• Title/Summary/Keyword: Si-Wafer

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열처리에 따른 Mo 박막의 잔류응력 완화에 관한 연구

  • Kim, Gang-Sam;Jo, Yong-Gi;Song, Yeong-Sik;Im, Tae-Hong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.192-192
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    • 2011
  • Mo 박막은 열적 안전성과 전기 전도성이 우수한 소재로 CIGS 태양전지의 배면전극으로 사용되고 있다. 스퍼터링법에 의한 Mo 박막의 전도성은 공정압력에 민감하여 높은 압력과 낮은 압력에서 이중박막으로 제조되고 있다. 연구에서는 압력에 크게 영향을 받지 않으면서 전도성이 $10{\mu}{\Omega}-cm$ 이하로 우수한 Mo 박막을 얻을 수 있는 아크 이온플레이팅법으로 Mo 박막을 제조하였다. 그러나 Mo 박막 증착시에 나타나는 높은 압축응력은 기재(Soda lime Glass; SLG)와의 밀착성을 떨어뜨렸다. 기재(SLG)와의 밀착성을 확보하기 위해 Ti 중간층($0.3{\mu}m$, $0.9{\mu}m$)을 증착하고 그 위에 Mo 박막을 증착하여 전도성이 우수한 박막을 제조하였으나 여전히 압축잔류응력의 문제점을 보였다. 압축응력의 완화를 위해 CIGS 박막이 제조되는 $550^{\circ}C$의 온도에서 열처리를 1시간 수행하였다. 열처리를 통해 열처리 전과 후에 나타나는 전도성과 잔류응력의 변화를 공정압력(5 mTorr~30 mTorr)별로 알아보았다. 사용된 시험편은 Si wafer, SLG, SUS계 소재를 이용하였으며 공정압력별로 아크 타겟에 인가되는 전류는 100 A로 고정하였고, 바이어스 전압은 0V, -50V를 인가하였다. 열처리 전과 후에 전도성은 크게 변화가 관찰되지 않았으나 잔류응력에는 많은 변화가 관찰 되었다. 잔류응력은 공정압력(5mTorr~30mTorr)별로 응력 완화가 일어났으며, 바이어스 전압이 0V에서 공정압력이 5 mTorr일 때 열처리 전에 측정된 1346 MPa 압축응력이 열처리 후에는 188 MPa의 인장응력을 나타내었다. 이러한 응력 변화에 대해 XRD와 SEM으로 구조분석을 통해 Mo 박막의 결정성과 전도성 및 잔류응력의 상관관계에 대해 알아보았다.

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UV 나노임프린트 리소그래피의 Quartz 기판상의 Resin mold 제거를 위한 Hybrid 세정공정에 관한 연구

  • Jo, Yun-Sik;Kim, Min-Su;Gang, Bong-Gyun;Kim, Jae-Gwan;Lee, Byeong-Gyu;Park, Jin-Gu
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2012.05a
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    • pp.81.1-81.1
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    • 2012
  • 나노임프린트 리소그라피(Nano-Imprint Lithography, NIL) 기술은 기판위의 resin을 나노구조물이 각인된 스탬프로 눌러서 나노구조물을 형성하는 기술로, 경제적이고 효과적으로 나노구조물을 제작할 수 있는 기술이다. 그중에서도 UV 기반의 나노임프린트(UV-NIL) 기술은 resin을 투명한 스탬프로 누른뒤 UV로 경화시켜 나노구조물을 형성하는 기술로써 고온, 고압($140{\sim}180^{\circ}C$, 10~30bar)이 필요한 가열식 나노임프린트 기술에 비해 상온, 상압($20^{\circ}C$, 1bar)에서도 구조물 형성이 가능하여 다층구조 형성에 적합하다. 연속적인 임프린팅 공정에 의해 resin이 quarz 스탬프에 잔류하여 패터닝에 결함을 유발하게 되므로 오염물을 제거하기 위한 세정공정이 필요하다. 하지만 UV에 의해 경화된 resin은 cross-linking을 형성하여 화학적인 내성이 증가하게 되므로 제거하기가 어렵다. 현재는 resin 제거를 위한 세정공정으로 SPM($H_2SO_4/H_2O_2$) 세정이 사용되고 있는데 세정시간이 길고 세정 후에 입자 또는 황 잔유물이 남으며 많은 유해용액 사용의 문제점이 있어 효과적으로 resin을 제거할 세정공정이 필요한 상황이다. 본 연구에서는 친환경적인 UV 세정 및 오존수 세정공정을 적용하여 경화된 resin을 제거하는 연구를 진행하였다. 실험샘플은 약 100nm 두께의 resin을 증착한 $1.5cm{\times}1.5cm$ $SiO_2$ 쿠폰 wafer를 사용하였으며, UV 및 오존수의 처리시간을 달리하여 resin 제거효율을 평가하였다. ATR-FTIR 장비를 사용하여 시간에 따른 resin의 두께를 측정한 결과, UV 세정으로 100nm 높이의 resin중에 80nm의 bulk resin이 단시간에 제거가 되었고 나머지 20nm의 resin thin film은 오존수 세정으로 쉽게 제거되는 것을 확인 하였다. 또한 표면에 남은 resin residue와 particle을 제거하기 위해서 SC-1 세정을 진행하였고 contact angle과 optical microscope 장비를 사용하여 resin이 모두 제거된 것을 확인하였다.

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Fabrication of n-ITO/p-PSL heterojunction type photodetectors and their characteristics (n-ITO/p-PSL 이종접합형 광검출 소자의 제조 및 그 특성)

  • Kim, Hang-Kyoo;Shin, Jang-Kyoo;Lee, Jong-Hyun;Song, Jae-Won
    • Journal of Sensor Science and Technology
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    • v.4 no.1
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    • pp.3-8
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    • 1995
  • n-ITO/p-PSL heterojunction photodetector have been fabricated on the Si wafer by using ITO(indium tin oxide) and PSL(porous silicon layer). They were anodized selectively by using silicon nitride and Ni-Cr/Au and were passivated by using ITO as well as being isolated by using mesa structure. With white light from 0 to 3000 Lux, the photocurrent varied linearly with incident light intensity. The reverse characteristics of fabricated devices were very stable up to a bias voltage of -40V and dark current density was about $40nA/mm^{2}$. When the device was exposed by Xe lamp whose wavelength range from 400nm to 1100nm, the maximum photo responsivity was about 0.6A/W between 600 and 700nm. Variation of the characteristics of fabricated devices after 5 weeks was negligible.

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Development of Space Divided PE-ALD System and Process Design for Gap-Fill Process in Advanced Memory Devices (차세대 메모리 디바이스Gap-Fill 공정 위한 공간 분할 PE-ALD개발 및 공정 설계)

  • Lee, Baek-Ju;Hwang, Jae-Soon;Seo, Dong-Won;Choi, Jae-Wook
    • Journal of the Korean institute of surface engineering
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    • v.53 no.3
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    • pp.124-129
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    • 2020
  • This study is for the development of high temperature ALD SiO2 film process, optimized for gap-fill process in manufacturing memory products, using a space-divided PE-ALD system equipped with an independent control dual plasma system and orbital moving unit. Space divided PE-ALD System has high productivity, and various applications can be applied according to Top Lid Design. But space divided ALD system has a limitation to realize concentric deposition map due to process influence due to disk rotation. In order to solve this problem, we developed an orbit rotation moving unit in which disk and wafer. Also we used Independent dual plasma system to enhance thin film properties. Improve productivity and film density for gap-fill process by having deposition and surface treatment in one cycle. Optimize deposition process for gap-fill patterns with different depths by utilizing our independently controlled dual plasma system to insert N2and/or He plasma during surface treatment, Provide void-free gap-fill process for high aspect ratio gap-fill patterns (up to 50:1) with convex curvature by adjusting deposition and surface treatment recipe in a cycle.

Transfer-Free, Large-Scale, High-Quality Monolayer Graphene Grown Directly onto the Ti (10 nm)-buffered Substrates at Low Temperatures (Ti (10 nm)-buffered 기판들 위에 저온에서 직접 성장된 무 전사, 대 면적, 고 품질 단층 그래핀 특성)

  • Han, Yire;Park, Byeong-Ju;Eom, Ji-Ho;Yoon, Soon-Gil
    • Korean Journal of Materials Research
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    • v.30 no.3
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    • pp.142-148
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    • 2020
  • Graphene has attracted the interest of many researchers due to various its advantages such as high mobility, high transparency, and strong mechanical strength. However, large-area graphene is grown at high temperatures of about 1,000 ℃ and must be transferred to various substrates for various applications. As a result, transferred graphene shows many defects such as wrinkles/ripples and cracks that happen during the transfer process. In this study, we address transfer-free, large-scale, and high-quality monolayer graphene. Monolayer graphene was grown at low temperatures on Ti (10nm)-buffered Si (001) and PET substrates via plasma-assisted thermal chemical vapor deposition (PATCVD). The graphene area is small at low mTorr range of operating pressure, while 4 × 4 ㎠ scale graphene is grown at high working pressures from 1.5 to 1.8 Torr. Four-inch wafer scale graphene growth is achieved at growth conditions of 1.8 Torr working pressure and 150 ℃ growth temperature. The monolayer graphene that is grown directly on the Ti-buffer layer reveals a transparency of 97.4 % at a wavelength of 550 nm, a carrier mobility of about 7,000 ㎠/V×s, and a sheet resistance of 98 W/□. Transfer-free, large-scale, high-quality monolayer graphene can be applied to flexible and stretchable electronic devices.

Surface energy assisted gecko-inspired dry adhesives

  • Rahmawan, Yudi;Kim, Tae-Il;Kim, Seong-Jin;Lee, Kwang-Ryeol;Moon, Myoung-Woon;Suh, Kahp-Yang
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.449-449
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    • 2011
  • We reported the direct effect of intrinsic surface energy of dry adhesive material to the Van der Waals and capillary forces contributions of the total adhesion force in an artificial gecko-inspired adhesion system. To mimic the gecko foot we fabricated tilted nanohairy structures using both lithography and ion beam treatment. The nanohairy structures were replicated from Si wafer mold using UV curable polymeric materials. The control of nanohairs slanting angles was based on the uniform linear argon ion irradiation to the nanohairy polymeric surface. The surface energy was studied utilizing subsequent conventional oxygen ion treatment on the nanohairy structures which resulted in gradient surface energy. Our shear adhesion test results were found in good agreement with the accepted Van der Waals and capillary forces theory in the gecko adhesion system. Surface energy would give a direct impact to the effective Hamaker constant in Van der Waals force and the filling angle (${\varphi}$) of water meniscus in capillary force contributions of gecko inspired adhesion system. With the increasing surface energy, the effective Hamaker constant also increased but the filling angle decreased, resulting in a competition between the two forces. Using a simple mathematical model, we compared our experimental results to show the quantitative contributions of Van der Waals and capillary forces in a single adhesion system on both hydrophobic and hydrophilic surfaces. We found that the Van der Waals force contributes about 82.75% and 89.97% to the total adhesion force on hydrophilic and hydrophobic test surfaces, respectively, while the remaining contribution was occupied by capillary force. We also showed that it is possible to design ultrahigh dry adhesive with adhesion strength of more than 10 times higher than apparent gecko adhesion force by controlling the surface energy and the slanting angle induced-contact line of dry adhesive the materials.

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Application of Surfactant added DHF to Post Oxide CMP Cleaning Process (계면활성제가 첨가된 DHF의 Post-Oxide CMP 세정 공정에의 적용 연구)

  • Ryu, Chung;Kim, You-Hyuk
    • Journal of the Korean Chemical Society
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    • v.47 no.6
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    • pp.608-613
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    • 2003
  • In order to remove particles on surface of post-oxide CMP wafer, new cleaning solution was prepared by mixing with DHF (Diluted HF), nonionic surfactant PAAE (Polyoxyethylene Alkyl Aryl Ether), DMSO (Dimethylsulfoxide) and D.I.W.. Silicone wafers were intentionally contaminated by silica, alumina and PSL (polystylene latex) which had different zeta potentials in cleaning solution. This cleaning solution under megasonic irradiation could remove particles and metals simultaneously at room temperature in contrast to traditional AMP (mixture of $NH_4OH,\;H_2O_2$ and D.I.W) without any side effects such as increasing of microroughness, metal line corrosion and deposition of organic contaminants. This suggests that this cleaning solution would be useful future application with copper CMP in brush cleaning process as well as traditional post CMP cleaning process.

Effects of DC Substrate Bias Power Sources and Reactant Gas Ratio on Synthesis and Tribological Properties of Ternary B-C-N Coatings (기판 바이어스 DC 전원의 종류와 반응가스 분압비가 3성분계 B-C-N 코팅막의 합성과 마찰 특성에 미치는 영향)

  • Jeong, Da-Woon;Kim, Doo-In;Kim, Kwang-Ho
    • Journal of the Korean institute of surface engineering
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    • v.44 no.2
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    • pp.60-67
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    • 2011
  • Ternary B-C-N coatings were deposited on Si(100) wafer substrate from $B_4C$ target by RF magnetron sputtering technique in $Ar+N_2+CH_4$ gas mixture. In this work, the effect of reactant gas ratio, $CH_4/(N_2+CH_4)$ on the composition, kinds and amounts of bonding states comprising B-C-N coatings were investigated using two different bias power sources of continuous and unipolar DCs. In addition, the tribological properties of coatings were studied with the composition and bonding state of coating. It was found that the substrate bias power had an effect on chemical composition, and all of the obtained coatings were nearly amorphous. Main bonding states of coatings were revealed from FTIR analyses to be h-BN, C-C, C-N, and B-C. The amount of C-C bonging mainly increased with increase of the reactant gas ratio. From our studies, both C-C and h-BN bonding states improved the tribological properties but B-C one was found to be harmful on those. The best coating from tribological points of view was found to be $BC_{1.9}N_{2.3}$ composition.

Fabrication and Characterization of Array Type of Single Photon Counting Digital X-ray Detector (Array Type의 Single Photon Counting Digital X-ray Detector의 제작 및 특성 평가)

  • Seo, Jung-Ho;Lim, Hyun-Woo;Park, Jin-Goo;Huh, Young;Jeon, Sung-Chea;Kim, Bong-Hui
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.32-32
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    • 2008
  • X-ray detector는 의료용, 산업용 등 다양한 분야에서 사용되어지고 있으며 기존의 Analog X-ray 방식의 환경오염, 저장공간 부족, 실시간 분석의 어려움 등의 문제점들을 해결하기 위하여 Digital X-ray로의 전환과 연구가 활발하며 이에 따른 관심도 높아지고 있는 살점이다. Digital X-ray detector는 p-영역과 n-영역 사이에 아무런 불순물을 도핑하지 않은 진성반도체(intrinsic semiconductor) 층을 접합시킨 이종접합 PIN 구조의 photodiode 이다. 이 소자는 역바이어스를 가해주면 p영역과 n영역 사이에서 캐리어 (carrier)가 존재하지 않는 공핍 영역이 발생하게 된다. 이런 공핍 영역에서 광흡수가 일어나면, 전자-정공 쌍이 발생한다. 그리고, 발생한 전자-정공 쌍에 전압이 역방향으로 인가되는 경우, 전자는 양의 전극으로 이동하고, 정공은 음의 전극으로 이동한다. 이와 같이, 발생한 캐리어들을 검출하여 전기적인 신호로 변환 시킨다. 고해상도의 Digital X-ray detector를 만들기 위해서는 누설전류에 의한 noise 감소와 소자의 높은 안정성과 내구성을 위한 높은 breakdown voltage를 가져야 한다. 본 연구에서는 Digital X-ray detector의 leakage current 감소와 breakdown voltage를 높이기 위하여 guradring과 gettering technology를 사용하여 전기적 특성을 분석하였다. 기판으로는 $10k\Omega{\cdot}cm$ resistivity를 갖으며, n-type <111>인 1mm 두께의 4인치 Si wafer를 사용하였다. 그리고 pixel pitch는 $100{\mu}m$이며 active area는 $80{\mu}m{\times}80{\mu}m$$32\times32$ array를 형성하여 X-ray를 조사하여 소자의 특성을 평가 하였다.

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Highly Sensitive Gas Sensors Based on Electrospun Indium Oxide Nanofibers for Indoor Toxic CO and HCHO Gases (전기방사법으로 제작한 In2O3 나노섬유 기반 고감도 실내독성 CO 및 HCHO 가스센서)

  • Im, Dong-Ha;Hwang, Sung-Hwan;Kwon, Se-Hun;Jung, Hyunsung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.12
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    • pp.803-808
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    • 2016
  • In this work, one dimension $In_2O_3$ nanostructures as detecting materials for indoor toxic gases were synthesized by an electrospinning process. The morphology of electrospun $In_2O_3$ nanofibers was controlled by electrolyte composition, applied voltage and working distance between a nozzle and a substrate. The synthesized $In_2O_3$ nanofibers-based paste with/without carbon black additives was prepared for the integration on a sensor device. The integration of $In_2O_3$ sensing materials was conducted by a hand-printing of the paste into the interdigit Au electrodes patterned on Si wafer. Gas sensing properties on CO and HCHO gases were characterized at $300^{\circ}C$. The evaluated sensing properties such as sensitivity, response time and recovery time were improved in $In_2O_3$ nanofiber pastes with carbon black, compared to the paste without carbon black.