need to find materials resistant to erosion by plasma. The developed chemical vapor deposition processing to produce silicon carbide parts with high purity has also supported its widespread use in the plasma etch process. Silicon carbide maintains mechanical strength at high temperature, it have been use to chamber parts for plasma. Recently, besides the structural aspects of silicon carbide, its electrical conductivity and possibly its enhanced life time under high density plasma with less generation of contamination particles are drawing attention for use in applications such as upper electrode or focus rings, which have been made of silicon for a long time. However, especially for high purity silicon carbide focus ring, which has usually been made by the chemical vapor deposition method, there has been no study about quality improvement. The goal of this study is to reduce surface roughness and depth of damage by diamond tool grit size and tool dressing of diamond tools for precise dimensional assurance of focus rings.

Industrial Applications of Si-based Ceramics

  • Eichler, Jens
    • 한국세라믹학회지
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    • 제49권6호
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    • pp.561-565
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    • 2012
  • Due to their unique combination of properties, Si-based ceramics, such as silicon carbide (SiC), silicon nitride ($Si_3N_4$) and silicon oxide ($SiO_2$ as fused silica), have a range of industrial applications in fields such as the chemical industry, aluminum manufacturing, oil and gas production and solar cell production. For each materials group, examples of typical applications from various industry sectors are presented while taking into account the property fingerprint.

다공성실리콘 위의 탄화규소 박막의 증착 및 발광특성 (Deposition and Photoluminescence Characteristics of Silicon Carbide Thin Films on Porous Silicon)

  • 전희준;최두진;장수경;심은덕
    • 한국세라믹학회지
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    • 제35권5호
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    • pp.486-492
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    • 1998
  • Silicon carbide (SiC) thin films were deposited on the porous silicon substrates by chemical vapour de-position(CVD) using MTS as a source material. The deposited films were ${\beta}$-SiC with poor crystallity con-firmed by XRD measurement. It was considered that the films showed the mixed characteistics of cry-stalline and amorphous SiC where amorphous SiC where amorphous SiC played a role of buffer layer in interface between as-dep films and Si substrate. The buffer layer reduced lattice mismatch to some extent the generally occurs when SiC films are deposited on Si. The low temperature (10K) PL (phtoluminescence) studies showed two broad bands with peaks at 600 and 720 for the films deposited at 1100$^{\circ}C$ The maximum PL peak of the crystalline SiC was observed at 600 nm and the amrophous SiC of 720 nm was also confirmed. PL peak due the amorphous SiC was smaller than that of the crystalline SiC, PL of porous Si might be disapperared due to densification during heat treatment.

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SiC/p-Aramid 복합방적사 제조기술 연구 (Research of the Composite Spun Yarn Manufacturing Process using Silicon Carbide and Para Aramid Fiber)

  • 김북성;유희준
    • 한국염색가공학회지
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    • 제33권4호
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    • pp.309-316
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    • 2021
  • Due to the rigid nature of the silicon carbide fiber(SiC), fiber damage occurs from the friction during the carding process. This damage not only lowers the spun yarn yield, but also lowers the heat resistance of the spun yarn, so that ultra-high heat resistant yarn cannot be manufactured. Therefore, in the carding process where the most friction between fiber and machine(wire, etc.) occurs, some factors were modified and tested, and as a result of measuring the change in physical properties, fiber damage decreased due to the wire angle or wire density, resulting in improved yield. The test method used to measure the yield of SiC fiber was the carbonization method, and the content of SiC fibers was calculated using the remaining amount after carbonization. Carbonization test was performed at air condition, 700℃, and for 2 hours. Analysis by SEM-EDX showed that the carbide was consistent with the composition of the SiC fiber.