• Journal of Powder Materials
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• v.1 no.1
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• pp.42-51
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• 1994

6061Al-SiCP metal matrix composite materials(MMCs) were fabricated by injecting SiCP particles directly into the atomized spray. The main attraction of this technique is the rapid fabrication of semi-finished, composite products in a combined atomization, particulate injection(10 $\mu\textrm{m}$, 40 $\mu\textrm{m}$, SiCP) and deposition operation. Conclusions obtained are as follows; The microstructure of the unreinforced spray formed 6061Al alloy consisted of relatively fine(50 $\mu\textrm{m}$) equiaxed grains. By comparision, the microstructure of the I/M materials was segregated and consisted of relatively coarse(150 $\mu\textrm{m}$) grains. The probability of clustering of SiCP particles in co-sprayed metal matrix composites increased it ceramic particle size(SiCP) was reduced and the volume fraction was held constant. Analysis of overspray powders collected from the spray atomization and deposition experiments indicated that morphology of powders were nearly spherical and degree of powders sphercity was deviated due to composite with SiCp particles. Interfacial bonding between matrix and ceramics was improved by heat treatment and addition of alloying elements(Mg). Maximum hardness values [Hv: 165 kg/mm2 for Al-10 $\mu\textrm{m}$ SiCp Hv--159 kg/mm2 for Al-40 $\mu\textrm{m}$SiCp] were obtained through the solution heat treatment at $530^{\circ}C$ for 2 hrs and aging at $178^{\circ}C$, and there by the resistance were improved.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.190-194
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• 2000

The fabrication process and thermal properties of 50∼76vo1% SiCp/Al metal matrix composites (MMCs) were investigated. The 50∼76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85∼170W/mK and coefficient of thermal expansion (CTE) were ranged 10∼6ppm/K. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged l15∼156W/mK and 6∼7ppm/K, respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.58-62
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• 2000

The fabrication process and analysis of thermal properties of 50~76vo1% SiCp/Al metal matrix composites(MMCs) for heatsink materials in electronic packaging were investigated. The 50~76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85~170W/mK and coefficient of thermal expansion(CTE) were ranged 10~6ppm1k. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged 115~156W/mK and 6~7ppm/K. respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.69-72
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• 2002

The high temperature deformation behavior of SiCp/2124Al composite and 2124Al alloy was investigated by hot compression test in a temperature ranged $400~475^{\circ}C$ over a strain rate ranged $10^{-3}~1s^{-1}$. The billets of 2124Al alloy and SiCp/2124Al composite were fabricated by vacuum hot pressing process. The stress-strain curve during high temperature deformation exhibited a peak stress, and then the flow stress decreased gradually into a steady state stress with increasing the strain. It was found that the flow-softening behavior was attributed to the dynamic recovery, local dynamic recrystallization and dynamic precipitation during the deformation. The precipitation phases were identified as S' and S by TEM diffraction pattern. Base on the TEM inspection, the relationship between the Z-H parameter and subgrain size was found based on the experiment data. The dependence of flow stress on temperature and strain rate could be formulated well by a hyperbolic-sinusoidal relationship using the Zener-Hollomon parameter.

• Korean Journal of Materials Research
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• v.11 no.7
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• pp.590-598
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• 2001

SiCp/pure Al and SiCp/2024Al MMCs were fabricated by in-situ VHP process designed specially just in this study which is composed of the vacuum hot press at range from R.T. to $500^{\circ}C$ and the continuous extrusion without canning process at $520^{\circ}C$. It was investigated the effect of SiC particle size, volume fraction and extrusion ratio on the tensile properties and micro structure in auf composites. In case of the 10:1 extrusion ratio, but SiCp/pure Al and SiCp/2024Al composites were shown a sound appearance and a good micro structure without crack of SiCp as well as uniform distribution of SiCp. However, in case of the 16:1 extrusion ratio, the number of cracked SiC particles more than increased in a higher volume fraction composite and 2024Al matrix composite compared with pure Al matrix one. The tensile strength of the composites reinforced smaller SiCp was higher than that of the bigger SiCp reinforced in same volume fraction and extrusion ratio.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.03a
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• pp.81-84
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• 1997

The hot deformation behavior of SiCp/AA2024 composites reinforced with different sizes of SiCp reinforcements (1, 8, 15, 36, and 44${\mu}{\textrm}{m}$) was investigated by hot torsion tests. The hot restoration of the composites depending on the SiCp reinforcements particle size was studied from the effective stress - strain curves. Dynamic recrystallization (DRX) was occurred in the SiCp/AA2024 composites during the hot deformation at 320 - 43$0^{\circ}C$ under a strain rate of 1.0/sec. Also, the critical strain for DRX decreased with decreasing the reinforcement size of SiCp from 44 to 8${\mu}{\textrm}{m}$. The composite reinforced with SiCp of 8${\mu}{\textrm}{m}$ showed the highest flow stress (265 MPa) and the work hardening rate at 32$0^{\circ}C$ under a strain rate of 1.0/sec.

• Journal of Korea Foundry Society
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• v.21 no.1
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• pp.7-14
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• 2001

The research on new DRA(discontinuous reinforced alloy) and CRA(continous reinforced alloy) composites has been carried out to improve the properties of ceramic fiber and particle reinforced metal matrix composites(MMCs). Effects of alloying elements and aging conditions on the microstructures and aging behavior of Al-Si-Cu-Mg-(Ni)-SiCp composite have been examined. The specimens used in this study were manufactured by duplex process. The first squeeze casting is the process to make precomposite and the second squeeze casting is the process to make final composite. The hardening behavior was accelerated with decreasing the size of SiCp particle in the composites. It is considered that the dislocation density increased with increasing SiCp size, due to the different thermal deformation between Al matrix and SiCp during quenching after the solution treatment. Peak aging time to obtain the maximum hardness in 3 ${\mu}m$ SiCp reinforced Al composite was reduced than that in large size(5, 10 ${\mu}m$) of SiCp because of difference in dislocation density. Aging hardening responce(${\Delta}H$ = $H_{Max}.-H_{S.T}$) of composites was greater than that of unreinforced Al alloy because of higher density of second phases in matrix.

• Korean Journal of Materials Research
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• v.6 no.2
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• pp.210-220
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• 1996

The purpose of this study is to develop the processing techniques of Fiber Reinforced Metal by Liquid Phase Diffusion Bonding method with SiC fiber as a reinforcing material and CP Ti(Commercial Pure) as a matrix. The microstructure and the distribution of elements in reaction and CP Ti(Commercial Pure) as a matrix. The microstructure and the distribution of elements is reaction zone among CP Ti/Ti-15wt%Cu-20wt%Ni(TCN20)/SiC long fiber were investigated by Optical Microscope, SEM/EDX, EPMA, X-ray and AES. The results obtained in this study are as follows. 1) When Ti matrix composite materials are fabricated under the bonding condition of 1273Kx1200sec, the SiC long fiber was the most suitable reinforcing material for Ti matrix composite materials. 2) With SiC long fiber under same condition, a TiC layer(1.0-1.6$\mu\textrm{m}$) was observed on the surface of SiC long fiber. 3) Liquid Phase Diffusion Bonding has shown the feasibility of production of Ti matrix composite materials.

• Composites Research
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• v.15 no.3
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• pp.1-10
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• 2002

The effect of size of SiC particles and additive Mg content on the mechanical properties and wear characteristics were investigated for the SiCp/AC8A composites fabricated by pressureless infiltration process. Results showed that the hardness and the bending strength increased with decreasing the size of SiC particle. By increasing the Mg content the hardness of SiCp/AC8A composites increased due to the hard reaction products, however the bending strength decreased by formation of coarse precipitates and high porosity level. The SiCp/AC8A composites exhibited about 6 times higher wear resistance compared with AC8A alloy at high sliding velocity and as increasing the particle size, wear resistance was improved. The major wear mechanical of SiCp/AC8A composites exhibited the abrasive wear at low to high sliding velocity whereas AC8A alloy showed adhesive and melt wear at high sliding velocity.

• Journal of Korea Foundry Society
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• v.10 no.4
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• pp.309-315
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• 1990

Aluminum alloy matrix composites reinforced by SiC particles were prepared by rheocompocasting, a process which consists of the incoporation and distribution of reinforcement by stirring within a semi-solid alloy. When the volume fraction of SiCp and stirring speed were fixed, the dispersion of SiCp in Al-matrix alloy depended on stirring time and solid volume fraction in slurry. The results were as follows : 1) As a dispersed SiCp during stirring at $647^{\circ}C$ in 6063-Al alloy, SiC was better dispersed than that other temperature, where solid volume fraction was 43% in slurry. 2) When increased solid fraction in slurry, rate of dispersing SiC increased during stirring and porosities decreased in matrix alloy after casting. 3) Inspite of stirring with 800rpm, since solid particles of matrix alloy in slurry joined each other and occured joining growth, so that SiC was not dispersed into solid particle.