• 한국전기전자재료학회논문지
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• 제17권1호
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• pp.70-74
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• 2004

We investigated transmittance, surface characteristics, and resistivity according to bending of ITO(indium tin oxide) film with four other multi -harrier film). Transmission data of ITO film with four ITO films showed there was about large 90％ transmission above 550nm wavelength at three multi-barrier structures. But, both-side hard coated structure showed relatively low 75％ transmission above 550nm wavelength. And, surface images measured from SEM (scanning electron microscope) showed both-side hard coated structure have a tendency of more roughness. Also, resistivity change of four other multi-barrier film showed there was the lowest change at one-side hardcoated structure. Subsequently, with result of resistivity change according to position, we knew the resistivity change of the center increased rapidly than that of the edge.

• 한국기계가공학회지
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• 제12권5호
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• pp.36-41
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• 2013

One of the problems in grinding process using a machining center(MC) with a small diametric wheels is machining error due to decrease of the quill diameter. In this study, side-cut grinding is performed with a vitrified bonded CBN wheel on the machining center. Grinding experiments are performed at various grinding conditions including quill length, quill diameter and depth of cut. The effect on the grinding force, machining error and surface roughness due to the change of the quill rigidity are investigated experimentally. The slenderness ratio of the quill is significant factor to analyse the change of the grinding force and machining error.

• 한국공작기계학회논문집
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• 제10권4호
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• pp.1-6
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• 2001

In the present industry, there are necessary to cut only iron metals but also non-ferrous metals such as aluminum, brass, plastic and wood(Paulownia), therefor it had been made the studies of non-ferrous metals by many scientists. we hope this kind of study will continue. The purpose of this study is to conduct the basic experiment about influencing of the feedrate adjustment and the change of the side rake angle at turning of non-feerous metals. As the results, the surface roughnesses were on the decrease with a side-rake angle and feedrate diminution in the case of the pastic, aluminum, and paulownia.

• 한국소음진동공학회논문집
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• 제18권11호
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• pp.1097-1104
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• 2008

Working condition is one of the most important factors in precision working. In this study, we optimized the vibration acceleration of working progress direction using RSM(response surface methodology) by table of orthogonal array. RSM was well adapted to make analytic model for minimizing vibration acceleration, created the objective function and saved a great deal of computational time. Therefore, it is expected that the proposed optimization procedure using RSM can be easily utilized to solve the optimization problem of working condition. The experimental results of the surface roughness and vibration acceleration showed the validity of the proposed working condition of side wall end-milling as it can be observed.

• 한국정밀공학회지
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• 제30권4호
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• pp.397-402
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• 2013

In this study, we carried out the each lines of section, using GC (green silicon carbide) whetstone, the SCM415 material which separated by after and before heat treatments process, in 3+2 axis machining centers for integrated grinding after cutting end mill works, the spindle speed 8000 rpm and feed rate 150 mm/min. For the analysis of the centerline average roughness (Ra), we measured by 10 steps stages. Using Finite element analysis, we found the result of the load analysis effect of the assembly parts, when applied the 11 kg's load on both side of the ATC (Automatic tool change) arm. The result is as follows. For the centerline average roughness (Ra) in the non-heat treatment work pieces, are appeared the most favorable in the tenth section are $0.510{\mu}m$, that were shown in the near the straight line section which is the smallest deformation of curve. In addition, the bad surface roughness appears on the path is to long by changing angle, the more inclined depth of cut, because the chip discharging is not smoothly.

• Spatial Information Research
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• 제19권1호
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• pp.13-19
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• 2011

도시화가 진행됨에 띠라 고층아파트와 고층빌딩 등 지형지물의 변화가 많이 일어나고 있다. 지형지물의 변화는 강풍 발생의 원인으로 작용하며, 풍속은 풍상측 지형지물의 영향으로 같은 속도의 바람이 붙어올지라도 그 값이 증가 또는 감소한다. 설계기준에서는 이러한 변화를 풍속고도분포계수로 정의하고, 지표면조도에 따라 그 값을 산정하여 반영하도록 하고 있지만 현실에서는 설계자의 주관적 판단에 따라 지표면조도를 결정하야 풍속고도분포계수를 산정하고 있으며, 건설지점의 지표면조도를 구분하기 위한 연구와 자료 또한 부족한 실정이다. 본 논문에서든 최근 고층주거건물이 많이 건설된 지역을 대상으로 건축물의 수직높이에 따분 지표면조도를 GIS프로그램을 이용하여 정량적으로 구분함으로써 풍속 고도분포계수를 보다 합리적으로 산정하고자 한다. 풍하중을 고려한 구조물 설계 시 본 연구에서 제안한 풍속고도분포계수 산정방법을 이용함으로써 설계의 합리성과 구조물의 안전성을 더 높일 수 있을 것이다.

• The Journal of Advanced Prosthodontics
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• 제4권4호
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• pp.179-186
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• 2012

PURPOSE. The aim of this study was to evaluate the efficiency of manual polishing over autoglazed and overglazed porcelain and their effect on plaque accumulation. MATERIALS AND METHODS. Thirty-six porcelain discs were fabricated out of which 18 each was subjected for autoglazing and overglazing. Half surface of the discs was left intact; the remaining half was roughened with medium grit diamond bur. Roughened surfaces were repolished by porcelain polishing kits (Shofu, DFS, Eve). All the surfaces were evaluated by the perthometer and SEM. Six discs from each sample were placed in human volunteer's mouth for 72 hours to evaluate the plaque accumulation. Acquired data was subjected to ANOVA comparative evaluation. RESULTS. Roughened surfaces had average roughness value of $2.88{\pm}0.1935{\mu}m$. The repolished surfaces by porcelain correction kits Shofu, DFS and Eve, average roughness value reduced to $0.6250{\pm}0.1036$, $0.9192{\pm}0.0953$, $0.9017{\pm}0.1305$ respectively. Autoglazed and overglazed surfaces showed the mean roughness value (Ra) of $0.4217{\pm}0.0685$, $0.3450{\pm}0.0729$. SEM study showed the improved surfaces when subjected for polishing. Plaque accumulation percentage was the highest on roughened surface ($93.83{\pm}6.2552%$), followed by porcelain discs polished by commercial kits. Autoglazed surfaces found to be the best surfaces with the least plaque accumulation ($0.5237{\pm}0.4209%$). CONCLUSION. All the polishing kits used in the study reduced the average roughness by approximately 77%. Corrected porcelain surfaces should ideally be reglazed, alternatively, polish the surfaces before final cementation.

• Design & Manufacturing
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• 제18권2호
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• pp.9-16
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• 2024

Recently, there has been extensive research conducted on the miniaturization of semiconductors and the improvement of their integration to achieve high-quality and high-performance electronic devices. To integrate and miniaturize multiple semiconductors, thin and precise wafers are essential. The backgrinding process, which involves high-precision processing, is necessary to achieve this. The backgrinding system is used to grind and polish the back side of the wafer to reduce its thickness to ㎛ units. This enables the high integration and miniaturization of semiconductors and a flattening process to allow for detailed circuit design, ultimately leading to the production of IC chips. As the backgrinding system performs precision processing at the ㎛ unit, it is crucial to determine the stability of the equipment's rigidity. Additionally, the flatness and surface roughness of the processed wafer must be checked to confirm the processability of the backgrinding system. IIn this paper, the goal is to verify the processability of the back grinding system by analyzing the natural frequency and resonance frequency of the equipment through computer simulation and measuring and analyzing the flatness and surface roughness of wafers processed with backgrinding system. It was confirmed whether processing damage occurred due to vibration during the backgrinding process.

• 한국전기전자재료학회논문지
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• 제18권8호
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• pp.696-701
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• 2005

This paper was investigated the changes of surface properties of high-temperature-vulcanized (HTV) semiconductive silicone rubber due to oxygen plasma discharge. The modifications produced on the silicone rubber surface by oxygen plasma were accessed using Fourier transform infrared spectroscopy(FTIR), X-ray photoelectron spectroscopy(XPS), contact angle and Surface Roughness Tester. The results of the chemical analysis Showed that C-H bonds were broken due to plasma discharge and Silica-like bonds (SiOx, x=$3\~4$) increased. It is thought that the above changes lead to the increase of surface energy of high-temperature-vulcanized (HTV) semiconductive silicone rubber also, Surface roughness was increased with cleavage of side-chains and oxidation process, it confirmed change as the SEM. The micromorphology of surface and hydrophobicity due to plasma discharge based on our results were discussed.

• 한국생산제조학회지
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• 제9권5호
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• pp.165-171
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• 2000

To get smoother ground surface, it is required to replace the grinding wheel with a finer-grit wheel. When the operator replaces the grinding wheel, the balancing and dressing of the wheel surface are necessary. So this replacement has a lot of problems like inconvenience to operators, delays in the operation time, and ineffectiveness in the production process. Therefore, a laminated grinding wheel, which consists of three layers, is provided. The side layers are coarse grits and the middle layer is made up of fine grits. To show the effectiveness of the laminated grinding wheel, experiments on the surface roughness and the material removal rate were performed respectively. As a result, it was found that the grinding process using a laminated grinding wheel can generate smoother ground surface in shorter time.