• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2000.04a
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• pp.56-62
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• 2000

Semi-solid forming process has some advantages such as successful manufacturing of high quality components with less inner defects suitable for less machining high productivity and energy-saving effect. the thixotropic behavior(solid-like in the unperturbed state and liquid-like during shearing) has been the basis for the semi-solid forming process. The main focus of this article is the investigation of the effect of T6 heat treatment and alloying elements on the mechanical properties in the semi-solid formed products using thixotropic hypoeutectic (A357 and ALTHIX 86S) and hypereutectic(A390) materials. The new methods to produce semi-solid formed components with high quality are also proposed and discussed in terms of a die design and the development of a lubricant.

• Journal of Korea Foundry Society
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• v.18 no.5
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• pp.450-461
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• 1998

The optimal reheating conditions to apply the thixoforging and semi-solid die casting process were investigated by changing the reheating time, the holding time, the reheating temperatures, the capacity of the induction heating system, and the adiabatic material size. In the case of solid fraction fs=50% (for semi-solid die casting), the microstructure of SSM (specimen size:$d76{\times}l90$) at the condition of the first elevating time of 4 min, holding time of 1 min and holding temperature of $350^{\circ}C$, the second elevating time of 3 min, holding time of 3 min and holding temperature of $575^{\circ}C$, the third elevating time of 1 min, holding time of 2 min and holding temperature of $584^{\circ}C$, capacity of Q=8.398KW is obtained with globular microstructure and finest. In addition, in the case of solid fraction fs=55% (for thixoforging), the SSM (specimen size:$d76{\times}l90$) at the condition of the first elevating time of 4 min, holding time of 1 min and holding temperature of $350^{\circ}C$, the second elevating time of 3 min, holding time of 3 min and holding temperature of $570^{\circ}C$, the third elevating time of 1 min, holding time of 2 min and holding temperature of $576^{\circ}C$, capacity of Q=12.04KW is obtained with the finest globular microstructure. We saw that the most important factor in a three-step reheating process is the final holding time.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.3
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• pp.232-238
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• 2008

In this paper, a wideband power efficient 2.2 GHz - 4.9 GHz Medium Power Amplifier (MPA), has been designed and fabricated using $0.8{\mu}m$ SiGe BiCMOS process technology. Passive elements such as parallel-branch spiral inductor, metal-insulator-metal (MIM) capacitor and three types of resistors are all integrated in this process. This MPA is a two stage amplifier with all matching components and bias circuits integrated on-chip. A P1dB of 17.7 dBm has been measured with a power gain of 8.7 dB at 3.4 GHz with a total current consumption of 30 mA from a 3 V supply voltage at $25^{\circ}C$. The measured 3 dB bandwidth is 2.7 GHz and the maximum Power Added Efficiency (PAE) is 41 %, which are very good results for a fully integrated Medium PA. The fabricated circuit occupies a die area of $1.7mm{\times}0.8mm$.

• Journal of the Korean Society for Heat Treatment
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• v.10 no.1
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• pp.20-29
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• 1997

Pure copper is widely used for base material for electrical and electronic parts because of its good electrical conductivity. However, it has such a low strength that various alloying elements are added to copper to increase its strength. Nevertheless, alloying elements which exist as solid solution elements in copper matrix severely reduce the electrical conductivity. The reduction of electrical conductivity can be minimized and the strengthening can be maximized by TMT(Thermo-Mechanical Treatment) in copper alloys. In this research, the effects of TMT on mechanical and electrical properties of Cu-Ni-Al-Si-P, Cu-Ni-Al-Si-P-Zr and Cu-Ni-Si-P-Ti alloys aged at various temperatures were investigated. The Cu alloy with Ti showed the hardness of Hv 225, electrical conductivity of 59.8%IACS, tensile strength of 572MPa and elongation of 6.4%.

• Convergence Security Journal
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• v.20 no.4
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• pp.153-159
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• 2020

Rebels emerge after the late Joseon. Hong Gyung-rae will fight against the military by gathering dissatisfaction forces with regional and status discrimination. Gasan supervisor Jung - Si in the first battle. He urged him to surrender and participate in the rebellion, but Jung - Si refused to die. Surrounding officials did not protest and surrendered to the rebels. When Hong Gyeong-rae's rebellion subsided, the most damaging thing was the death of 2,000 people who were deceived and joined by Hong Gyeong-rae's propaganda. There would have been no death of the innocent people if the officials in charge of the government had actively defended them at the beginning of the rebellion. There is a need for a historical study on the time of the Gasan supervisor Jung-Si, who refused to surrender to the rebels and fought with death.

• Transactions of Materials Processing
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• v.11 no.1
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• pp.45-53
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• 2002

The forming process of metal matrix composites by die casting and squeeze casting process are limited in size and dimension In term of final parts. The melt strirring method have the problems that the homogeneous distribution of the reinforcements is difficult due to the low weldability and the density difference between the molten metal and the reinforcement. The thixoforming process for metal matrix composites has numerous advantages compacted to die casting, squeeze casting and compocasting. However, for the thixofoming process, the billet with the desired volume fraction must be heated to obtain a uniform temperature distribution over the entire cross-sectional areas. To obtain the reheating conditions of composites, the particulate reinforced metal matrix composites for thixoforming were fabricated by combined stirring process which is simultaneously performed with electro-magnetic stirring and mechanical stirring process. The matrix alloy and reinforcement are used to aluminum alloy(A357) and SiCp with diameter 14, $25{\mu}m$, respectively. The microstructure characteristics were investigated by changing the volume fraction and reinforcement size. The heating conditions to obtain the uniform temperature distribution in cross section area of fabricated metal matrix composites billet are proposed with heating time, the heating temperature and the holding time.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.64.1-64.1
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• 2011

LCD 디스플레이 등에 사용되는 글래스 패널 위에 bare si die를 직접 실장하는 COG 플립칩 패키지의 경우 Au 범프와 ITO 패드 간의 전기적 접속 및 접합부 신뢰성 확보를 위해 접속소재로서 ACF (anisotropic conductive film)가 사용되고 있다. 그러나 ACF는 고가이고 접속피치 미세화에 따라 브릿지 형상에 의한 쇼트 등의 문제가 발행할 수 있어 NCP (non-conductive paste)의 상용화가 요구되고 있다. 본 연구에서는 NCP를 적용한 COG 패키지에 있어서 온도, 압력 등의 열압착 본딩 조건과 NCP 물성이 Au-ITO 접합부의 전기적 및 기계적 특성에 미치는 영향을 조사하였다. NCP는 에폭시 레진과 경화제, 촉매제를 사용하여 다양하게 포뮬레이션을 하였고 DSC (Differential Scanning Calorimeter), TGA (Thermogravimetric Analysis), DEA (Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화 거동을 확인하였다. 테스트 베드는 면적 $5.2{\times}7.2\;mm^2$, 두께 650 ${\mu}m$, 접속피치 200 ${\mu}m$의 Au범프가 형성된 플립칩 실리콘 다이와 접속패드가 ITO로 finish된 글래스 기판을 사용하였다. 글래스 기판과 실리콘 칩은 본딩 전 PVA Tepla사의 Microwave 플라즈마 장비로 Ar, $O_2$ 플라즈마 처리를 하였으며, Panasonic FCB-3 플립칩 본더를 사용하여 본딩하였다. 본딩 후 접합면의 보이드를 평가하고 die 전단강도로 접합강도를 측정하였다.

• Journal of Korea Foundry Society
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• v.31 no.6
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• pp.354-361
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• 2011

The liquid metal shearing device was constructed and assembled with a commercial high-pressure die-caster in order to induce intensive turbulent shearing force on molten aluminum alloys. The effect of the liquid metal shearing on the microstructure and tensile properties of A356 alloys was investigated with the variation of iron content. The experimental results show that dendritic primary ${\alpha}$-Al phase was effectively modified into a equiaxed form by the liquid metal shearing. It was also found that the needle-like ${\beta}$-AlFeSi phase in a Fe containing A356 alloy was changed into a blocky shape resulting in the improved mechanical properties. Based on the mechanical properties, it was suggested that the iron content in A356 alloy could be more widely tolerated by utilizing the liquid metal shearing HPDC process.

• Journal of the Korean Ceramic Society
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• v.50 no.3
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• pp.186-194
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• 2013

The relationship between composition and properties of enamel glass was investigated by introducing a mixture design. The enamel glass was manufactured by mixing various components under the following constraints: $45{\leq}SiO_2{\leq}55$, $10{\leq}B_2O_3{\leq}18$, $6{\leq}Na_2O{\leq}15$, $1{\leq}Li_2O{\leq}6$, $5{\leq}K_2O{\leq}10$, $0{\leq}TiO_2{\leq}8$, $0{\leq}ZrO_2{\leq}8$, 13.3MO (mol %). A mathematical model for the calculation of some properties of enamel glasses as a function of their composition was developed by the experimental statistical method. The results showed that the proposed model with the experimental measurement were in good agreement and the mixture experimental design was an effective method for optimizing the composition of the enamel glass with respect to its properties.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.