• 제목/요약/키워드: SiC Paper

검색결과 942건 처리시간 0.029초

Substrate Temperature Dependence of Microcrystalline Silicon Thin Films by Combinatorial CVD Deposition

  • Kim, Yeonwon
    • 한국표면공학회지
    • /
    • 제48권3호
    • /
    • pp.126-130
    • /
    • 2015
  • A high-pressure depletion method using plasma chemical vapor deposition (CVD) is often used to deposit hydrogenated microcrystalline silicon (${\mu}c-Si:H$) films of a low defect density at a high deposition rate. To understand proper deposition conditions of ${\mu}c-Si:H$ films for a high-pressure depletion method, Si films were deposited in a combinatorial way using a multi-hollow discharge plasma CVD method. In this paper the substrate temperature dependence of ${\mu}c-Si:H$ film properties are demonstrated. The higher substrate temperature brings about the higher deposition rate, and the process window of device quality ${\mu}c-Si:H$ films becomes wider until $200^{\circ}C$. This is attributed to competitive reactions between Si etching by H atoms and Si deposition.

액상소결 시의 β-SiC의 입자성장 방지 (Prevention of Grain Growth during the Liquid-Phase Assisted Sintering of β-SiC)

  • 길건영;노비얀토 알피안;한영환;윤당혁
    • 한국세라믹학회지
    • /
    • 제47권6호
    • /
    • pp.485-490
    • /
    • 2010
  • In our previous studies, continuous SiC fiber-reinforced SiC-matrix composites ($SiC_f$/SiC) had been fabricated by two different slurry infiltration methods: vacuum infiltration and electrophoretic deposition (EPD). 12 wt% of $Al_2O_3-Y_2O_3$-MgO with respect to SiC powder was used as additives for liquid-phase assisted sintering. After hot pressing at $1750^{\circ}C$ under 20 MPa for 2 h in Ar atmosphere, a high composite density could be achieved for both cases, whereas the problems such as large grain size and non-uniform distribution of liquid phase were observed, which was resulted in the relatively poor mechanical properties of composites. Therefore, efforts have been made to reduce the grain growth during the sintering, including the optimization for hot pressing condition and utilization of spark plasma sintering using a SiC monolith. Based on the results, spark plasma sintering was found to be effective method in decreasing the amount of sintering additive, time and grain growth, which will be explained in comparison to the results of hot pressing in this paper.

3C-SiC 광기전 특성 기반 광학식 수소센서의 제작과 그 특성 (Fabrication of an Optical Hydrogen Sensor Based on 3C-SiC Photovoltaic Effect and Its Characteristics)

  • 김강산;정귀상
    • 센서학회지
    • /
    • 제21권4호
    • /
    • pp.283-286
    • /
    • 2012
  • This paper presents the optical hydrogen sensor based on transparent 3C-SiC membrane and photovoltaic effect. Gasochromic materials of Pd and Pd/$WO_3$ were deposited by sputter on 3C-SiC membrane for gas sensing area. Gasochromic materials change to transparency by exposure to hydrogen. The variations of light intensity by hydrogen generate the photovoltaic of P-N junction between N-type 3C-SiC and P-type Si. Single layer of Pd shows higher photovoltaic compared with Pd/$WO_3$. However, phase transition from ${\alpha}$ to ${\beta}$ is shown at 6 %. Pd/$WO_3$ structure show the more linear response to hydrogen range of 2 % ~10 %. Also, almost 2 times fast response and recovery characteristics are shown at Pd/$WO_3$. These fast performances are come from the fact that Pd promoted the chemical reaction between hydrogen and $WO_3$.

단결정 6H-SiC의 광전화학습식식각에 대한 연구 (Study on Photoelectrochemical Etching of Single Crystal 6H-SiC)

  • 송정균;정두찬;신무환
    • 한국전기전자재료학회논문지
    • /
    • 제14권2호
    • /
    • pp.117-122
    • /
    • 2001
  • In this paper, we report on photoelectrochemical etching process of 6H-SiC semiconductor wafer. The etching was performed in two-step process; anodization of SiC surface to form a deep porous layer and thermal oxidation followed by an HF dip. Etch rate of about 615${\AA}$/min was obtained during the anodization using a dilute HF(1.4wt% in H$_2$O) electrolyte with the etching potential of 3.0V. The etching rate was increased with the bias voltage. It was also found out that the adition of appropriate portion of H$_2$O$_2$ into the HF solution improves the etching rate. The etching process resulted in a higherly anisotropic etching characteristics and showed to have a potential for the fabrication of SiC devices with a novel design.

  • PDF

6H-SiC $p^{+}n$ 접합의 항복 전압을 위한 해석적 모형 (Analytical Model of Breakdown Voltages for 6H-SiC $p^{+}n$ Junction)

  • 정용성
    • 대한전자공학회논문지SD
    • /
    • 제38권6호
    • /
    • pp.398-403
    • /
    • 2001
  • 본 논문에서는 6H-SiC의 유효 이온화 계수를 추출하였고, 이 이온화 계수를 이용하여 6H-SiC p+n 접합의 해석적 항복 전압 식을 유도하였다. 해석적 항복 전압 결과는 10/sup 15/ cm/sup -3/ ∼ 10/sup 18/ cm/sup -3/의 농도 범위에서 Dmitriev의 수치적 결과[3] 및 Cree Research의 실험 결과[9]와 비교하여 잘 일치하였다.

  • PDF

강유전성 박막의 형성 및 수소화 된 비정질실리콘과의 접합 특성 (The Contact Characteristics of Ferroelectrics Thin Film and a-Si:H Thin Film)

  • 허창우
    • 한국정보통신학회:학술대회논문집
    • /
    • 한국해양정보통신학회 2003년도 춘계종합학술대회
    • /
    • pp.501-504
    • /
    • 2003
  • 본 연구에서는 박막트랜지스터의 특성 향상을 위하여 강유전성 박막을 게이트 절연충으로 사용하기 위하여 강유전성 박막과 a-Si:H 의 계면특성을 조사하였다. 먼저 강유전성 박막 중에 대표적인 SrTiO$_3$를 E-BEAM 증착기로 박막을 형성시켰다. 형성된 박막은 $N_2$ 분위기에서 15$0^{\circ}C$~$600^{\circ}C$로 1시간 ANNEALING 하여 전자현미경으로 표면을 측정하였다. SrTiO$_3$의 유전상수는 50~100 정도였으며 항복전계는 1~l.5 MV/cm로 매우 우수한 유전특성을 갖고 있었다. 강유전체 박막 위에 a-SiN:H,a-Si:H(n-type a-Si:H) 등을 PECVD로 증착하여 MFNS구조를 형성하였다. 계면특성을 C-V PLOTTER로 측정한 결과 SrTiO$_3$ 박막은 SiN 과의 접합이 매우 안정되어 있었고 C-V특성은 SiN/a-Si:H 과 유사하였다. 그러나 FERROELECTRIC/a-S:H의 경우가 훨씬 CAPACITANCE값이 컸으며, 이는 강유전체 박막의 높은 유전상수에 기인 된 것이라 생각된다.

  • PDF

배터리 팩 시험기용 3상 AC/DC 컨버터에서의 SiC 및 Si 소자에 대한 손실 비교 분석 (Comparision Analysis of SiC and Si Loss in 3-Phase AC/DC Converter for Battery Pack Testing System)

  • 박세희;현승욱;성호재;원충연
    • 전력전자학회:학술대회논문집
    • /
    • 전력전자학회 2017년도 전력전자학술대회
    • /
    • pp.363-364
    • /
    • 2017
  • This paper analyzes switching losses and efficiency depending on SiC and Si devices applied in 3-phase AC/DC Converter for Battery Pack Testing System. The switch elements of the 3-phase AC/DC Converter is compared to Si and SiC-based elements and analyzed through comparison of each switching loss by simulation results.

  • PDF

SDB와 etch-back 기술에 의한 MEMS용 SiCOI 구조 제조 (Fabrication of SiCOI Structures Using SDB and Etch-back Technology for MEMS Applications)

  • 정수용;우형순;정귀상
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
    • /
    • pp.830-833
    • /
    • 2003
  • This paper describes the fabrication and characteristics of 3C-SiCOI sotctures by SDB and etch-back technology for high-temperature MEMS applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si(001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The wafer bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR. The strength of the bond was measured by tensile strengthmeter. The bonded interface was also analyzed by SEM. The properties of fabricated 3C-SiCOI structures using etch-back technology in TMAH solution were analyzed by XRD and SEM. These results indicate that the 3C-SiCOI structure will offers significant advantages in the high-temperature MEMS applications.

  • PDF

SiC 마이크로 히터가 내장된 극한 환경용 NO 센서의 제작과 특성 (Fabrication of NO sensor integrated SiC micro heaters for harsh environments and its characteristics)

  • 김강산;정귀상
    • 센서학회지
    • /
    • 제19권3호
    • /
    • pp.197-201
    • /
    • 2010
  • This paper describes the fabrication and characteristics of a NO sensor using ZnO thin film integrated 3C-SiC micro heater based on polycrystalline 3C-SiC thin film of operation in harsh environments. The sensitivity, response time, and operating properties in high temperature and voltages of NO sensors based SiC MEMS are measured and analyzed. The sensitivity of device with pure ZnO thin film at the heater operating power of 13.5 mW ($300^{\circ}C$) is 0.875 in NO gas concentration of 0.046 ppm. In the case of Pt doping, the sensitivity of at power consumption of 5.9 mW ($250^{\circ}C$) was 1.92 at same gas flow rate. The ZnO with doped Pt was showed higher sensitivity, lower working temperature and faster adsorption characteristics to NO gas than pure ZnO thin film. The NO gas sensor integrated SiC micro heater is more strength than others in high voltage and temperature environments.

Oxidized-SiN으로 형성된 4H-SiC MOS capacitor.의 전기적 특성 (Electrical properties of Metal-Oxide-Semiconductor (MOS) capacitor formed by oxidized-SiN)

  • 문정헌;김창현;이도현;방욱;김남균;김형준
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2009년도 춘계학술대회 논문집
    • /
    • pp.45-46
    • /
    • 2009
  • We have fabricated advanced metal-oxide-semiconductor (MOS) capacitors with thin (${\approx}10\;nm$) Inductive-Coupled Plasma (ICP) CVD $Si_xN_y$ dielectric layers and investigated electrical properties of nitrided $SiO_2$/4H-SiC interface after oxidizing the $Si_xN_y$ in dry oxidation and/or $N_2$ annealing. An improvement of electrical properties have been revealed in capacitance-voltage (C-V) and current density-electrical field (J-E) measurements if compared with non-annealed oxidized-SiN. The improvements of SiC MOS capacitors formed by oxidized-SiN have been explained in this paper.

  • PDF