• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.369.2-369.2
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• 2014

Diamond-like Carbon(DLC) films doping Si were deposited by linear ion source(LIS)-physical vapor deposition method on Si wafer. We have studied the effects of Si content on friction and wear properties of DLC films and the characteristics of the films were investigated using Nano-indentation, Micro raman spectroscopy, Field Emission-Scanning Electron Microscope (FM-SEM) and X-ray Photoelectron Spectroscopy (XPS). The films has been various low-friction and low-stress by varying the flow rates of silane gas. Under the about 2% of Si doping is very suitable for improving the adhesion of films and reducing internal stress while maintaining the surfaces hardness of DLC films. Linear ion source (LIS)를 사용하여 Si wafer위에 Si 이온이 첨가된 DLC 박막을 증착하였다. 참가된Si 이온의 양에 따라 DLC 박막에 미치는 영향을 분석하기 위하여 마찰 계수 및 경도를 비교하였고, Micro raman spectroscopy, Field Emission-Scanning Electron Microscope (FM-SEM) and X-ray Photoelectron Spectroscopy (XPS)를 통하여 표면 상태를 분석하였다. 천체 주입된 가스량의 약 2%까지 Si 이온 주입이 늘어날수록 DLC 박막의 마찰계수는 낮아졌고, 경도는 Si 이온이 주입되지 않았을 경우와 비슷한 값(약 20~23 GPa)을 가졌다. 2% 이상의 주입량에서는 마찰계수는 주입량이 늘어날수록 높아졌으며 경도는 떨어지는 경향을 보였다. 이는 Si이온이 2%이하로 첨가되었을 경우, DLC 박막의 생성시 탄소 이온들의 결합 Stress를 줄여 마찰계수가 줄어든다고 볼 수 있으며, 그 양이 2%이상이 되면 오히려 불순물로 작용하여 DLC 박막의 Stress는 급격히 증가하고 마찰계수도 높아짐을 알 수 있다.

• Korean Journal of Crystallography
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• v.3 no.2
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• pp.98-110
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• 1992

B-SiC thin films were fabricated on Si(100) substrate under 1 atom by fVD. The effects of deposition conditions on the growth and the properties especially crystallinity and prefer ential alignment of these thin films were investigated. SiH4 and CH4 were used as source gases and H2 as Carrier gas. Th9 growth Of B-SiC thin films with changing parameters such as the growth temperature, the ratio of source gases (SiH4/CH4 ) and the total amount of source gases. The grown thin films were characterized by using SEM, a -step, XRD, Raman Spectro- scopy and TEM. Chemical conversion process improved the quality of thin films due to the formation of SiC buffer layer. The crystallinity of SiC thin films was improved when the growth temperature was higher than l150t and the amount of CH4 exceeded that of SiH4. The better crystallinity, the better alignment to the crystalline direction of substates. TEM analyses of the good quality thin films showed that the grain size was bigger at the surface than at the interface and the defect density is not depend on the ratio of the source gases.

• Journal of the Korean Society of Radiology
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• v.12 no.1
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• pp.101-106
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• 2018

Multilayer mirrors have widely been used for monochromatization of X-ray with high reflection efficiency. The reflected X-ray energy or wavelength is determined by the d-spacing of a multilayer mirror and the incidence angle. The reflectivity critically depends on the number of bilayers and surface roughness on each interface. The multilayer mirror has a structure of alternative deposition of high and low Z-elements on the substrate. Each interface should be considered in the calculation of reflectivity. In this paper, we examine the degradation of reflectivity by the inter-diffusion combined with surface roughness on each interface for a W/Si multilayer mirror. In the depth-graded W/Si multilayer mirror, the FWHMs for angle and energy were larger than them of the uniform multilayer mirror. Inter-diffusion considerable gave rise to the degradation of reflectivity. To obtain measured reflectivity closed to the expected reflectivity, the inter-diffusion on W-Si and Si-W interfaces should be considered.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.189-189
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• 2011

CrZrN 박막은 CrN 박막에 비해서 향상된 기계적 특성과 우수한 표면 조도특성을 가지고 있다. 그러나 $500^{\circ}C$ 이상에서 기계적 특성이 급격히 감소하는 현상이 알려져 있다. 본 연구에서는 CrZrN 박막에 Si를 첨가하여 Si 함량에 따른 고온에서의 기계적 특성을 CrZrN 박막과 비교하였다. $500^{\circ}C$에서 마모 실험한 결과 CrZrN 박막에 비하여 소량의 Si의 첨가만으로 고온에서의 마모 특성이 향상되는 것을 확인하였다. 이것은 Si 첨가에 따라 고온에서 안정한 비정질상의 형성 영향으로 판단된다.

• Journal of the Korean Vacuum Society
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• v.8 no.1
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• pp.31-35
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• 1999

In this paper, the lifetime dependence as a function of the line length of Al-1%Si thin film interconnections due to electromigration in semiconductor devices was studied. Al-1%Si thin film interconnections with a pattern of straight type were formed by using a standard photolithography process. The test patterns manufactured have line lengths in the range of 100 to 1600 $mu extrm{m}$. Al-1%Si thin film interconnections with Ti underlayers showed longer lifetime than those without Ti underlayers. Ti underlayers are believed to improve electromigration resistance resulting in a longer lifetime in Al-1%Si thin film interconnections. The dependence of lifetime on the line length in Al-1%Si/Ti thin film interconnections shows a saturation tendency near 800 $\mu\textrm{m}$ line length.

• Journal of the Korean Magnetics Society
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• v.9 no.6
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• pp.306-311
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• 1999

$La_{2/3}Sr_{1/3}MnO_3(LSMO)/YSZ/SiO_2/Si(100)$ polycrystalline thin films were fabricated be chelated sol-gel method The effect of YSZ buffer layer at low field (120 Oe) spin-polarized tunneling magnetotransport (TMR) properties of LSMO thin film was studied at room temperature. Single perovskite LSMO thin films was obtained. The maximum TMR ratio was increased from 0.2 to 0.42 % by the insertion of YSZ buffer. YSZ as diffusion barrier was attributed to the fine microstructure of LSMO thin films and the reduction of dead layer between LSMO and $SiO_2/Si(100)$ interfaces.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.97.2-97.2
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• 2010

유리기판을 이용하여 제조되는 미세 결정질 실리콘 박막 태양전지에서 진성 반도체층(i ${\mu}c$-Si:H layer, i층)은 태양전지의 광 흡수층으로 사용되기 때문에 그 특성은 매우 중요하다. 특히, i층의 결정분율 변화는 태양광의 흡수파장 및 효율을 결정하여 준다. 본 연구에서는 i층 증착시 $SiH_4$ 가스의 농도 변화 및 $SiH_4$ 가스 profiling을 통하여 i층의 결정분율을 변화하였으며, 이에 따른 i층 단위박막과 미세결정질 태양전지 특성변화를 분석 하였다. i층의 $SiH_4$ 가스 농도가 증가함에 따라 i층 단위박막의 결정분율은 증가하였으며, 전기 전도도는 감소하였다. 또한, i층의 $SiH_4$ 가스 농도를 점차 증가하며 profiling 하여 증착한 박막은 동일 가스 농도로 증착한 박막보다 전기 전도도가 감소하였고, 증착속도는 증가하였다. 이와 같은 다양한 i층들은 'Raman spectroscopy'를 통하여 결정분율 변화를 측정하였다. 또한, 이 박막들을 광 흡수층으로 사용하는 미세결정질 태양전지를 제조하고, 태양전지의 효율, 양자효율, 암전류 특성들을 단위박막 특성과 연계하여 분석하였다.

• Journal of the Korean Vacuum Society
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• v.2 no.3
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• pp.374-383
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• 1993

필라멘트와 Si 기판 사이의 기전력을 20, 80, 140, 200V로 증가시키면서 EACVD에 의하여 성장된 다이아몬드 박막에 대하여 다이아몬드/Si 계면분석 및 계면강도를 측정하였다. 주사형전자현미경(SEM), 고분해능투과형전자현미경(HRTEM), 오제이전자분석기(AES)에 의해 계면상태를 분석한 결과, 기전력 증가에 따라 활성탄화수소 이온(CmHn-)에너지가 증가되어져 CmHn-이 Siso로 침투(Impringement)가 증가되고 침투된 높은 에너지의 CmHn-이 Si과 화학결합하여 생성되는 SiC층 깊이 및 농도 분포도 증가된다. 풀 시험(Pull test)에 의한 계면강도 측정 결과, SiC층 깊이 및 농도분포가 증가할수록 계면강도가 증가하였다. 관찰된 파면과 파면의 X-선 메핑 결과 및 HRTEM과 AES에 의한 분석 결과, 기전력 증가에 따라 공극율이 적고 치밀한 다이아몬드 박막이 성장된다. 그리고 생성되는 SiC층 농도 및 깊이 분포가 증가함에 따라 다이아몬드/Si 계면이 강화되고, 상대적으로 파괴는 다이아몬드/Si 계면이 아닌 SiC층이나 Si 내부에서 발생된다. 결국, 기전력을 증가하여 활성탄화수소이온의 에너지를 증가함으로써 계면강도가 우수하며 공극율이 매우 적고 치밀한 다이아몬드 박막을 성장할 수 있다.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.1
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• pp.31-37
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• 1999

In this study, the thermal property and adhesion of the electroless-deposited Cu thin film were investigated. The multilayered structure of Cu /TaN /Si was fabricated by electroless-depositing the Cu thin layer on the TaN diffusion barrier which was deposited by MOCVD on the Si substrate. The thermal stability was investigated by measuring the resistivity as post-annealing temperature for the multilayered Cu /TaN /Si specimen which was annealed at atmospheres of $H_2$and Ar gases, respectively. The adhesion strength of Cu films was evaluated by the scratch test. The adhesion of the electroless-deposited Cu film was compared with other deposition methods of thermal evaporation and sputtering. The scratch test showed that the adhesion of electroless plated Cu film on TaN was better than that of sputtered Cu film and evaporated Cu film.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.6
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• pp.283-287
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• 2002

We have studied Zr(Si)N film as a diffusion barrier between Cu metal and Si substrate for application of interconnection metal in ULSI circuits. Zr(Si)N film was deposited with reactive DC magnetron sputtering system using $Ar/N_2$mixed gas. The value of the resistivity was the lowest for the ZrN film using 29 : 1 of Ar : $N_2$reactant gas ratio at room temperature and decreased with increasing of Si substrate temperature. As the value of ZrN film resistivity was decreased, the direction of crystal growth was toward to (002) plane. The barrier property of ZrN film added with Si was improved. But Si was added too much in ZrN film, the barrier property was degraded. The adhesive property was improved with increasing of Si in ZrN. For the analysis of the film, XRD, Optical microscopy, Scretch tester, so on were used.