• The Bulletin of The Korean Astronomical Society
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• v.36 no.2
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• pp.125.2-125.2
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• 2011

We are developing medium resolution cross-dispersed silicon grisms in the near IR region ($1.45{\sim}5.2{\mu}m$). The grisms will be installed in MIMIR, a multifunction instrument at the Lowel Observatory, USA. The two devices are designed to cover H and K band and L and M band simultaneously. Our goal is to make grism with R=3000 at 1.2 arcsec slit. The Silicon has high refractive index (n=3.4 at $1.5{\mu}m$) which enhances the resolving power by up to 5 times when compared to conventional material such as BK-7 (n=1.5 at 1.5 ${\mu}m$). The bonded grisms will be installed in a filter wheel for the uses switch from spectroscopic mode to imaging mode easily. Our device is compact and light weighted while it provides a decent resolving power. We produce monolithic grisms using e-beam lithography at the NASA JPL and chemically etching the grooves on the silicon prisms. Moreover, the main-disperser and cross-disperser will be contacted together by direct Si-Si bonding technique and eventually turn into one piece. The bonded pair offers more stability in terms of the layout of the spectrum and removes the Fresnel loss at the intersection of two grisms. We report on the proper wafer bonding steps through this research, and inspected the bonding quality thermally, optically and mechanically.

• Journal of the Korean Ceramic Society
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• v.41 no.1
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• pp.13-18
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• 2004

$La_{0.5}Sr_{0.5}CoO_3$ (LSCO) electrodes were prepared on ferroelectric $Sr_{0.9}Bi_{2.1}Ta_2O_9$(SBT) thin films by spin coating method using photosensitive sol-gel solution. Self-patterning technique of photosensitive sol-gel solution has advantages such as simple manufacturing process compared to photoresist/dry etching process. Lanthanum(III) 2-methoxyethoxide, Stronitium diethoxide. Cobalu(II)2-methoxyethoxide were used as starting materials for LSCO electrode. UV irradiation on LSCO thin films lead to decrease solubility by M-O-M bond formation and the solubility difference allows us to obtain self-patternine. There was little composition change of the LSCO thin films between before leaching and after leaching in 2-methoxyethanol. The lowest resistivity of LSCO thin films deposited on $SiO_2$/Si substrate was $1.1{\times}10^{-2}{\Omega}cm$ when the thin film was ennealed at $740^{\circ}C$. The values of Pr/Ps and 2Pr of LSCO/SBT/Pt capacitor on the applied voltage of 5V were 0.51, 8.89 ${\mu}C/cm^2$, respectively.

• Journal of the Korean Ceramic Society
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• v.43 no.4 s.287
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• pp.235-241
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• 2006

Mullite short fibers have been fabricated by adapting the Kneading-Drying-Calcination (KDC) process and characterized. The effect of the addition of foaming agent and calcination temperature on the formation of mullite fibers from coal fly ash, was examined. In the present work, ammonium alum $NH_4Al(SO_4)_2\;12H_2O$ synthesized trom coal fly ash and sodium phosphate $Na_2HPO_4\;2H_2O$ were used as foaming agents. After calcination at $1300^{\circ}C$ for 10 h and then etching with 20% HF solution at $50^{\circ}C$ for 5 h using a microwave heating source, the alumina-deficient $(AI_2O_3/SiO_2$ = 1.13, molar ratio) orthorhombic mullite fibers with a width of ${\sim}0.8mm$ (aspect ratio >30), were prepared from the coal fly ash with $AI_2O_3/SiO_2$ = 0.32, molar ratio by the addition of $NH_4AI(SO_4)_2\;12H_2O$, and with further addition of 2 wt% sodium phosphate. The excessive addition of sodium phosphate rather decreased the formation of mullite fibers, possibly due to the large amount of liquid phase prior to mullitization reaction.

• Journal of the Korean Magnetics Society
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• v.16 no.1
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• pp.75-78
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• 2006

In case of contacts between semiconductor and metal in semiconductor circuits, they become unstable because of thermal budget. To prevent these problems, we use diffusion barrier that has a good thermal stability between metal and semiconductor. So we consider the diffusion barrier to prevent the increase of contact resistance between the interfaces of metals and semiconductors, and the increase of resistance and the reaction between the interfaces. In this paper we deposited tungsten boron carbon nitride (W-B-C-N) thin film on silicon substrate. The impurities of the $1000\;{\AA}-thick$ W-B-C-N thin films provide stuffing effect for preventing the inter-diffusion between metal thin films $(Cu-2000\;{\AA})$ and silicon during the high temperature $(700\~1000^{\circ}C)$ annealing process.

• Korean Journal of Optics and Photonics
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• v.18 no.2
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• pp.149-154
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• 2007

Bragg reflecting waveguide devices have been fabricated on a flexible polymer substrate utilizing a post lift-off process which could Provide excellent uniformity of grating Patterns on Plastic film. The 510 m Period Bragg grating pattern is made by two methods. In the first sample the grating is fabricated by exposing the laser interference pattern on a photoresist, and then it is inscribed by $O_2$ plasma etching. The grating pattern of the second sample is formed by a PDMS soft mold imprinting process. The selective adhesion property of SU-8 material for Au and Si surfaces is utilized to prepare a 100-mm thick plastic substrate. Single mode waveguide is fabricated on the plastic substrate using polymer materials with refractive indices of 1.540 and 1.430 for the core and the cladding layers, respectively. The Bragg grating on Plastic substrate does not show any degradation in its spectral response compared to the reference sample made on a silicon wafer.

• Korean Journal of Crystallography
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• v.7 no.2
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• pp.175-182
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• 1996

ZnO thin films were deposited on Corning 7059 glass substrates to study fundamental properties of films. According to the experimental results, (002) preferred ZnO thin films were grown by purging Ar/O2 mixed gas, but not without oxygen gas. The structure and the orientation of ZnO thin films were much affected by the substrate temperature and rf power. High quality ZnO films were obtained by increasing their values. Optimum deposition parameters were : 300W rf power, 300℃ substrate temperature, Ar/O2=70/30. To characterize SAW propagation properties, IDT was fabricated by etching Al films deposited on diamond/Si wafer with RIE. Measured λ(wavelength) was 24μm and experimental results were well matched with simulation. Center frequency was 250MHz, and the calculated phase velocity of ZnO/ diamond structure was about 6000m/s.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.28.1-28.1
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• 2009

The superior properties of ZnO such as high exciton binding energy, high thermal and chemical stability, low growth temperature and possibility of wet etching process in ZnO have great interest for applications ranging from optoelectronics to chemical sensor. Particularly, vertically well-aligned ZnO nanorods on large areas with good optical and structural properties are of special interest for the fabrication of electronic and optical nanodevices. Currently, low-dimensional ZnO is synthesized by metal-organic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE), thermal evaporation, and sol.gel growth. Recently, our group has been reported about achievement the growth of Ga-doped ZnO nanorods using ZnO seed layer on p-type Si substrate by RF magnetron sputtering system at high rf power and high growth temperature. However, the crystallinity of nanorods deteriorates due to lattice mismatch between nanorods and Si substrate. Also, in the growth of oxide using sputtering, the oxygen flow ratio relative to argon gas flow is an important growth parameter and significantly affects the structural properties. In this study, Phosphorus (P) doped ZnO nanorods were grown on c-sapphire substrates without seed layer by radio frequency magnetron sputtering with various argon/oxygen gas ratios. The layer change films into nanorods with decreasing oxygen partial pressure. The diameter and length of vertically well-aligned on the c-sapphire substrate are in the range of 51-103 nm and about 725 nm, respectively. The photoluminescence spectra of the nanorods are dominated by intense near band-edge emission with weak deep-level emission.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.64-64
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• 2000

Since its discovery in 1991, the carbon nanotube has attracted much attention all over the world; and several method have been developed to synthesize carbon nanotubes. According to theoretical calculations, carbon nanotubes have many unique properties, such as high mechanical strength, capillary properties, and remarkable electronical conductivity, all of which suggest a wide range of potential applications in the future. Here we report the synthesis in the catalytic decomposition of acetylene at ~65 $0^{\circ}C$ over Ni deposited on SiO2, For the catalyst preparation, Ni was deposited to the thickness of 100-300A using effusion cell. Different approaches using porous materials and HF or NH3 treated samples have been tried for synthesis of carbon nanotubes. It is decisive step for synthesis of carbon nanotubes to form a round Ni particles. We show that the formation of round Ni particles by heat treatment without any pre-treatment such as chemical etching and observe the similar size of Ni particles and carbon nanotubes. Carbon nanotubes were synthesized by chemial vapour deposition ushin C2H2 gas for source material on Ni coated Si substrate. Ni film gaving 20~90nm thickness was changed into Ni particles with 30~90nm diameter. Heat treatment of Ni fim is a crucial role for the growth of carbon nanotube, High-resolution transmission electron microscopy images show that they are multi-walled nanotube. Raman spectrum shows its peak at 1349cm-1(D band) is much weaker than that at 1573cm-1(G band). We believe that carbon nanotubes contains much less defects. Long carbon nanotubes with length more than several $\mu$m and the carbon particles with round shape were obtained by CVD at ~$650^{\circ}C$ on the Ni droplets. SEM micrograph nanotubes was identified by SEM. Finally, we performed TEM anaylsis on the caron nanotubes to determine whether or not these film structures are truly caron nanotubes, as opposed to carbon fiber-like structures.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.293-293
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• 2010

최근 태양전지 연구에서 저가격화를 실현하는 방법 중 하나로 폐 실리콘 웨이퍼를 재생하는 방법에 관하여 많은 연구가 진행되고 있다. 그러나 기존 웨이퍼 재생공정은 높은 재처리 비용과 복잡한 공정등의 많은 단점을 가지고 있다. 챔버 내에 압축된 공기나 가스에 의해 가속된 미세 파우더들이 재료와 충돌하면서 식각하는 기계적 건식 식각 공정 기술이라고 할 수 있는 micro blaster 공정을 이용하면 기존 재생공정보다 낮은 재처리 비용과 간단한 공정으로 재생웨이퍼를 제작할 수 있다. 하지만 이러한 micro blaster 공정은 식각 후 표면에 많은 particle과 crack을 형성시켜 태양전지용으로 사용하기에 단점을 가진다. 본 연구에서는 이러한 micro blaster를 이용한 태양전지용 재생 웨이퍼를 제작하기 위해 폐 실리콘 웨이퍼의 표면 물질을 식각하고, 식각 후 충돌에 의해 발생된 표면의 particle과 crack을 DRE(Damage Remove Etching)공정으로 제거하는 연구를 진행 하였다. 먼저 폐 실리콘 웨이퍼와 같은 표면을 형성하기 위하여 시편 표면에 각각 Al($2000{\AA}$), $Si_3N_4(3000{\AA})$, $SiO_2(1{\mu}m)$, AZ1512($1{\mu}m$)을 형성하고 micro blaster의 파우더 크기, 압력, 스캔 속도 등의 공정 조건에 따라 폐 실리콘 웨이퍼 표면 물질을 식각하였다. 식각 후 폐 실리콘 웨이퍼의 식각된 깊이와 표면 물질 잔량을 측정하고, 폐 실리콘 웨이퍼의 표면에 particle과 crack, 요철이 형성되어 있는지를 확인하였다. 그 결과 폐 실리콘 웨이퍼에 형성된 물질의 두께 이상으로 식각되었으며, 표면 물질의 잔량이 남아 있지 않았고, 표면에 많은 particle과 crack, 요철이 형성되었다. 표면에 형성된 요철은 유지하면서 많은 particle과 crack을 제거하기 위하여 micro blaster공정 후 DRE 공정으로 표면 개선이 필요하였다. 이때 남겨진 요철은 입사광량을 증가시키고, 표면 반사율을 감소시켜 태양전지내의 흡수하는 빛의 양을 증가시키는 태양전지 texturing 공정 효과로 작용하게 된다. 표면에 남은 particle과 crack을 완전히 제거하면서 요철은 유지할 수 있게 HNA 용액의 농도와 시간에 따른 식각 정도를 측정하였다. DRE 공정 후 표면 particle과 crack이 완전히 제거되어 표면이 개선됨을 확인하였다. Micro blaster를 이용하여 폐 실리콘 웨이퍼의 표면을 식각하고, DRE공정으로 표면을 개선함으로써 태양전지용 기판으로의 재생 가능성을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.311-311
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• 2016

최근 고성능 디스플레이 개발이 요구되면서 기존 비정질 실리콘(a-Si)을 대체할 산화물 반도체에 대한 연구 관심이 급증하고 있다. 여러 종류의 산화물 반도체 중 a-IGZO (amorphous indium-gallium-zinc oxide)가 높은 전계효과 이동도, 저온 공정, 넓은 밴드갭으로 인한 투명성 등의 장점을 가지며 가장 연구가 활발하게 보고되고 있다. 기존에는 SG(단일 게이트) TFT가 주로 제작 되었지만 본 연구에서는 DG(이중 게이트) 구조를 적용하여 고성능의 a-IGZO 기반 박막 트랜지스터(TFT)를 구현하였다. SG mode에서는 하나의 게이트가 채널 전체 영역을 제어하지만, double gate mode에서는 상, 하부 두 개의 게이트가 동시에 채널 영역을 제어하기 때문에 채널층의 형성이 빠르게 이루어지고, 이는 TFT 스위칭 속도를 향상시킨다. 또한, 상호 모듈레이션 효과로 인해 S.S(subthreshold swing)값이 낮아질 뿐만 아니라, 상(TG), 하부 게이트(BG) 절연막의 계면 산란 현상이 줄어들기 때문에 이동도가 향상되고 누설전류 감소 및 안정성이 향상되는 효과를 얻을 수 있다. Dual gate mode로 동작을 시키면, TG(BG)에는 일정한 positive(or negative)전압을 인가하면서 BG(TG)에 전압을 가해주게 된다. 이 때, 소자의 채널층은 depletion(or enhancement) mode로 동작하여 다른 전기적인 특성에는 영향을 미치지 않으면서 문턱 전압을 쉽게 조절 할 수 있는 장점도 있다. 제작된 소자는 p-type bulk silicon 위에 thermal SiO2 산화막이 100 nm 형성된 기판을 사용하였다. 표준 RCA 클리닝을 진행한 후 BG 형성을 위해 150 nm 두께의 ITO를 증착하고, BG 절연막으로 두께의 SiO2를 300 nm 증착하였다. 이 후, 채널층 형성을 위하여 50 nm 두께의 a-IGZO를 증착하였고, 소스/드레인(S/D) 전극은 BG와 동일한 조건으로 ITO 100 nm를 증착하였다. TG 절연막은 BG 절연막과 동일한 조건에서 SiO2를 50 nm 증착하였다. TG는 S/D 증착 조건과 동일한 조건에서, 150 nm 두께로 증착 하였다. 전극 물질과, 절연막 물질은 모두 RF magnetron sputter를 이용하여 증착되었고, 또한 모든 patterning 과정은 표준 photolithography, wet etching, lift-off 공정을 통하여 이루어졌다. 후속 열처리 공정으로 퍼니스에서 질소 가스 분위기, $300^{\circ}C$ 온도에서 30 분 동안 진행하였다. 결과적으로 $9.06cm2/V{\cdot}s$, 255.7 mV/dec, $1.8{\times}106$의 전계효과 이동도, S.S, on-off ratio값을 갖는 SG와 비교하여 double gate mode에서는 $51.3cm2/V{\cdot}s$, 110.7 mV/dec, $3.2{\times}108$의 값을 나타내며 훌륭한 전기적 특성을 보였고, dual gate mode에서는 약 5.22의 coupling ratio를 나타내었다. 따라서 산화물 반도체 a-IGZO TFT의 이중게이트 구조는 우수한 전기적 특성을 나타내며 차세대 디스플레이 시장에서 훌륭한 역할을 할 것으로 기대된다.