• 제목/요약/키워드: Si oxide

검색결과 2,121건 처리시간 0.024초

Correlation Between Energy Gap and Defect Formation of Al Doped Zinc Oxide on Carbon Doped Silicon Oxide

  • Oh, Teresa;Kim, Chy Hyung
    • Transactions on Electrical and Electronic Materials
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    • 제15권4호
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    • pp.207-212
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    • 2014
  • Aluminum-doped zinc oxide (AZO) films were deposited on SiOC/Si wafer by an RF-magnetron sputtering system, by varying the deposition parameters of radio frequency power from 50 to 200 W. To assess the correlation of the optical properties between the substrate and AZO thin film, photoluminescence was measured, and the origin of deep level emission of AZO thin films grown on SiOC/Si wafer was studied. AZO formed on SiOC/Si substrates exhibited ultraviolet emission due to exciton recombination, and the visible emission was associated with intrinsic and extrinsic defects. For the AZO thin film deposited on SiOC at low RF-power, the deep level emission near the UV region is attributed to an increase of the variations of defects related to the AZO and SiOC layers. The applied RF-power influenced an energy gap of localized trap state produced from the defects, and the gap increased at low RF power due to the formation of new defects across the AZO layer caused by lattice mismatch of the AZO and SiOC films. The optical properties of AZO films on amorphous SiOC compared with those of AZO film on Si were considerably improved by reducing the roughness of the surface with low surface ionization energy, and by solving the problem of structural mismatch with the AZO film and Si wafer.

극한 환경 MEMS용 2" 3C-SiC기판의 직접접합 특성 (Direct Bonding Characteristics of 2" 3C-SiC Wafers for Harsh Environment MEMS Applications)

  • 정귀상
    • 한국전기전자재료학회논문지
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    • 제16권8호
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    • pp.700-704
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    • 2003
  • This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 % and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

내화물 응용을 위한 산화물 재료들과 탄소와의 고온 반응거동 (High Temperature Reaction Behaviors of Oxide Materials with Carbon for Refractory Application)

  • 최도문;이진석;김남훈;최성철
    • 한국세라믹학회지
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    • 제44권6호
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    • pp.331-337
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    • 2007
  • High temperature reaction behaviors of various oxide materials (such as bauxite, pyrophyllite, mullite and fused silica powders) used in the refractory materials for tap-hole plugging of blast furnace were investigated with varying temperature in the carbon surrounding. Kinetics of carbothermal reduction of $SiO_2$ for forming SiC with high corrosion resistance were strongly dependent on it's crystalline phase. SiC generation yield increased with increasing catalyst amount in oxide regardless of generated SiO gas amount at temperature of $<1500^{\circ}C$. However, in case of fused silica over $1500^{\circ}C$, SiC generation yield was dominantly influenced by SiO amount without catalyst effect. Bauxite showed the most effective carbothermal reduction reaction, since bauxite have a large amount of catalyst and well-dispersed $SiO_2$ phase in oxide matrix.

고효율 결정질 실리콘 태양전지 적용을 위한 실리콘 산화막 표면 패시베이션 (A Review on Silicon Oxide Sureface Passivation for High Efficiency Crystalline Silicon Solar Cell)

  • 전민한;강지윤;;박철민;송진수;이준신
    • 한국전기전자재료학회논문지
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    • 제29권6호
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    • pp.321-326
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    • 2016
  • Minimizing the carrier recombination and electrical loss through surface passivation is required for high efficiency c-Si solar cell. Usually, $SiN_X$, $SiO_X$, $SiON_X$ and $AlO_X$ layers are used as passivation layer in solar cell application. Silicon oxide layer is one of the good passivation layer in Si based solar cell application. It has good selective carrier, low interface state density, good thermal stability and tunneling effect. Recently tunneling based passivation layer is used for high efficiency Si solar cell such as HIT, TOPCon and TRIEX structure. In this paper, we focused on silicon oxide grown by various the method (thermal, wet-chemical, plasma) and passivation effect in c-Si solar cell.

Si, Mn함유 IF 고강도 합금화 용융아연도금강판의 표면특성 (Surface Characteristics of the Galvannealed Coating in Interstitial-Free High Strengthen Steels Containing Si and Mn)

  • 전선호;진광근;김대룡
    • 대한금속재료학회지
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    • 제46권2호
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    • pp.58-64
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    • 2008
  • Surface-void defects observed on the galvannealed(GA) steel sheets in Interstitial-free high-strengthened steels containing Si and Mn have been investigated using the combination of the FIB(Focused Ion Beam) and FE-TEM(Field Emission-Transmission Electron Microscope) techniques. The scanning ion micrographs of cross-section microstructure of defects showed that these defects were identified as craters which were formed on the projecting part of the substrate surface. Also, those craters were formed on the Si or Mn-Si oxides film through the whole interface between galvannealed coating and steel substrate. Interface enrichments and oxidations of the active alloying elements such as Si and Mn during reduction annealing process for galvanizing were found to interrupt Zn and Fe interdiffusion during galvannealing process. During galvannealing, Zn and Fe interdiffusion is preferentially started on the clean substrate surface which have no oxide layer on. And then, during galvannealing, crater is developed with consumption of molten zinc on the oxide layer.

Pt 촉매 박막을 이용한 비정질 SiOx 나노기둥의 수직성장 (Vertical Growth of Amorphous SiOx Nano-Pillars by Pt Catalyst Films)

  • 이지언;김기출
    • 한국산학기술학회논문지
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    • 제19권1호
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    • pp.699-704
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    • 2018
  • 일차원 나노구조물은 양자 갇힘 효과 및 나노와이어가 갖는 체적 대비 높은 표면적 비에 기인하는 독특한 전기적, 광학적, 광전기적, 전기화학적 특성으로 인하여 많은 주목을 받아왔다. 특히 수직으로 성장된 나노와이어는 체적 대비 높은 표면적 비의 특성을 나타낸다. VLS(Vapor-Liquid-Soild) 공정은 나노구조물의 성장 과정에서 자기정렬 효과 때문에 더욱 주목을 받는다. 본 연구에서는 두 영역 열화학 기상증착법을 이용하여 Si\$SiO_2$(300 nm)\Pt 기판 위에 수직으로 정렬된 실리콘 옥사이드 나노기둥을 VLS 공정으로 성장시켰다. 성장된 실리콘 옥사이드 나노기둥의 형상과 결정학적 특성을 주사전자현미경 및 투과전자현미경으로 분석하였다. 그 결과 성장된 실리콘 옥사이드 나노기둥의 지름과 길이는 촉매 박막의 두께에 따라 변하였다. 실리콘 옥사이드 나노 기둥의 몸체는 비정질 상을 나타내었으며, Si과 O로 구성되어 있었다. 또한 성장된 실리콘 옥사이드 나노 기둥의 머리는 결정성을 나타내었으며, Si, O, Pt 및 Ti으로 구성되어 있었다. 실리콘 옥사이드 나노 기둥의 수직 정렬은 촉매물질인 Pt/Ti 합금의 결정성 정렬 선호에 기인하는 것으로 판단되며, 수직 성장된 실리콘 옥사이드 나노기둥은 기능성 나노소재로 활용이 가능할 것으로 기대된다.

Ti Capping Layer에 의한 Co-silicide 박막의 형성에 관한 연구

  • 김해영;김상연;고대홍;구자흠;최철진;김철승;최시영;강호규
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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    • pp.61-61
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    • 2000
  • Device의 고성능화를 위하여 소자의 고속화, 고집적화가 가속됨에 따라 SALICIDE Process가 더욱 절실하게 요구되고 있다. 이러한 SALICIDE Process의 재료로써는 metal/silicide 중에서 비저항이 가장 낮은 TiSi2(15-25$\mu$$\Omega$cm), CoSi2(17-25$\mu$$\Omega$cm)가 일반적으로 많이 연구되어 왔다. 그러나 Ti-silicide의 경우 Co-silicide는 배선 선폭의 감소에 따른 면저항 값의 변화가 작으며, 고온에서 안정하고, 도펀트 물질과 열역학적으로 안정하여 화합물을 형성하지 않는다는 장점이 있으마 Ti처럼 자연산화막을 제거할 수 없어 Si 기판위에 자연산화막이 존재시 균일한 실리사이드 박막을 형성할 수 없는 단점등을 가지고 있다. 본 연구에서는 Ti Capping layer 에 의한 균일한 Co-silicide의 형성을 일반적인 Si(100)기판과 SCl 방법에 의하여 chemical Oxide를 성장시킨 Si(100)기판의 경우에 대하여 연구하였다. 스퍼터링 방법에 의해 Co를 150 증착후 capping layer로써 TiN, Ti를 각각 100 씩 증착하였다. 열처리는 RTP를 이용하여 50$0^{\circ}C$~78$0^{\circ}C$까지 4$0^{\circ}C$ 구간으로 N2 분위기에서 30초 동안 열처리를 한후, selective metal strip XRD, TEM의 분석장비를 이용하여 관찰하였다. lst RTP후 selective metal strip 후 면저항의 측정과 XRD 분석결과 낮은 면저항을 갖는 CoSi2로의 상전이는 TiN capping과 Co 단일박막이 일반적인 Si(100)기판과 interfacial oxide가 존재하는 Si(100)기판위에서 Ti capping의 경우보다 낮은 온도에서 일어났다. 또한 CoSi에서 CoSi2으로 상전이는 일반적인 Si(100)기판위에서 보다 interfacial Oxide가 존재하는 Si(100)기판 위에 TiN capping과 Co 단일박막의 경우 열처리 후에도 Oxide가 존재하는 불균인한 CoSi2박막을 관찰하였으며, Ti capping의 경우 Oxise가 존재하지 않는 표면과 계면이 더 균일한 CoSi2 박막을 형성 할 수 있었다.

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탄소주입 실리콘 산화막 위에 성장한 투명전극 ZnO 박막의 광학적 특성 (Optical Properties of Transparent Electrode ZnO Thin Film Grown on Carbon Doped Silicon Oxide Film)

  • 오데레사
    • 반도체디스플레이기술학회지
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    • 제11권2호
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    • pp.13-16
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    • 2012
  • Zinc oxide (ZnO) films were deposited by an RF magnetron sputtering system with the RF power of 200W and 300W and flow rate of oxygen gases of 20 and 30 sccm, in order to research the growth of ZnO on carbon doped silicon oxide (SiOC) thin film. The reflectance of SiOC film on Si film deposited by the sputtering decreased with increasing the oxygen flow rate in the range of long wavelength. In comparison between ZnO/Si and ZnO/SiOC/Si thin film, the reflectance of ZnO/SiOC/Si film was inversed that of ZnO/Si film in the rage of 200~1000 nm. The transmittance of ZnO film increased with increasing the oxygen gas flow rate because of the transition from conduction band to oxygen interstitial band due to the oxygen interstitial (Oi) sites. The low reflectance and the high transmittance of ZnO film was suitable properties to use for the front electrode in the display or solar cell.

Copper oxide/n-Si 전극의 광전기화학 변환 특성과 안정성에 미치는 Pt 층의 영향 (Effect of Pt Layers on the Photoelectrochemical Properties and Stability of a Copper Oxide/n-Si Electrode)

  • 윤기현;홍석건;강동헌
    • 한국세라믹학회지
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    • 제37권3호
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    • pp.263-270
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    • 2000
  • The Pt/copper oxide/n-Si electrodes were fabricated by depositing copper oxide thin film of 500${\AA}$ and very thin Pt layer on the n-type (100) Si substrate. hotoelectrochemical properties and stability profiles of the electrodes were investigated as a function of deposition time of Pt layer. As the deposition time of Pt layer increased up to 10 seconds, the photocurrent and quantum efficiency were increased and then decreased with further depositing time. The better cell stability was observed for the electrode with longer deposition time. The improvements in above photoelectrochemical properties indicate that Pt layer acts as a catalyst layer at electrode/electrolyte interface as well as a protective layer. The decreasing tendency of the photocurrent and efficiency for the electrode with Pt layer deposited above 20 seconds was explained as an increases in probbility of electron-hole pair recombination and also the absorbing photon loss at electrode surface due to the excessive thickness of Pt layer. The results were confirmed by impedance spectroscopy, mutiple cycle voltammograms and microstructural analyses.

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EMMI(Emission Microscope)와 FIB(Focused Ion Beam)를 이용한 Thin Oxide 불량분석 (Failure Analysis of Thin Oxide by EMMI and FIB)

  • 박진성;이은구;이현규;이우선
    • 한국재료학회지
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    • 제6권6호
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    • pp.605-609
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    • 1996
  • MOS 소자의 얇은산화막(thin oxide)불량을 화학적으로 식각하지 않고 불량부위를 광전자방사(photon emission)반응을 이용하여 위치를 확인하고, 이곳을 FIB로 절단하여 불량부위의 단면을 관찰했다. 20nm 두께의 SiO2불량은 셀(cell)영역의 위치에 따른 의존성은 없고, 불량은 저전계의 입자(particle)성 불량과 중간전계의 Si 기판 핏(pit)과 관련된 불량이 주였다. 고전계에서는 전형적인 SiO2 산화막의 절연파괴가 일어난 것이 관찰된다.

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