• Journal of Korean Vacuum Science & Technology
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• v.2 no.1
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• pp.25-31
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• 1998

The reliability of fluorine doped silicon oxide (SiOF) films for intermetal dielectrics in multilevel interconnections of ultra-large scale integrated circuits (ULSIs) is investigated. SiOF films were deposited by electron cyclotron resonance plasma-enhanced chemical vapor deposition (ECRPECVD) using H-free source gases, i.e., SiF4 and O2. The effect of post plasma treatment on the moisture absorption and dielectric properties of SiOF films was carried out I terms of air exposure time, The reliability test of Cu/TiN/SiOF/Fi specimen was carried out in terms of temperature by rapid thermal annealing (RTA) in N2 ambient. After O2 plasma treatment,, no appreciable peak directly related to moisture absorption was detected. The capacitance-voltage (C-V) characteristics of the O2 plasma treated SiOF film showed that the film remained to hold the sound dielectric properties even after boiling treatment. The Cu/TiN/SiOF/Si system was found to be reliable up to $600^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.274-274
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• 2008

This paper describes on the fabrication and characteristics of a 3C-SiC (Silicon Carbide) micro pressure sensor for harsh environment applications. The implemented micro pressure sensor used 3C-SiC thin-films heteroepitaxially grown on SOI (Si-on-insulator) structures. This sensor takes advantages of the good mechanical properties of Si as diaphragms fabricated by D-RIE technology and temperature properties of 3C-SiC piezoresistors. The fabricated pressure sensors were tasted at temperature up to $250^{\circ}C$ and indicated a sensitivity of 0.46 mV/V*bar at room temperature and 0.28 mV/V*bar at $250^{\circ}C$. The fabricated 3C-SiC/SOI pressure sensor presents a high-sensitivity and excellent temperature stability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.1084-1087
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• 2001

The (Sr$\sub$0.85/Ca$\sub$0.15/)TiO$_3$(SCT) thin films are deposited on Pt-coated electrode(Pt/TiN/SiO$_2$/Si) using RF sputtering method. The crystallinity of SCT thin films is increased with increase of substrate temperature in the temperature range of 100[$^{\circ}C$]∼500[$^{\circ}C$]. Also, the crystallinity of SCT thin films are obtained at the substrate temperature above 400[$^{\circ}C$]. SCT thin films had (111) preferred orientation. The dielectric constant changes almost linearly in temperature ranges of-80∼+90[$^{\circ}C$]. The temperature properties of the dielectric loss have a stable value within 0.1. SCT thin films used in this study show the phenomena of dielectric relaxation with the increase of frequency, and the relaxation frequency is observed above 200[kHz].

• Journal of Sensor Science and Technology
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• v.13 no.4
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• pp.282-286
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• 2004

${\alpha}-Fe_{2}O_{3}$ films were prepared by ultrasonic spray pyrolysis (USP) on $SiO_{2}$ coated Si wafers using iron acetylacetonate as an iron precursor. The crystallographic properties and surface morphologies of the films were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM), respectively. X-ray photoelectron spectroscopy (XPS) was carried out to determine the Fe oxidation states. In order to observe stability of the films to temperature, the resistance variation of the films with an ambient temperature was measured. The effects of substrate temperature on the structural and electrical properties of the ${\alpha}-Fe_{2}O_{3}$ films were studied. The films were densified from the substrate temperature of $350^{\circ}C$. The grain size of the films grown at $400^{\circ}C$ was shown to be increased abruptly comparing with that of $350^{\circ}C$. The films showed a low resistance variation between the ambient temperature of $300^{\circ}C$ and $350^{\circ}C$.

• Journal of the Korean Ceramic Society
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• v.44 no.7
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• pp.375-380
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• 2007

Tribological properties of carbon layers produced by high temperature chlorination of SiC ceramic and DLC (diamond-like carbon) coatings produced by ion plating method were investigated and compared. Carbon coatings were produced by exposure of ball and disc type SiC in chlorine and hydrogen gas mixtures at $1200^{\circ}C$. After treatment for 10 h, dense carbon films up to $180{\mu}m$ in thickness were formed. Tribological behavior of newly developed carbon films were compared with that of DLC films. Wear resistance and frictional coefficient of the surface modified ball and disc type SiC were significantly improved compared to an untreated SiC specimen, and also the modified carbon layer had better performance than DLC coatings. Therefore, in this study, the newly developed carbon films have several advantages over existing carbon coatings such as DLC coatings and showed superior tribological performances.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.546-546
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• 2013

Zinc silicate ($Zn_2SiO_4$) has been identified as a suitable host material for a wide variety of luminescent activators, such as transition metal and rare earth elements. In particular, manganese-activated $Zn_2SiO_4$ exhibits highly efficient photoluminescenceand cathodoluminescence, which allows this material to be used in fluorescent lamps and display applications. In this study, we investigated the green and yellow luminescence from Mn-doped $Zn_2SiO_4$ thin films that were synthesized using radio frequency magnetron sputtering followed by annealing at $600{\sim}1,200^{\circ}C$ The refractive index of the $Zn_2SiO_4$: Mn films showed normal dispersion behavior. It was found that the $Zn_2SiO_4$: Mn films annealed at $800^{\circ}C$ ossessed a mixture of alpha and beta phases. The obtained photoluminescence spectrum consisted of two emission bands centered at 525 nm in the green range and 574 nm in the yellow range. The green luminescence originates from the divalent Mn ions in alpha phase of $Zn_2SiO_4$, while the yellow luminescence comes from the divalent Mn ions in beta phase. The films annealed at and above $900^{\circ}C$ xhibited only the alpha phase. The broad PL excitation band was observed ranging from 220 to 300 nm with a maximum at around 243 nm.

• Journal of Sensor Science and Technology
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• v.5 no.1
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• pp.37-42
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• 1996

ZnO films have been deposited on oxide grown Si wafers by the conventional thermal evaporation method. Anhydrous zinc acetate was directly heated and sublimed in the laboratory-made brass boat. The substrates temperature varied from $200^{\circ}C$ to $600^{\circ}C$. Oxygen has been flowed into the deposition chamber to change the partial pressure of oxygen. The films deposited at high oxygen pressure exhibited higher resistivity than films at low pressure. X-Ray Diffraction(XRD), Energy Dispersive Spectroscopy(EDS) and Rutherford Backscattering Spectrometry (RBS) were conducted on the films to reveal the crystallinity and composition of the ZnO films. The ZnO films deposited at high oxygen pressure were extremly sensitive to the humidity of higher than 70 % RH.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.51-54
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• 2000

In this paper, $Ba_{0.5}$Sr$_{0.5}$TiO$_3$ thin films were prepared on Pt/Ti/SiO$_2$/Si substrate by RF magnetron sputtering method. We investigated effect of deposition conditions (especially RF input power) on structural properties of BST thin films. Deposit conditions of BST films were set working gas ratio, Ar:O$_2$= 70 : 30, working pressure 10mTorr, and RF input power 25W, 50W, 75W and 100W. Post-annealing using rapid thermal annealing(RTA) performed at 45$0^{\circ}C$, 55$0^{\circ}C$, $650^{\circ}C$, and 75$0^{\circ}C$ in oxigen ambient for 60 sec, respectively. The structural properties of BST films on Pt/Ti/SiO$_2$/Si substrate analysed by X-ray diffraction(XRD).).).

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.10
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• pp.436-440
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• 2003

The (S $r_{0.85}$C $a_{0.15}$)Ti $O_3$(SCT) thin films were deposited on Pt-coated electrode(Pt/TiN/ $SiO_2$/Si) using RF sputtering method according to the deposition condition. The optimum conditions of RF power and Ar/ $O_2$ ratio were 140[W] and 80/20, respectively. Deposition rate of SCT thin films was about 18.75[$\AA$/min] at the optimum condition. The composition of SCT thin films deposited on Si substrate is close to stoichiometry (1.102 in A/B ratio). The capacitance characteristics had a stable value within $\pm$4[%]. The drastic decrease of dielectric constant and increase of dielectric loss in SCT thin films were observed above 200[kHz]. SCT thin films used in this study showed the phenomena of dielectric relaxation with the increase of frequency.ncy.

• Journal of the Korean Vacuum Society
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• v.7 no.2
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• pp.141-149
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• 1998

The W thin films were deposited on Si3N4 by a PECVD technique. The effects of substrate temperature and gas flow ratio on the properties of the W films were investigated. The deposition of W films were limited by surface reaction at the temperature range of 150>~$250^{\circ}C$, W films had the deposition rate of 150~530 $\AA$/min and stress of 0.85~$14.35\times10 ^9 \textrm {dynes/cm}^2}$ at various substrate temperatures and $SiH_4/WF_6$ flow ratios. $SiH_4/WF_6$ flow ratio affected the deposition rate and stress of the W films, expecially, excessive flow of SiH4 abruptly changed the structure, chemical bonding, and stress of the W films. Among the deposited W films on TiN, Ti, Mo, NiCr and Al adhesion layer, the one on the Al had the best adhesion property.