• Title/Summary/Keyword: Silica slurry

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Study on the Fabrication of Ceramic Core using a Gel-casting Process in Aqueous medium(I) : Gelation Behavior of Polydispered Ceramic Slip (수용액 매체에서 젤-케스팅 공정을 이용한 세라믹 코어 제조에 관한 연구(I) : 다성분계 분산 세라믹 슬립의 젤화 거동)

  • Kim, Jae-Won;Kim, Du-Hyeon;Kim, In-Su;Yu, Yeong-Su;Kim, Jae-Cheol;Jo, Chang-Yong
    • Korean Journal of Materials Research
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    • v.11 no.2
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    • pp.137-145
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    • 2001
  • A new process, gelcasting in aqueous medium, to fabricate complex-shaped ceramic core has investigated. The ceramic slurry, mixture of fused silica powder and additives such as zircon and cordierite, was electrosterically stabilizes. The slip was prepared by ball milling of polydispered ceramic suspension with monomer, dimer and dispersant. The rheological behavior of slip was evaluated by viscosity measurement. It was found that the high solid loading of polydispersed ceramic slip, which has low viscosity of 50vol%, is possible to obtained. The viscosity of the slip was significantly dependent upon the amount of polymer dispersant and the formulation of monomer and dimer. The green bodies were fabricated through casting and gelation at room temperature followed by drying at $25^{\circ}C$ for 48hrs under relative humidity of 80~85%. Crack-free green body was successfully fabricated through the above process.

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Tensile Properties and Adhesion of Hybrid-Type Anti-Corrosion Polymer Cement Slurry (하이브리드형 방식 폴리머 시멘트 슬러리의 인장특성 및 접착성)

  • Jo, Young-Kug
    • Journal of the Korea Concrete Institute
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    • v.20 no.5
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    • pp.635-642
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    • 2008
  • In recent years, epoxy-coated reinforcing bars have been widely used in order to prevent the corrosion of ordinary reinforcing bar. However, they have a bad balance between performance and cost. Especially, they have a brittleness properties, low bond strength to cement concrete and no good bend-ability in the field. The purpose of this study is to evaluate the tensile properties and adhesion of hybrid-type anti-corrosion polymer cement slurry (PCS). PCSs are prepared with four types polymer dispersions using fly ash and silica fume, and tested for proper coating thickness, tensile properties, adhesion to steel plate and bend-ability. From the test results, the viscosity of PCS is effected by polymer dispersion types, and is a little decreased by using fly ash. The coating thickness of PCS has a proper thickness at polymer-binder ratio of 100%. It is apparent that the coating thickness has various values according to viscosity of PCS, water-binder ratio and polymer-binder rato. PCS has a good various anticorrosion properties and physical properties such as tensile strength, adhesion and bend-ability. It is also recommended that proper coating thickness to reinforcing bar is in the ranges of 150 to $250{\mu}m$ for bond strength, adhesion and bend-ability. It is also expected that the coated reinforcing bar using PCS is widely used instead of epoxy coated reinforcing bar in the industrial field.

Effect of mechanical damage on the crystallization of amorphous silicon thin film (기계적 손상이 비정질 규소박막의 결정화에 미치는 영향)

  • 문권진;김영관;윤종규
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.8 no.2
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    • pp.299-306
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    • 1998
  • Crystallization of the amorphous silicon needs activation. Thermal energy through laser annealing, furnace annealing and rapid thermal process (RTP) has been convinced to crystallize the amorphous silicon thin film. It is expected that some other type of energy like mechanical energy can help to crystallize the amorphous silicon thin film. In this study, mechanical energy through wet blasting of silica slurry and silicon ion implantation has been applied to the amorphous silicon thin film deposited with LPCVD technique. RTP was employed for the annealing of this mechanically-damaged amorphous silicon thin film. For the characterization of the crystallized silicon thin film, XRD and Raman analysis were conducted. In this study, it is shown that the mechanical damage is effective to enhance the crystallization of amorphous silicon thin film.

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Optimization Of CMP for $SiO_2$ Thin Film with a Control of Temperature in Pad Conditioning Process (패드 컨디셔닝시 온도조절을 통한 산화막 CMP 최적화)

  • Choi, Gwon-Woo;Park, Sung-Woo;Kim, Nam-Hoon;Chang, Eui-Goo;Seo, Yong-Jin;Lee, Woo-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.731-734
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    • 2004
  • As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. Polishing pads play a key role in CMP, which has been recognized as a critical step to improve the topography of wafers for semiconductor fabrication. It is investigated the performance of $SiO_2-CMP$ process using commercial silica slurry as a pad conditioning temperature increased after CMP process. This study also showed the change of SEM images in the pore geometry on the CMP pad surface after use with a different pad conditioning temperature.

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Development of Lightweight Foamed Concrete Using Polymer Foam Agent (고분자 기포제를 이용한 경량 기포 콘크리트의 개발(I))

  • 변근주;송하원;박상순
    • Magazine of the Korea Concrete Institute
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    • v.9 no.1
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    • pp.165-172
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    • 1997
  • Lightweight foamed concrete is a concrete which is lighter than conventional concree by mixing ptetoamed foam in cement slurry. The objectives of this study are to develop optimal prefoarneti lightweight foamed concrete with high lightness. high flowability and enough strength fol special use of structural application by using the polymer foam agent. By mixing the admixtures such as silica-fume and fly-ash and the industrial by-product such as styrofoam for the purpose of practical use of industrial waste, lightweight foamed concrete shich has better lightness. flowability and strength than the conventional prefoamed lightweight foamed concrete is developed. This paper presents extensive data on characteristics of compressive strength and flowability of the concrete manufactured with the different factors in mix design and also presents optimum mix proportion.

Chemical Mechanical Polishing Characteristics of BTO Thin Film for Vertical Sidewall Patterning of High-Density Memory Capacitor (고집적 메모리 커패시터의 Vertical Sidewall Patterning을 위한 BTO 박막의 CMP 특성)

  • Ko, Pil-Ju;Park, Sung-Woo;Lee, Kang-Yeon;Lee, Woo-Sun;Seo, Yong-Jin
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.55 no.3
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    • pp.116-121
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    • 2006
  • Most high-k materials are well known not to be etched easily, Some problems such as low etch rate poor sidewall angle, plasma damage, and process complexity were emerged from the high-density DRAM fabrication. Chemical mechanical polishing (CMP) by a damascene process was proposed to pattern this high-k material was polished with some commercial silica slurry as a function of pH variation. Sufficient removal rate with adequate selectivity to realize the pattern mask of tera-ethyl ortho-silicate (TEOS) film for the vertical sidewall angle were obtained. The changes of X-ray diffraction pattern and dielectric constant by CMP process were negligible. The planarization was also achieved for the subsequent multi-level processes. Our new CMP approach will provide a guideline for effective patterning of high-k material by CMP technique.

Effect of Oxidizer on the Polishing in Cadmium Telluride CMP (카드뮴 텔룰라이드 CMP 공정에서 산화제가 연마에 미치는 영향)

  • Shin, Byeong Cheol;Lee, Chang Suk;Jeong, Hae Do
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.1
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    • pp.69-74
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    • 2015
  • Cadmium telluride (CdTe) is being developed for thin film of the X-Ray detector recently. But a rough surface of the CdTe should be improved for resolution and signal speed. This paper shows the study on the improvement of surface roughness and removal rate by applying Chemical Mechanical Polishing. The conventional potassium hydroxide (KOH) based colloidal silica slurry could not realize a mirror surface without physical defects, resulting in low material removal rate and many scratches on surface. In order to enhance chemical reaction such as form oxidized layer on the surface of cadmium telluride, we used hydrogen peroxide ($H_2O_2$) as an oxidizer. Consequently, in case of 3 wt% concentration of hydrogen peroxide, the highest MRR (938 nm/min) and the lowest surface roughness ($R_{p-v}=10.69nm$, $R_a=0.8nm$) could be obtained. EDS was also used to confirm the generated oxide of cadmium telluride surface.

Formation mechanism of scratches on ILD CMP (ILD CMP 공정중 발생하는 Scratch 발생기구에 관한 연구)

  • Kim, In-Gon;Choi, Jea-Gon;Park, Jin-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.119-120
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    • 2008
  • ILD CMP process has been well accepted for the planarization of the dielectric oxide film and becomes a critical process in ULSI manufacturing due to the rapid shrinkage of the design rule for the device. In total manufacturing process steps for a device, the proportion of ILD CMP process has been gradually increased. Ever since ILD CMP has been introduced, the scratches have been a major defects on polished surfaces which cause the electrical shorts between vias or metal lines [1,2]. It was reported that micro-scratches are caused by large, irregularly shaped particles during CMP process. Therefore, most of the CMP users have used < 5 m POU filter to remove and reduce the scratch source from the slurry. However, the scratch has always been the biggest concern in ILD polishing whatever preventive actions are taken. Silica and ceria slurries are widely used for ILD CMP process. There are not much differences in generated scratches and their formation mechanism. In this study, the scratches were investigated as a function of polishing conditions with possible explanation on formation mechanism in ILD CMP.

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Polishing Behavior and Characterization of Cu Surface in Citric Acid based Slurry with Corrosion Inhibitor (BTA) (부식방지제(BTA)가 첨가된 Cu CMP 슬러리에서의 연마거동과)

  • Kim, In-Kwon;Kang, Young-Jae;Hong, Yi-Kwan;Kim, Tae-Gon;Park, Jin-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.42-43
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    • 2005
  • 본 연구에서는 Cu 슬러리에 부식방지제인 BTA를 첨가하여 슬러리내의 과수의 농도, pH 의 변화, 연마입자의 종류에 따라 연마거동에 미치는 영향과 각 chemical 변화에 따른 Cu surface의 변화를 살펴보았다. BTA (Benzotriazole, $C_6H_4C_3H$)를 첨가함으로써 본 연구에서 시행된 pH 와 과수의 변화에 상관없이 Cu-BTA film을 형성하여 Cu의 dissolution을 최대한 억제하는 것을 확인할 수 있었다. 또 그로인해 BTA를 첨가하지 않았을 때보다 얇은 passivation layer를 형성함을 알 수 있었고 contact angle도 더 높았다. 연마율의 경우에도 BTA가 첨가됨으로써 감소됨을 확인할 수 있었고 연마입자로 alumina particle을 사용한 경우에는 pH6, 과수 10vol%이상에서는 오히려 연마율이 증가하였다. fumed silica의 경우에는 hardness가 작아 mechanical적인 제거력이 낮아 BTA가 첨가되어도 연마율에는 큰 영향이 없었다.

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Engineering Properties of Sound Absorbing Foamed Concrete Using Bottom Ash Depending on Mix Factors (배합요인에 따른 바텀애시 미분말을 사용한 흡음형 기포콘크리트의 공학적 특성)

  • Kim, Jin-Man;Kang, Cheol
    • Journal of the Korea Institute of Building Construction
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    • v.9 no.5
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    • pp.63-70
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    • 2009
  • This study is part of an ongoing research project on the development of a sound-absorbing lightweight foamed concrete manufactured by a hydro-thermal reaction between silica and calcium. As the silica source, pulverized bottom ash was used, and as several cementitious powders of ordinary portland cement, alumina cement and calcium hydroxide were used. Manufacture of foamed concrete was accomplished using the pre-foaming method to make a continuous pore system, which is the method of making the foam by using a foaming agent, then making the slurry by mixing the foam, water, and powders. The experiment factors are W/B, foam agent dilution ratio, and foam ratio, and test items are compressive strength, dry density, void ratio, and absorption rate, as evaluated by NRC. The experiment results showed that the sound absorption of lightweight foamed concrete satisfied NRC requirements for the absorbing materials in most of the experiments. It is thus concluded that foam ratio was the most dominant factor, and significantly affected all properties of lightweight foamed concrete in this study. W/B rarely affected total void ratio and continuous void ratio as well as compressive strength, and dry density and foam agent dilution ratio also had little effect onalmost all properties. The analysis of the correlation between NRC, absorption time, continuous void ratio, and absorption time showed that the interrelationship of the continuous void ratio was high.