• Title/Summary/Keyword: Si die

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A study on slit opening and flexural strength of carbon/epoxy prepregs with slit patterns (슬릿 패턴 형상에 따른 Carbon/Epoxy 프리프레그 성형물의 굽힘 강도 특성 및 슬릿 변형량 분석)

  • Lee, Sung-Gyun;Won, Si-Tae;Yoon, Gil-Sang;Kim, Yong-Dae;Kim, Dong-Earn
    • Design & Manufacturing
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    • v.10 no.2
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    • pp.6-11
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    • 2016
  • Designed patterns of slit are introduced to the uni-directional (UD) prepreg in order to enhance the formability of the carbon/epoxy composites without wrinkling and laddering. Three different types of the slit alignment along the thickness direction are applied to analyse the deformation behavior during the compression moulding process of laminates. Degrees of the slit open and the mechanical strength are evaluated based on the level of the compaction pressure in the course of forming process. Results have shown that the mechanical strength of laminates having slits could attain at least 80% of the conventional ones without slits. However, further studies are required to identify the direct relevance of the slit alignment in laminate to the mechanical properties.

A study on the contactless generator and recharge system for a bicyle (비접촉식 자전거 발전기 및 충전 시스템 개발에 관한 연구)

  • Park, Wang-Geun;Won, Si-Tae
    • Design & Manufacturing
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    • v.11 no.2
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    • pp.29-36
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    • 2017
  • In this study, the non-contact type bicycle generator system considering the recharge is developed to use the eco-friendly energy source when the bicycle is operating. The following three main factors are considered in this study. One of factors is that the intensity of the rotating magnet is in the range of 2,700~4,300 [Gause]. The next factor is that the separation distance of rotating magnet and bicycle rim is in the range of 1.5-3.0 mm. The last factor is that the pedaling speed is in the range of 55 RPM [Wheel speed 5.6Km]~150 RPM [Wheel speed 15.25Km] consirering with the 5 staged gear transmission. The obtained results are as followed. (1) The generator output voltage gradually increases from 3V to 10V with the pedaling speed increases, at the separation distance is less than 2.5 mm and the operating voltage of the LED lamp is generated at a pedaling speed of 60 RPM or more. (2) The output current of the generator increases from 20mA to 40mA with the pedaling speed increases, at a separation distance is less than 2.0 mm and the operating current of the LED lamp is generated at a pedaling speed of 60 RPM or more. (3) When the separation distance was 3.0 mm, the output voltage and current are significantly lower than those of the bicycle LED lamp is generated. (4) The charging time is expected to be 12.24 ~ 17.65 hours when the magnitude of the magnet is 3,400[Gauss] at a pedaling speed of 55 RPM or more. (5) As a result of this study, it is thought that the non-contact type bicycle generator system considering the recharge can replace the conventional friction power generation system.

Copper Filling to TSV (Through-Si-Via) and Simplification of Bumping Process (비아 홀(TSV)의 Cu 충전 및 범핑 공정 단순화)

  • Hong, Sung-Jun;Hong, Sung-Chul;Kim, Won-Joong;Jung, Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.3
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    • pp.79-84
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    • 2010
  • Formation of TSV (Through-Si-Via) with an Au seed layer and Cu filling to the via, simplification of bumping process for three dimensional stacking of Si dice were investigated. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process using $SF_6$ and $C_4F_8$ plasmas alternately. The vias were 40 ${\mu}m$ in diameter, 80 ${\mu}m$ in depth, and were produced by etching for 1.92 ks. On the via side wall, a dielectric layer of $SiO_2$ was formed by thermal oxidation, and an adhesion layer of Ti, and a seed layer of Au were applied by sputtering. Electroplating with pulsed DC was applied to fill the via holes with Cu. The plating condition was at a forward pulse current density of 1000 mA/$dm^2$ for 5 s and a reverse pulse current density of 190 mA/$dm^2$ for 25 s. By using these parameters, sound Cu filling was obtained in the vias with a total plating time of 57.6 ks. Sn bumping was performed on the Cu plugs without lithography process. The bumps were produced on the Si die successfully by the simplified process without serious defect.

Effects of the Solid Solution Treatment Conditions and Casting Methods on Mechanical Properties of Al-Si-Cu Based Alloys (Al-Si-Cu계 합금의 주조법과 용체화처리 조건이 기계적 특성변화에 미치는 영향)

  • Moon, Min-Kook;Kim, Young-Chan;Kim, Yu-Mi;Choi, Se-Weon;Kang, Chang-Seog;Hong, Sung-Kil
    • Journal of Korea Foundry Society
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    • v.38 no.6
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    • pp.111-120
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    • 2018
  • In this study, the effects of two different casting methods (gravity casting and, diecasting) and various solid-solution conditions on the mechanical properties of ASC (Al-10.5wt%Si-1.75wt%Cu) and ALDC12 (Al-10.3wt%Si-1.72wt%Cu-0.76wt%Fe-0.28wt% Mn-0.32wt%Mg-0.9wt%Zn) alloys were investigated. A thermodynamic solidification analysis program (PANDAT) was used to predict the liquidus, solidus, and phases of the used alloys. In the results of an XRD analysis, ${\beta}$-AlFeSi peaks were observed only in the ALDC12 alloy regardless of the casting method or SST (solid-solution treatment) conditions. However, according to the results of a FE-SEM observation, both ${\theta}(Al_2Cu)$ and ${\beta}$-AlFeSi were found to exist besides ${\alpha}$-Al and eutectic Si in the gravity-casted ASC alloy at $500^{\circ}C$ after a SST of 120min. The ${\alpha}$-AlFeSi and ${\beta}$-AlFeSi phases including the eutectic phases were also found to exist in the ALDC12 alloy. The results of a microstructural observation and analyses by XRD, FE-SEM and EDS were in good agreement with the PANDAT results. The gravity-casted ALDC12 and ASC specimens showed the highest Y.S. and UTS values after aging for three hours at $180^{\circ}C$ after a SST at $500^{\circ}C$ for 30min. At longer solid-solution treatment times at $500^{\circ}C$ in the gravity-casted ALDC12 and ASC specimens, the elongations of the ASC alloys increased, whereas they decreased slightly in the ALDC12 alloys.

High Power W-band Power Amplifier using GaN/Si-based 60nm process (GaN/Si 기반 60nm 공정을 이용한 고출력 W대역 전력증폭기)

  • Hwang, Ji-Hye;Kim, Ki-Jin;Kim, Wan-Sik;Han, Jae-Sub;Kim, Min-Gi;Kang, Bong-Mo;Kim, Ki-chul;Choi, Jeung-Won;Park, Ju-man
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.22 no.4
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    • pp.67-72
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    • 2022
  • This study presents the design of power amplifier (PA) in 60 nm GaN/Si HEMT technology. A customized transistor model enables the designing circuits operating at W-band. The all matching network of the PA was composed of equivalent transformer circuit to reduce matching loss. And then, equivalent transformer is several advantages without any additional inductive devices so that a wideband power characteristic can be achieved. The designed die area is 3900 ㎛ × 2300 ㎛. The designed results at center frequency achieved the small signal gain of 15.9 dB, the saturated output power (Psat) of 29.9 dBm, and the power added efficiency (PAE) of 24.2% at the supply voltage of 12 V.

Characteristics of $Al_2O_3$ Short Fiber/Al-Si-Mg Alloy Composites Fabricated by Rheo-compocasting and Hot Extrusion (Rheo-compocasting 및 열간압출에 의하여 제조한 Al-Si-Mg / $Al_2O_3$단섬유강화복합재료의 특성)

  • Lee, Hag-Ju;Hong, Chun-Pyo
    • Journal of Korea Foundry Society
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    • v.11 no.4
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    • pp.293-302
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    • 1991
  • Aluminum alloy matrix composites reinforced with various amounts of $Al_2O_3$ short fibers have been produced by a combined technique of rheo-compocasting and hot extrusion. Distribution of fibers in the composites fabricated by rheo-compocasting was relatively uniform. A good degree of uniaxial fiber alignment has been achieved by hot extrusion, but a lot of fibers fractured during extrusion. The tendency of fiber fracturing increases as the aspect ratio and the amount of fibers increase. Relatively good bonding between fiber and matrix was obtained by the formation of $MgAl_2O_4$ and Mg(Al, Fe)$_2O_4$ at the interface between fiber and matrix. In extruded composites, fiber-strengthening effect was relatively small since a lot of fibers fractured during hot extrusion. On the other hand, dispersion strengthening effect may increase. In order to improve the fiber strengthening effect, it is important to optimize the extrusion condition with consideration of metal flow in extrusion die.

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A Study on Cutting Conditions and Finishing Machining of Si Material Using Laser Assisted Module (레이저 보조 모듈을 이용한 Si 소재의 절삭조건 및 보정가공에 관한 연구)

  • Young-Durk Park
    • Design & Manufacturing
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    • v.17 no.2
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    • pp.15-21
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    • 2023
  • In this study, a diamond turning machine and a laser-assisted machining module were utilized for the complex combined cutting of aspheric shapes and fine patterns on the surface of high-hardness brittle material, silicon. The analysis of material's form accuracy and corrective machining was conducted based on key factors such as laser output, rotational speed, feed rate, and cutting depth to achieve form accuracy below 1 ㎛ and surface roughness below 0.1 ㎛. The cutting condition and corrective machining methods were investigated to achieve the desired form accuracy and surface roughness. The rotational speed of the spindle and the linear feed rate of the diamond turning machine were varied in five stages for the cutting condition test. Surface roughness and form accuracy were measured using both a contact surface profilometer and a non-contact surface profilometer. The experimental results revealed a tendency of improved surface roughness with increased rotational speed of the workpiece, and the best surface roughness and form accuracy were observed at a feed rate of 5 mm/min. Furthermore, based on the cutting condition experiments, corrective machining was performed. The experimental results demonstrated an improvement in form accuracy from 0.94 ㎛ to 0.31 ㎛ and a significant reduction in the average value of the surface roughness curve from 0.234 ㎛ to 0.061 ㎛. This research serves as a foundation for future studies focusing on the machinability in relation to laser output parameters.

The Restoration of Forest Fire Area in Kagawa Prefecture, Japan (일본 가가와현 산불피해지의 복구대책)

  • Chun, Kun-Woo;Lee, Si-Young;Lim, Young-Hyup;Kakihara, Toshiko;Ezaki, Tsugio
    • 한국방재학회:학술대회논문집
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    • 2007.02a
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    • pp.238-241
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    • 2007
  • The forest seemed apparently to die on the forest fire area in Honjima, Kagawa Prefecture, Japan. However, the soil that became growing basic of vegetation hardly suffered damage, and the forest recovery was started by the sprout, etc. in the next year. For restoration of forest fire area, the fascine mulching works and log barrier works using the damaged trees were used for the upper-stream, and chack dam and erosion control dam were set up in the downstream. Also, the forest restoration was tried with the plants and the microorganism that inhabit in Honjima to preserve a peculiar forest ecosystem.

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Compact Wilkinson Power Divider Design and Fabrication Using IPD Technology

  • Li, De-Zhong;Wang, Cong;Kyung, Gear Inpyo;Kim, Nam-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.406-407
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    • 2009
  • In this paper, presents the Wilkinson power divider used integrated passive device (IPD) technology with excellent performance for personal communication services (PCS). The insertion loss of this power divider is 0.4 dB and the port isolation greater than 25 dB over the entire band. Return losses input and output ports are 18 dB and 19 dB, respectively. The power divider based on SI-GaAs substrate is designed within die size of about $0.775\times0.53\;mm^2$.

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A Simple Dual Band Filter Design with 0603 Case Size using IPD Technology for 1.8 GHz and 2.5 GHz DC-block Application

  • Li, De-Zhong;Wang, Cong;Kyung, Gear Inpyo;Kim, Nam-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.385-386
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    • 2008
  • In this paper, a simple dual band filter chip is designed with 0603 case size using IPD technology. The dual-band filter achieves high frequency band at 2.5 GHz and low frequency band at 1.8 GHz. The insertion losses in high frequency band and low frequency band are -0.195 dB and -0.146 dB, respectively. The return losses in these bands are -22.7 dB and -22.8 dB, respectively. The simple dual-band filter based on SI-GaAs substrate is designed within die size of about 1.3 $mm^2$.

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