• Bulletin of the Korean Chemical Society
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• v.30 no.7
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• pp.1593-1597
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• 2009

A biosensor has been developed based on induced wavelength shifts in the Fabry-Perot fringes in the visible reflection spectrum of appropriately derivatized thin films of porous silicon semiconductors. Porous silicon (PSi) was generated by an electrochemical etching of silicon wafer using two electrode configurations in aqueous ethanolic HF solution. Porous silicon displayed Fabry-Perot fringe patterns whose reflection maxima varied spatially across the porous silicon. The sensor system studied consisted of a mono layer of porous silicon modified with Protein A. The system was probed with various fragments of an aqueous Human Immunoglobin G (Ig G) analyte. The sensor operated by measurement of the Fabry-Perot fringes in the white light reflection spectrum from the porous silicon layer. Molecular binding was detected as a shift in wavelength of these fringes.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1996.06b
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• pp.129-153
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• 1996

In aqueous slurry processing of silicon nitride, the interaction of dispersant and binder on the surface of particles was studied to identify the effect of these additives on ceramic powder processing. Polymethacrylic acid (PMAA) and polyvinyl alcohol (PVA) were used as dispersant and binder, respectively. the adsorption isotherms of PMAA and PVA for the silicon nitride suspension were determined, while the adsorption of PMAA was differentiated in the mixed additive system by ultraviolet spectroscopy. These experiments were done in order to investigate the effect of these organic additives on the physicochemical properties of silicon nitride suspensions. The electrokinetic behavior of silicon nitride was subsequently measured by electrokinetic sonic amplitude (ESA). As PMAA adsorbed onto silicon nitride, the isoelectric point (pHicp) shifted from pH=6.7 to acidic pH, depending on the surface coverage of PMAA. However, adsorption of PVA did not change the pHicp of suspensions, but did decrease the surface potential of silicon nitride moderately. The rheological behavior of silicon nitride suspensions was measured to assess the stability of particles in aqueous media, and was correlated with the electrokinetic behavior and adsorption isotherm data for silicon nitride.

• Journal of the Korean Ceramic Society
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• v.50 no.4
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• pp.294-300
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• 2013

The effect of chemical treatments of porous silicon in organic solvents on its nanostructural and optical features was investigated. When the porous Si was dipped in the organic solvent with various PH values, the morphological, chemical, and structural properties of the porous silicon was sensitively affected by the chemical conditions of the solvents. The size of silicon nanocrystallites in the porous silicon decreased from 5.4 to 3.1 nm with increasing pH values from 1 to 14. After the samples were dipped in the organic solvents, the Si-O-H bonding intensity was increased while that of Si-H bonding decreased. Photoluminescence peaks shifted to a shorter wavelength region in the range of 583 to 735 nm as the pH value increased. PL intensity was affected by the size as well as the volume fraction of the nanocrystalline silicon in the porous silicon.

• Mass Spectrometry Letters
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• v.12 no.1
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• pp.26-30
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• 2021

The impurity concentration is a crucial parameter for semiconductor thin films. Evaluating the impurity distribution in silicon thin film is another challenge. In this study, we have investigated the doping concentration of boron in silicon thin film using time of flight secondary ion mass spectrometry in dynamic mode of operation. Boron doped silicon film was grown on i) p-type silicon wafer and ii) borosilicate glass using hot wire chemical vapor deposition technique for possible applications in optoelectronic devices. Using well-tuned SIMS measurement recipe, we have detected the boron counts 101~104 along with the silicon matrix element. The secondary ion beam sputtering area, sputtering duration and mass analyser analysing duration were used as key variables for the tuning of the recipe. The quantitative analysis of counts to concentration conversion was done following standard relative sensitivity factor. The concentration of boron in silicon was determined 1017~1021 atoms/㎤. The technique will be useful for evaluating distributions of various dopants (arsenic, phosphorous, bismuth etc.) in silicon thin film efficiently.

• Journal of the Korean institute of surface engineering
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• v.47 no.6
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• pp.354-361
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• 2014

In order to utilize silicon carbide (SiC) as an inner part of fluidized bed reactor (FBR) for manufacturing poly-silicon, we have carried out the thermodynamic calculation on the overall reactions including poly-silicon synthesis and compatibility of SiC with FBR process. The resources of silicon included $SiH_4(MS)$, $SiHCl_3(TCS)$ and $SiCl_4(STC)$ and the thermodynamic yield of the FBR with MS, TCS and STC were compared each other with variable range of temperature, pressure and hydrogen to silicon ratio. The silicon yield of MS, TCS and STC were 100%, 28% and 4%, respectively, throughout the conventional FBR conditions. Silicon carbide having high hardness and strength showed strong resistance to granule collisions during the FBR process using a lab-scale reactor. And it also showed quite good compatibility with the typical FBR processes of MS and TCS resources.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.11 no.3
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• pp.89-95
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• 2001

The CZ-silicon crystal was annealed at $1350^{\circ}C$ to dissolve the vacancy type grown-in defects. A this temperature, the equilibrium concentration of the oxygen in the silicon crystal is around $1.7{\times}10^{18}$ which induces the oxygen undersaturation in the silicon crystal. This situation results in the faster dissolution of the grown-in defects in the bulk of the silicon wafer than near the surface. This indicates the possibility that the presence of the higher concentration of silicon interstitial hinders the dissolution of the grown-in defects, which were known to compose of the vacancy clusters with surrounding silicon oxide film. This expectation was confirmed by the observation that the slower dissolution of the grown-in defects near the surface of the silicon wafer in the oxygen atmosphere than in the argon atmosphere. This result is quite opposite to the previous argument hat presence of the excess silicon interstitial leads to faster dissolution of the vacancy type defects.

• Korean Chemical Engineering Research
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• v.54 no.1
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• pp.16-21
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• 2016

Silicon/Carbon/CNT composites as anode materials for lithium-ion batteries were synthesized to overcome the large volume change during lithium alloying-de alloying process and low electrical conductivity. Silicon/Carbon/CNT composites were prepared by the fabrication processes including the synthesis of SBA-15, magnesiothermic reduction of SBA-15 to obtain Si/MgO by ball milling, carbonization of phenolic resin with CNT and HCl etching. The prepared Silicon/Carbon/CNT composites were analysed by XRD, SEM, BET and EDS. In this study, the electrochemical effect of CNT content to improve the capacity and cycle performance was investigated by charge/discharge, cycle, cyclic voltammetry and impedance tests. The coin cell using Silicon/Carbon/CNT composite (Si:CNT=93:7 in weight) in the electrolyte of $LiPF_6$ dissolved in organic solvents (EC:DMC:EMC=1:1:1 vol%) has better capacity (1718 mAh/g) than those of other composition coin cells. The cycle performance of coin cell was improved as CNT content was increased. It is found that the coin cell (Si:CNT=89:11 in weight) has best capacity retension (83%) after 2nd cycle.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.21 no.3
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• pp.177-183
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• 2011

Occupational exposure to silicon carbide dust of manufacturing industries has seldom been evaluated in Korea. Accordingly, we evaluated various silicon carbide dust concentrations in the breathing zone of workers between May 2010 and July 2010. To compare silicon carbide dust concentrations, three dust samplers including the Institute of Occupational Medicine (IOM) sampler, 37mm cassette sampler, and Aluminum cyclone sampler were used. A total of 5 manufacturing industries producing abrasive and refractory materials using silicon carbide were investigated. The geometric mean concentrations were 2.04, 0.97, and $0.48mg/m^3$ in inhalable, total and respirable silicon carbide dust, respectively. The geometric mean concentrations of silicon carbide in abrasive material manufacturing industries were slightly higher than that of refractory manufacturing industries, and finishing operations were higher than that of other operations. It was found that the results of exposure assessment in airborne dust at manufacturing industries using silicon carbide in Korea showed exceeding rate to American Conference of Governmental Industrial Hygienists Threshold Limit Value ($3mg/m^3$) was 10% in respirable dust samples. Therefore, with the consideration of the close relationship between smaller dust size and the occurrence of occupational respiratory diseases, it is suggested to promulgate the new occupational exposure limit for respirable silicon carbide dust.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.9
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• pp.444-449
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• 2001

In this paper, a novel ultraviolet sensor is presented based on a photoluminescent porous silicon. Porous silicon layer was formed by chemical etching of surface of pn junction in a $HF(48%)-HNO_3(60%)-H_20$ solution. Incident ultraviolet(UV) light is converted to visible light by photoluminescent porous silicon layer, and then this visible light generates electron-hole pairs in the pn junction, which produces a photocurrent flow through the device. In order to maximize detection efficiency, the peak sensitivity wavelength of the pn junction diode was matched with the peak wavelength of Photoluminescence from porous silicon layer. The porous silicon ultraviolet sensor showed a large output current as UV intensity increases and but very low sensitivity to visible light. The detection sensitivity of porous silicon sensor was calculated as 2.91mA/mW. These results are expected to open up a possibility that the present porous silicon sensor can be used for detecting UV light in a visible background, compared to silicon UV detectors which have an undesirable response to visible light.

• Journal of Integrative Natural Science
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• v.3 no.3
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• pp.168-173
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• 2010

Novel porous silicon chip exhibiting dual optical properties, both Frbry-Perot fringe (optical reflectivity) and photoluminescence had been developed and used as chemical sensors. Porous silicon samples were prepared by an electrochemical etch of p-type sillicon wafer (boron-doped, <100> orientation, resistivity 1 - 10 ${\Omega}$). The ething solution was prepared by adding an equal volume of pure ethanol to an aqueous solution of HF (48% by weight). The porous silicon was illuminated with a 300 W tungsten lamp for the duration of etch. Ething was carried out as a two-electrode Kithley 2420 preocedure at an anodic current. The surface of porous silicon was characterized by FT-IR instrument. The porosity of samples was about 80%. Three different types of porous silicon, fresh porous silicon (Si-H termianated), oxidized porous silicon (Si-OH terminated), and surface-derivatized porous silicon (Si-R terminated), were prepared by the thermal oxidation and hydrosilylation. Then the samples were exposed to the wapor of various organics vapors. such as chloroform, hexane, methanol, benzene, isopropanol, and toluene. Both reflectivity and photoluminescence were simultaneously measured under the exposure of organic wapors.