• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2002년도 제3회 최신 분말제품 응용기술 Workshop
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• pp.25-37
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• 2002

The most important industrial application of gamma radiation in characterizing green compacts is the determination of the density. Examples are given where this method is applied in manufacturing technical components in powder metallurgy. The requirements imposed by modern quality management systems and operation by the workforce in industrial production are described. The accuracy of measurement achieved with this method is demonstrated and a comparison is given with other test methods to measure the density. The advantages and limitations of gamma ray densitometry are outlined. The gamma ray densitometer measures the attenuation of gamma radiation penetrating the test parts (Fig. 1). As the capability of compacts to absorb this type of radiation depends on their density, the attenuation of gamma radiation can serve as a measure of the density. The volume of the part being tested is defined by the size of the aperture screeniing out the radiation. It is a channel with the cross section of the aperture whose length is the height of the test part. The intensity of the radiation identified by the detector is the quantity used to determine the material density. Gamma ray densitometry can equally be performed on green compacts as well as on sintered components. Neither special preparation of test parts nor skilled personnel is required to perform the measurement; neither liquids nor other harmful substances are involved. When parts are exhibiting local density variations, which is normally the case in powder compaction, sectional densities can be determined in different parts of the sample without cutting it into pieces. The test is non-destructive, i.e. the parts can still be used after the measurement and do not have to be scrapped. The measurement is controlled by a special PC based software. All results are available for further processing by in-house quality documentation and supervision of measurements. Tool setting for multi-level components can be much improved by using this test method. When a densitometer is installed on the press shop floor, it can be operated by the tool setter himself. Then he can return to the press and immediately implement the corrections. Transfer of sample parts to the lab for density testing can be eliminated and results for the correction of tool settings are more readily available. This helps to reduce the time required for tool setting and clearly improves the productivity of powder presses. The range of materials where this method can be successfully applied covers almost the entire periodic system of the elements. It reaches from the light elements such as graphite via light metals (AI, Mg, Li, Ti) and their alloys, ceramics ($AI_20_3$, SiC, Si_3N_4, $Zr0_2$, ...), magnetic materials (hard and soft ferrites, AlNiCo, Nd-Fe-B, ...), metals including iron and alloy steels, Cu, Ni and Co based alloys to refractory and heavy metals (W, Mo, ...) as well as hardmetals. The gamma radiation required for the measurement is generated by radioactive sources which are produced by nuclear technology. These nuclear materials are safely encapsulated in stainless steel capsules so that no radioactive material can escape from the protective shielding container. The gamma ray densitometer is subject to the strict regulations for the use of radioactive materials. The radiation shield is so effective that there is no elevation of the natural radiation level outside the instrument. Personal dosimetry by the operating personnel is not required. Even in case of malfunction, loss of power and incorrect operation, the escape of gamma radiation from the instrument is positively prevented.

• 한국재료학회지
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• 제6권7호
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• pp.723-732
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• 1996

ICB 공정으로 선행 증착한 Cu Seeding 층이 이후의 CVD 공정으로 증착하는 최종의 Cu 박막의 기계적 전기적 특성에 미치는 영향을 고찰하였고, seening을 하지 않은 CVD-Cu 박막과의 특성을 비교하였다. seeding 층을 형성한 경우의 CVD-Cu 박막에 있어서 증착 속도가 증가하였으며, grain 크기의 균일성도 향상되는 경향을 보였다. 증착된 Cu 박막은 seening에 무관하게 모두 FCC 우선배향인 (111)의 결정배향을 나타냈으며, seeding 우에 성정된 박막의 경우 $I_{111}/I_{200}$비가 향상되었다.$ 180^{\circ}C$의 동일 조건하에서 증착하는 경우 $40\AA$ seeding층 위에 성장한 박막의 전기비저항이 $2.42\mu$$\Omega$.cm로 낮은 값을 나타내었으며, 130$\AA$ seeding 경우는 오히려 전기비저항이 증가하는 경향을 나타내었다. Cu 박막의 접착력은 seeding층의 두께가 $0\AA$에서 $130\AA$으 증가함에 따라 21N에서 27N 으로 향상되었다.

• 한국재료학회지
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• 제27권5호
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• pp.281-288
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• 2017

In this study, Fe-Ni slag, converter slag and dephosphorization slag generated from the steel industry, and fly ash or bottom ash from a power plant, were mixed at an appropriate mixing ratio and melted in a melting furnace in a mass-production process for glass ceramics. Then, glass-ceramic products, having a basalt composition with $SiO_2$, $Al_2O_3$, CaO, MgO, and $Fe_2O_3$ components, were fabricated through casting and heat treatment process. Comparison was made of the samples before and after the modification of the process conditions. Glass-ceramic samples before and after the process modification were similar in chemical composition, but $Al_2O_3$ and $Na_2O$ contents were slightly higher in the samples before the modification. Before and after the process modification, it was confirmed that the sample had a melting temperature below $1250^{\circ}C$, and that pyroxene and diopside are the primary phases of the product. The crystallization temperature in the sample after modification was found to be higher than that in the sample before modification. The activation energy for crystallization was evaluated and found to be 467 kJ/mol for the sample before the process modification, and 337 kJ/mol for the sample after the process modification. The degree of crystallinity was evaluated and found to be 82 % before the process change and 87 % after the process change. Mechanical properties such as compressive strength and bending strength were evaluated and found to be excellent for the sample after process modification. In conclusion, the samples after the process modification were evaluated and found to have superior characteristics compared to those before the modification.

• Journal of Korean Dental Science
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• 제8권2호
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• pp.82-88
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• 2015

Purpose: To evaluate the effect of light-curing on the immediate and delayed micro-shear bond strength (${\mu}SBS$) between yttria-tetragonal zirconia polycrystal (Y-TZP) ceramics and RelyX Ultimate when using Single Bond Universal (SBU). Materials and Methods: Y-TZP ceramic specimens were ground with #600-grit SiC paper. SBU was applied and RelyX Ultimate was mixed and placed on the Y-TZP surface. The specimens were divided into three groups depending on whether light curing was done after adhesive (SBU) and resin cement application: uncured after adhesive and uncured after resin cement application (UU); uncured after adhesive, but light cured after resin cement (UC); and light cured after adhesive and light cured resin cement (CC). The three groups were further divided depending on the timing of ${\mu}SBS$ testing: immediate at 24 hours (UUI, UCI, CCI) and delayed at 4 weeks (UUD, UCD, CCD). ${\mu}SBS$ was statistically analyzed using one-way ANOVA and Student-Newman-Keuls multiple comparison test (P<0.05). The surface of the fractured Y-TZP specimens was analyzed under a scanning electron microscope (SEM). Result: At 24 hours, ${\mu}SBS$ of UUI group ($8.60{\pm}2.06MPa$) was significantly lower than UCI group ($25.71{\pm}4.48MPa$) and CCI group ($29.54{\pm}3.62MPa$) (P<0.05). There was not any significant difference between UCI and CCI group (P>0.05). At 4 weeks, ${\mu}SBS$ of UUD group ($24.43{\pm}2.88MPa$) had significantly increased over time compared to UUI group (P<0.05). The SEM results showed mixed failure in UCI and CCI group, while UUI group showed adhesive failure. Conclusion: Light-curing of universal adhesive before or after application of RelyX Ultimate resin cement significantly improved the immediate ${\mu}SBS$ of resin cement to air-abrasion treated Y-TZP surface. After 4 weeks, the delayed ${\mu}SBS$ of the non-light curing group significantly improved to the level of light-cured groups.

• 한국결정성장학회지
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• 제7권2호
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• pp.253-258
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• 1997

반도체화 첨가제인 $Y_2O_3$와 $Nb_2O_5$ 첨가랑 변화에 따른 PTCR $BaTiO_3$ 세라믹스의 결정구조 해석과 상전이 특성을 연구하기 위하여 ($Ba_{0.85}Ca_{0.15})TiO_3$ ＋ X m/o $Nb_2O_5$(Y m/o $Y_2O_3$) ＋ 0.08 w/o $Mn(NO_3)_2$ㆍ$6H_2O$ ＋ 0.25 w/o $SiO_2$ 계에서 X는 0.1 ~ 0.4로 Y는 0.2 ~ 0.4로 각각 변화시켜 실험을 수행하였다. $Nb_2O_5$의 첨가시 B-site 치환에 따라서 격자상수가 선형적으로 변화하다가 0.3 mol% 이상 치환할 경우 c 축의 격자상수가 급격히 감소함을 알 수 있었다. 이는 octahedron distortion둥의 원인으로 판단되며, 이러한 격자상수 변화는 상전이 온도 결과와도 잘 일치함을 확인할 수 있었다. 또한 $Y_2O_3$ 첨가의 경우 0.3 mol%가지는 A, B-site를 각각 치환하며 그 이상부터는 A-site 이온을 주로 치환하는 것을 격자상수 변화와 상전이 온도결과를 통해 알 수 있었으며, Rietveld 해석결과 $Y^{3+}$가 A-site 치환시 $Ba^{2＋}$와 $Ca^{2＋}$를 같은 비율로 치환한다는 것을 알 수 있었다.

• Journal of Electrical Engineering and Technology
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• 제13권4호
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• pp.1638-1643
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• 2018

Multi-layer ceramic capacitors as decoupling capacitor were fabricated by dielectric composition with a high dielectric constant. The fabricated decoupling capacitors were embedded in the PCB of the 10G RF transceiver module and evaluated for the characteristics of electrical noise by the level of AC input voltage. In order to further improve the electrical properties of the $BaTiO_3$ based composite, glass frit, MgO, $Y_2O_3$, $Mn_3O$, $V_2O_5$, $BaCO_3$, $SiO_2$, and $Al_2O_3$ were used as additives. The electrical properties of the composites were determined by various amounts of additives and optimum sintering temperature. As a result of the optimized composite, it was possible to obtain a density of $5.77g/cm^3$, a dielectric constant of 1994, and an insulation resistance of $2.91{\times}10^{12}{\Omega}$ at an additive content of 5wt% and a sintering temperature of $1250^{\circ}C$. After forming a $2.5{\mu}m$ green sheet using the doctor blade method, a total of 77 layers were laminated and sintered at $1180^{\circ}C$. A decoupling capacitor with a size of $0.6mm(W){\times}0.3mm(L){\times}0.3mm(T)$ (width, length and thickness, respectively) and a capacitance of 100 nF was embedded using a PCB process for the 10G RF Transceiver modules. In the range of AC input voltage 400mmV @ 500kHz to 2200mV @ 900kHz, the embedded 10G RF Transceiver modules evaluated that it has better electrical performance than the non-embedded modules.