• Title/Summary/Keyword: SiO gas

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Effect of Substrate Temperature and Growth Duration on Palladium Oxide Nanostructures (팔라듐 옥사이드 나노구조물의 성장에서 기판 온도와 성장 시간의 효과)

  • Kim, Jong-Il;Kim, Ki-Chul
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.20 no.4
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    • pp.458-463
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    • 2019
  • Palladium (Pd) is widely used as a catalyst and noxious gas sensing materials. Especially, various researches of Pd based hydrogen gas sensor have been studied due to the noble property, Pd can be adsorbed hydrogen up to 900 times its own volume. In this study, palladium oxide (PdO) nanostructures were grown on Si substrate ($SiO_2(300nm)/Si$) for 3 to 5 hours at $230^{\circ}C{\sim}440^{\circ}C$ using thermal chemical vapor deposition system. Pd powder (source material) was vaporized at $950^{\circ}C$ and high purity Ar gas (carrier gas) was flown with the 200 sccm. The surface morphology of as-grown PdO nanostructures were characterized by field-emission scanning electron microscopy(FE-SEM). The crystallographic properties were confirmed by Raman spectroscopy. As the results, the as-grown nanostructures exhibit PdO phase. The nano-cube structures of PdO were synthesized at specific substrate temperatures and specific growth duration. Especially, PdO nano-cube structrures were uniformly grown at $370^{\circ}C$ for growth duration of 5 hours. The PdO nano-cube structures are attributed to vapor-liquid-solid process. The nano-cube structures of PdO on graphene nanosheet can be applied to fabricate of high sensitivity hydrogen gas sensor.

APPLICATIN OF $CF_4$ PLASMA ETCHING TO $Ta_{0.5}Al_{0.5}$ ALLOY THIN FILM

  • Shin, Seung-Ho;Na, Kyung-Won;Kim, Seong-Jin;Chung, Yong-Sun;Auh, Keun-Ho
    • Proceedings of the Korea Association of Crystal Growth Conference
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    • 1998.09a
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    • pp.85-90
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    • 1998
  • Reactive ion etching (RIE) of Ta-Al alloy thin film and SiO2 thin films was observed during the etching with the CF4 gas and the could be used effectively to etch the Ta-Al alloy thin film. The etching rate of the thin film at a Ta content of 50 mol% was about 67$\AA$/min. No selectivity between the Ta-Al alloy thin film and SiO2 thin films was observed during the etching with the CF4 gas and the etching rate of the SiO2 layer was 12 times faster than that of the Ta-Al alloy thin film. In addition, it was observed that photoresist of AZ5214 was more useful than Shiepley 1400-2 in RIE with the CF4 gas.

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A Study on the mechanism of $SiO_2$ film deposition by Laser CVD (레이져 CVD에 의한 $SiO_2$막의 형성기구 모델링에 관한 연구)

  • Ryoo, Ji-Ho;So, Hwang-Young;Kim, Young-Hoon;Sung, Yung-Kwon
    • Proceedings of the KIEE Conference
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    • 1995.07c
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    • pp.1149-1151
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    • 1995
  • In order to examine the deposition mechanism for $SiO_2$ by ArF(193nm) excimer Laser using $Si_2H_6$ and $N_2O$ gas mixture, deposition rate and refractive index were measured and creative modeling on film deposition was established by suggesting now precursor and film growing mechanism.

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A properties and the fabrication of ZnO-Si system CO gas sensor with low power consumption (절전형 ZnO-Si계 CO 가스 센서 제작과 그 특성)

  • Yi, S.H.;Hung, H.K.;Kim, J.K.;Chang, B.H.;Sung, Y.K.
    • Proceedings of the KIEE Conference
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    • 1997.11a
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    • pp.324-326
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    • 1997
  • Low power ZnO-Si gas sensor below 500 mW at operating temperature has been fabricated by using micromachining technique. I-V measurement shows the power consumption of 260 mW at $400^{\circ}C$ The sensitivity of the sensor was 45 percent at operating temperature of $350^{\circ}C$(230 mW) with 1,000 ppm CO gas atmosphere. The response and the recovery time found out to be 94 sec and 180 sec, respectively, when CO gas was used. In order to measure the exact temperature of the gas sensing layer, Pt/Cr bilayer-RTD was used in this experiment.

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Optical Properties of Transparent Electrode ZnO Thin Film Grown on Carbon Doped Silicon Oxide Film (탄소주입 실리콘 산화막 위에 성장한 투명전극 ZnO 박막의 광학적 특성)

  • Oh, Teresa
    • Journal of the Semiconductor & Display Technology
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    • v.11 no.2
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    • pp.13-16
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    • 2012
  • Zinc oxide (ZnO) films were deposited by an RF magnetron sputtering system with the RF power of 200W and 300W and flow rate of oxygen gases of 20 and 30 sccm, in order to research the growth of ZnO on carbon doped silicon oxide (SiOC) thin film. The reflectance of SiOC film on Si film deposited by the sputtering decreased with increasing the oxygen flow rate in the range of long wavelength. In comparison between ZnO/Si and ZnO/SiOC/Si thin film, the reflectance of ZnO/SiOC/Si film was inversed that of ZnO/Si film in the rage of 200~1000 nm. The transmittance of ZnO film increased with increasing the oxygen gas flow rate because of the transition from conduction band to oxygen interstitial band due to the oxygen interstitial (Oi) sites. The low reflectance and the high transmittance of ZnO film was suitable properties to use for the front electrode in the display or solar cell.

Synthesis and Application of Nanoparticulate Aluminosilicate Sols (II) Mixed Al_2O_3-SiO_2$ Sols (극미세 입자 Aluminosilicate계 졸의 합성 및 응용 (II) Al_2O_3-SiO_2$계 혼합졸)

  • 현상훈;김승구;이성철
    • Journal of the Korean Ceramic Society
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    • v.32 no.1
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    • pp.63-70
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    • 1995
  • A crack-free ceramic composite membrane with micropores has been synthesized by the pressurized sol-gel coating technique using the mixed Al2O3-SiO2 sols. The mixed sols were prepared by mixing nanoparticulate SiO2 and boehmite sols. These sols were more stable at lower pH, but very unstable when their copositions were in the range of 50~75mol% of SiO2 at the same pH. The mixed Al2O3-SiO2 membrane prepared from the mixed sol (0.2mol/$\ell$ of solid content and pH=2) containing 40mol% of SiO2 had the mean pore radius of 0.80nm and the specific surface area of 280$m^2$/g. The nitrogen permeability through the coated Al2O3-SiO2 layer was 42$\times$107mol/$m^2$.s.Pa. It was found that the thermal stability of aluminosilicate membranes, even through similar to that of SiO2 membranes, was much improved in comparison with ${\gamma}$-alumina membranes.

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High-temperature Corrosion of CrAlSiN Films in Ar/1%SO2 Gas

  • Lee, Dong Bok;Xiao, Xiao;Hahn, Junhee;Son, Sewon;Yuke, Shi
    • Journal of the Korean institute of surface engineering
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    • v.52 no.5
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    • pp.246-250
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    • 2019
  • Nano-multilayered $Cr_{25.2}Al_{19.5}Si_{4.7}N_{50.5}$ films were deposited on the steel substrate by cathodic arc plasma deposition. They were corroded at $900^{\circ}C$ in $Ar/1%SO_2$ gas in order to study their corrosion behavior in sulfidizing/oxidizing environments. Despite the presence of sulfur in the gaseous environment, the corrosion was governed by oxidation, leading to formation of protective oxides such as $Cr_2O_3$ and ${\alpha}-Al_2O_3$, where Si was dissolved. Iron diffused outward from the substrate to the film surface, and oxidized to $Fe_2O_3$ and $Fe_3O_4$. The films were corrosion-resistant up to 150 h owing to the formation of thin ($Cr_2O_3$ and/or ${\alpha}-Al_2O_3$)-rich oxide layers. However, they failed when corroded at $900^{\circ}C$ for 300 h, resulting in the formation of layered oxide scales due to not only outward diffusion of Cr, Al, Si, Fe and N, but also inward movement of sulfur and oxygen.

A Study on Selective Epitaxial Growth using Disilane and Hydrogen gas in Low Pressure chemical vapor deposition ($Si_{2}H_{6}$$H_2$ Gas를 이용한 LPCVD 내에서의 선택적 Epitaxy 성장에 관한 연구)

  • 손용훈;김상훈;박성계;남승의;김형준
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.11a
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    • pp.471-475
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    • 2000
  • P-type (100) Si wafer patterned with 1000$\AA$ SiO$_2$island was used as substrate and the Si films were deposited under low pressure using Si$_2$H$_{6}$-H$_2$gas mixture where the total gas flow rate and deposition pressure were 16.6sccm and 3.5mtorr, respectively. In this condition, we selectively obtained high-quality epitaxial Si layer of the 350~1050$\AA$ thickness. In order to extend the incubation period, we kept high pressure H$_2$ environment without Si$_2$H$_{6}$ gas for few minutes after first incubation period and then we conformed the existence of second incubation period.iod.

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Improvement of the adhesion and resistivity of low-pressure chemical vapor deposited tungsten films by controlling deposition parameters (LPCVD로 증착한 텅스텐 박막의 증착 조건 제어에 의한 접착성 및 저항 특성 향상)

  • 노관종;윤선필;윤영수;노용한
    • Journal of the Korean Vacuum Society
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    • v.9 no.4
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    • pp.321-327
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    • 2000
  • Tungsten(W) thin films with good adhesion property and low resistivity (~10 $\mu$\Omega$$.cm) were deposited directly on $SiO_2$ by LPCVD. The adhesion property of W thin films on $SiO_2$ improves as the temperature and/or $SiH_4/WF_6$ gas ratio increase. Specifically tungsten thin films could be deposited on $SiO_2$ even at $350^{\circ}C$ if the gas ratio of 2 was employed. The resistivity of tungsten thin films deposited at $350^{\circ}C$ was high due to the presence of $\beta$-W. However, the resistivity can be minimized by increasing the amount of $H_2$ gas flow. Therefore, it is shown in this work that the adhesion of tungsten thin films on $SiO_2$ can be improved simply by controlling the process parameters (e.g., temperature, gas ratio and $H_2$ flow rate) without employing complex deposition methods or additional glue layers.

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Crystallization and Optical Properties of Transparent AZO Thin Films (AZO 투명전극의 결정성과 광학적 특성)

  • Oh, Teresa
    • Journal of the Korean Vacuum Society
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    • v.21 no.4
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    • pp.212-218
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    • 2012
  • The optical properties of AZO thin films prepared by the RF mangnetron sputtering system was studied to research the dependance of chemical properties of substrate. The substrate was the SiOC film deposited by Inductively coupled plasma chemical vapor deposition with various gas flow rate of $O_2$ and Ar (DMDMOS). In accordance with the increase of Ar gas flow rates, the Si-O bond in the SiOC film increased and then progressed the amorphism. The roughness of AZO grown on SiOC film with high degree of amorphism decreased and then improved the flatness of surfaces. Moreover, the ultra violet emission with high intensity was spontaneously induced in the AZO film growed on SiOC film with high degree of amorphism.