• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.05a
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• pp.24-37
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• 1999

A comprehensive methodology to consolidate the hypereutectic Al-27Si-X alloy via spray forming was investigated in an attempt to judge the feasiblilty of this alloy in applying wear resistant components. Billets having desired shape and microstructures were fabricated using forming parameters obtained from numerical calculations. Prior to tube extrusion of the spray formed billets, effects of various extrusion conditions, such as extrusion ratio, die temperature, and die configuration, on microstructures of the billet were studied. Based on results obtained from the preliminary extrusion tests, the formed billets were then hot extruded into a tubular shape. Various material properties of the extruded billet were measured and compared with the other candidate materials for anti-wear applications.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.6
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• pp.785-792
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• 2011

Equal channel angular(ECA) pressing is the established processing technique in which a polycrystalline metal is pressed through the die to achieve a very high plastic strain. Therefore, the capability to produce an ultra-fine grain size in the materials is provided. To investigate that mechanical properties at elevated temperature have the ultrafine grain ECA pressing, experiments were conducted on an Al-4.8% Mg-0.07% Mn-O.06% Si alloy. After having been solution treated at 773K for 2hrs, the billet for ECA pressing was inserted into the die. And it was pressed through two channel of equal to cross section intersecting at a 90 degree angle. The billet can be extrude repeatedly because of 1:1 extrusion ratio. Since the billet is passed through the cannel for 2 times, a large strain is accumulated in the alloy. The tensile tests on elevated temperature were carried out with initial strain rate of $10^{-3}s^{-1}$ at eight temperature distributed from 293K to 673K.

• Transactions of the Korean Society of Automotive Engineers
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• v.23 no.6
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• pp.656-662
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• 2015

In the present study, multi-layered Si DLC (Silicon Diamond-Like Carbon) coatings with HMDSO (Hexamethyldisiloxane) buffer layers are applied on SKD 11 substrates by PECVD (Plasma Enhanced Chemical Vapor Deposition) with different HMDSO gas flow rates, while the gas flow rate of $C_2H_2$ is fixed to enhance the electric resistivity of forming dies for electrically assisted forming. The HMDSO buffer layer is introduced to increase adhesion between the base metal and Si-DLC layers. The result of evaluation of electric resistivity and adhesion strength shows that the properties are affected by the flow rate of HMDSO, while the flow rate of 80 sccm results in the coating with the highest electric resistivity and adhesion strength among the selected flow rates.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.54-56
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• 2005

Ultrasonic soldering using of Si-wafer to FR-4 PCB atroom temperature was investigated. Sn3.5Ag foil rolled $100{\mu}m$ was used for solder. The UBM of Si-die was Cu/ Ni/ Al from top to bottom and its thickness was $0.4{\mu}m$, $0.4{\mu}m$, $0.3{\mu}m$ respectively. Pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom and its thickness was $0.05{\mu}m$, $5{\mu}m$, $18{\mu}m$ respectively. The ultrasonic soldering time was changed from 0.5sec to 3.0sec and its power 1400W. As experimental result, reliable bond joint by ultrasonic at room temperature was obtained. The shear strength increased with soldering time up to 2.5 sec. That means at 2.5sec, the shear strength showed maximum rate of 65.23N. The strength decreased to 33.90N at 3.0 sec because the cracks generated along the intermetallic compound between Si-wafer and Sn-3.5mass%Ag solder. intermetallic compound produced by ultrasonic between the solder and the Si-die was $(Cu, Ni)_{6}Sn_{5}$ and the intermetallic compound between solder and pad on FR-4 was $(Ni, Cu)_{3}Sn_{4}$.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.393-396
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• 2005

This paper is concerned with the drawing process of $Al-1\%Si$ bonding wire. In this study, the finite-element model established in previous work was used to analyze the effect of various forming parameters, which included the reduction in area, the semi-die angle, the aspect ratio, the inter-particle spacing and orientation angle of the fine Si particle in drawing processes. The finite-element results gave the consolidation condition. From the results of analysis, the effects of each forming parameter were determined. It is possible to obtain the Important basic data which can be guaranteed in the fracture prevention of $Al-1\%Si$ wire by using FE-Simulation.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.138-140
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• 2001

Fluxless flip chip bonding using plasma & ultrasonic wave was investigated in order to evaluate the effect of plasma & ultrasonic treatment on the bondability of the Sn-3.5wt%Ag solder bumped die to TSM-coated glass substrate. The $Ar+10%H_2plasma$ was effective in removing tin oxide on solder surface. The die shear strength of the plasma-treated Si-chip is higher than that of non-treated specimen but lower than that of specimen bonded with flux. The die shear strength with the bonding load at 25W ultrasonic power increased to 0.8N/bump for all bonding temperature but decreased above 1.0N/bump.

• Journal of the Korean institute of surface engineering
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• v.53 no.6
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• pp.322-329
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• 2020

The utilization of aluminum scrap is a subject of great importance in terms of reducing energy consumption and environmental protection. However, aluminum scrap contains impurities, which can degrade the properties of aluminum alloy, especially corrosion resistance. This study examines the effect of scrap charge rate of aluminum alloys about microstructures and corrosion characteristics. According to the metallographic examinations, Mg2Si tended to become coarser and its uniformity was decreased by increasing aluminum scrap charge rate. The immersion test exhibited corrosion progressed through the eutectic areas due to micro-galvanic interactions. Electrochemical measurements revealed that excess aluminum scrap could reduce the intergranular corrosion resistance of aluminum alloys. Results showed that the scrap charge rate is important factor in the design of corrosion resistance of aluminum die casting alloys.

• Journal of the Korean Society for Heat Treatment
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• v.35 no.2
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• pp.66-73
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• 2022

Partial-hardened hot stamping has been well known to be very effective to absorb more energy in automotive lateral crash. Hardness distribution and dimensional change after partial-hardened hot stamping have been studied to find out effect of thermal deformation of the heated hot stamping die on dimensional accuracy of automotive center pillar. Soft zone of commercial center pillar showed 275~345 in Vickers hardness, indicating bigger non-uniformity which resulted from thermal deformation of heated die. Dimensional changes in soft zone of the commercial center pillar measured by three dimensional scanner were much bigger than that in hard zone. It has been found that hot stamping die compensation considering thermal deformation in soft zone causes a significant decrease in hardness deviation in the soft zone, corresponding to 20 percent of commercial center pillar and subsequently leads to much higher dimensional accuracy.

• Transactions of Materials Processing
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• v.9 no.1
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• pp.52-58
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• 2000

Hot precision forging with a back pressure was investigated for manufacturing of compressor parts made of Al-Si alloy. Disk-shaped blank made of Al-Si alloy was hot forged, and ribs were formed by loading back pressure on their top. The influence of the back pressure and die temperature on forgeability and properties of parts made of Al-Si alloy were examined. Using the F.E.M. simulation, we found the optimum vallue of back-pressure. The prototypes of scroll parts were forged into the near-net shape and satisfied the required properties.