• Journal of Welding and Joining
• /
• 제16권5호
• /
• pp.108-118
• /
• 1998

This study proposes th analysis and evaluation method of time series ultrasonic signal using the chaos feature extraction for ultrasonic pattern recognition. Features extracted from time series data using the chaos time series signal analyze quantitatively weld defects. For this purpose, analysis objective in this study is fractal dimension and Lyapunov exponent. Trajectory changes in the strange attractor indicated that even same type of defects carried substantial difference in chaosity resulting from distance shifts such as 0.5 and 1.0 skip distance. Such differences in chaosity enables the evaluation of unique features of defects in the weld zone. In quantitative chaos feature extraction, feature values of 4.511 and 0.091 in the case of side hole and 4.539 and 0.115 in the case of vertical hole were proposed on the basis of fractal dimension and Lyapunov exponent. Proposed chaos feature extraction in this study can enhances ultrasonic pattern recognition results from defect signals of weld zone such as side hole and vertical hole.

• Journal of Welding and Joining
• /
• 제16권3호
• /
• pp.64-73
• /
• 1998

This paper is concerned with defects detection and evaluation of heat affected zone (HAZ) in austenitic stainless steel type 304 by ultrasonic wave and neural network. In experiment, the reflected ultrasonic defect signals from artificial defects (side hole, vertical hole, notch) of HAZ appears as beam distance of prove-defect, distance of probe-surface, depth of defect-surface on CRT. For defect classification simulation, neural network system was organized using total results of ultrasonic experiment. The organized neural network system was learned with the accuracy of 99%. Also it could be classified with the accuracy of 80% in side hole, and 100% in vertical hole, 90% in notch about ultrasonic pattern recognition. Simulation results of neural network agree fairly well with results of ultrasonic experiment. Thus were think that the constructed system (ultrasonic wave - neural network) in this work is useful for defects dection and classification such as holes and notches in HAZ of austenitic stainless steel 304.

• 한국세라믹학회지
• /
• 제42권12호
• /
• pp.865-871
• /
• 2005

Submicron thick solid electrolyte membrane is essential to the implementation of low temperature solid oxide fuel cell, and, therefore, development of new electrode structures is necessary for the submicron thick solid electrolyte deposition while providing functions as current collector and fuel transport channel. In this research, a nickel membrane with multi-stage nano hole array has been produced via modified two step replication process. The obtained membrane has practical size of 12mm diameter and $50{\mu}m$ thickness. The multi-stage nature provides 20nm pores on one side and 200nm on the other side. The 20nm side provides catalyst layer and $30\~40\%$ planar porosity was measured. The successful deposition of submicron thick yttria stabilized zirconia membrane on the substrate shows the possibility of achieving a low temperature solid oxide fuel cell.

• The Journal of Korean Physical Therapy
• /
• 제30권6호
• /
• pp.234-238
• /
• 2018

Purpose: Aim of this study was to investigate whether there are ipsilateral motor deficits for visuospatial accuracy and fine movements by making a comparison between stroke patients and healthy subjects. We examined whether ipsilateral motor deficits are influenced by the level of functional movements and muscle strength of the upper and lower extremities of the affected side. Methods: Thirty post-stroke subjects and 20 normal aged matched subjects were recruited. Outcome measures for less-affected side were the tracking task and nine-hole pegboard test. Fugl-Meyer test and motricity index were applied for the measurement of functional movements and muscle strength of affected side. Results: Tracking task and nine-hole pegboard test was significantly different between control and experimental group. In terms of accuracy index according to tracking, the experimental group showed a lower accuracy index in the MCP joint than the control group. However, there were no significant difference relation between the level of motor function of the affected side and the motor deficit level of ipsilateral side. Conclusion: Ipsilateral motor deficits may have significant clinical implications. It needs to be noted that although many patients, families, and medical staff are focused only on motor deficits of the affected side, motor deficits of the sound side can cause difficulties in daily living movements requiring delicate movements. In addition, there was no significant correlation between the level of motor function of the affected side and motor deficits of the sound side.

• 대한기계학회논문집B
• /
• 제26권7호
• /
• pp.927-936
• /
• 2002

An experimental study has been conducted to investigate the heat/mass transfer characteristics within a film cooling hole of square cross-section for various blowing ratios and Reynolds numbers. The experiments have been performed using a naphthalene sublimation method and the flow field has been analyzed by numerical calculation using a commercial code. A duct flow enters into a film cooling hole in a cross-direction. For the film cooling hole with square cross-section, it is observed that the reattachment of separated flow and the vortices within the hole enhance considerably the heat/mass transfer around the hole entrance region. The heat/mass transfer on the leading edge side of hole exit region increases as the blowing ratios decrease because the main flow induces a secondary vortex. Heat/mass transfer patterns within the square film cooling hole are changed little with the various Reynolds numbers.

• 센서학회지
• /
• 제22권2호
• /
• pp.130-135
• /
• 2013

This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time, and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process. The via hole was $100{\mu}m$ in diameter and $400{\mu}m$ in depth. A dielectric layer of $SiO_2$ was formed by thermal oxidation on the front side wafer and via hole side wall. An adhesion layer of Ti and a seed layer of Au were deposited. Soldering process was applied to fill the via holes with solder paste and metal powder. When the solder paste was used as via hole metal line, sintering state and electrical properties were excellent. However, electrical connection was poor due to occurrence of many voids. In the case of metal powder, voids were reduced but sintering state and electrical properties were bad. We tried the via hole filling process by using mixing solder paste and metal powder. As a consequence, it was confirmed that mixing rate of solder paste (4) : metal powder (3) was excellent electrical characteristics.

• 전자공학회논문지A
• /
• 제30A권1호
• /
• pp.16-22
• /
• 1993

A via-hole process for reproducible and reliable GaAs MMIC fabrication is described. The via-hole etching process consists of two step dry etching. During the first etching step a BC $I_{3}$/C $I_{2}$/Ar gas mixure is used to achieve high etch rate and small lateral etching. In the second etching step. CC $L_{2}$ $F_{2}$ gas is used to achieve selective etching of the GaAs substrate with respect to the front side metal layer. Via holes are formed from the backside of a 100$\mu$m thick GaAs substrate that has been evaporated initially with 500.angs. thick chromium and subsequently a 2000.angs. thick gold layer. The fabricated via holes are electroplated with gold (~20$\mu$m thick) to form via connections. The results show that established via-hole process is satisfactory for GaAs MMIC fabrication.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2007년도 제38회 하계학술대회
• /
• pp.284-285
• /
• 2007

In this paper, we present the effect on a novel transmission line filter response by the etch hole position on the suspended ground and the residue on the resonator under ground plane. We defined the etch hole offset as the distance from the sidewall of the suspended ground to the nearest side of the etch holes. We simulated new filter responses to reflect the real value of the changed etch hole offset caused by characteristics of negative photoresist. Return loss is distorted by the residue on the center conductor remained after sacrificial layer removing. By comparison of simulation and measurements, we concluded the residue on the resonator distorted the RF response worse than etch hole offset variation did.

• 한국광학회:학술대회논문집
• /
• 한국광학회 2008년도 하계학술발표회 논문집
• /
• pp.405-406
• /
• 2008

In this paper, we will discuss the spectral characteristics of fiber Bragg gratings (FBGs) inscribed in two different types of polarization-maintaining fibers with side holes. One showed high signal-to-noise ratio (SNR), narrow bandwidth and high bending sensitivity, while the other one showed insensitivity to bending due to the small size of the side holes.

• 한국유체기계학회 논문집
• /
• 제17권6호
• /
• pp.52-58
• /
• 2014

In the present work, design optimization of film-cooling hole array on the pressure side of high pressure turbine nozzle was conducted. There are four rows of fan-shaped film cooling holes on the nozzle pressure side surface and each row has a straight array of holes in the spanwise direction for baseline model. For design optimization, hole distributions in streamwise and spanwise directions for three rows of holes except first row are parameterized as a 2nd-order shape function. Three-dimensional compressible RANS equations are used for flow and thermal analysis around the nozzle surface and optimization technique using Design of Experiment, Kriging surrogate model and Genetic Algorithm is used. The results shows that averaged adiabatic wall temperature at the whole nozzle surface decreases about 2.7% and averaged film cooling effectiveness at the pressure side of nozzle increased about 8.2%.