• Journal of the Korean Crystal Growth and Crystal Technology
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• v.33 no.2
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• pp.45-53
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• 2023

The growth of Si on 4H-SiC substrate has a wide range of applications as a very useful material in power semiconductors, bipolar junction transistors and optoelectronics. However, it is considerably difficult to grow very fine crystalline Si on 4H-SiC owing to the lattice mismatch of approximately 20 % between Si and 4H-SiC. In this paper, we report the growth of a Si epilayer by an Al-related nanostructure cluster grown on a 4H-SiC substrate using a mixed-source hydride vapor phase epitaxy (HVPE) method. In order to grow hexagonal Si on the 4H-SIC substrate, we observed the process in which an Al-related nanostructure cluster was first formed and an epitaxial layer was formed by absorbing Si atoms. From the FE-SEM and Raman spectrum results of the Al-related nanostructure cluster and the hexagonal Si epitaxial layer, it was considered that the hexagonal Si epitaxial layer had different characteristics from the general cubic Si structure.

• Journal of the Korean Magnetics Society
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• v.19 no.3
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• pp.85-88
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• 2009

Magnetic phases of polycrystalline $Ge_{1-x}Mn_x$ thin films were studied. The $Ge_{1-x}Mn_x$ thin films were grown at $400^{\circ}C$ by using a molecular beam epitaxy. The $Ge_{1-x}Mn_x$thin films were p-type and electrical resistivities were $4.0{\times}10^{-2}{\sim}1.5{\times}10^{-4}ohm-cm$. Based on the analysis of magnetic characteristics and microstructures, it was concluded that the ferromagnetic phase formed on the $Ge_{1-x}Mn_x/SiO_2$/Si(100) thin films was $Ge_3Mn_5$ phase which has about 310 K of Curie temperature. Moreover, the $Ge_{1-x}Mn_x$ thin film which had $Ge_3Mn_5$ phase showed the negative magnetoresistance to be about 9% at 20 K when the magnetic field of 9 T was applied.

• Korean Journal of Materials Research
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• v.13 no.5
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• pp.279-284
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• 2003

The $CoSi_2$ process is widely employed in a salicide as well as an ohmic layer process. In this experiment, we investigated the characteristics of $CoSi_2$ films by combinations of I-type (TiN 100$\AA$/Co 150$\AA$), II-type(TiN 100$\AA$/Co 150$\AA$/Ti 50$\AA$), III-type(Ti 100$\AA$/Co 150$\AA$/Ti 50$\AA$), and IV-type(Ti 100$\AA$/Co 150$\AA$/Ti 100$\AA$). Sheet resistances of $CoSi_2$ show the lowest resistance with 2.9 $\Omega$/sq. in a TiN/Co condition and much higher resistances in conditions simultaneously applying Ti capping layers and Ti interlayers. Though we couldn't observe a $CoSi_2$roughness dependence on the film stacks from RMS values, Ti capping layers turned into 78∼94$\AA$ thick TiN layers of (200) preferred orientation at $N_2$ambient. In addition, Ti interlayers helped to form the epitaxial $CoSi_2$with (200) preferred orientation and ternary compounds of Co-Ti-Si. We propose that film structures of II-type and III-type may be appropriate in the salicide process and the ohmic layer process from the viewpoint of Co diffusion kinetics and the CoSi$_2$epitaxy.

• Journal of Electrical Engineering and Technology
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• v.10 no.4
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• pp.1720-1725
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• 2015

The performance of the AlGaN/GaN MSM-2DEG varactor with different dielectric films deposited by the E-beam deposition is investigated in detail. The capacitance swing and the capacitance ratio of the varactor without dielectric film as well as with, SiO₂, Gd₂O₃, and Si₃N₄ films, respectively, are determined by electrodes of varying areas. The maximum capacitance, the minimum capacitance and the capacitance ratios are proportional to the increasing of the electrode areas. The capacitance ratio determined by the maximum and the minimum capacitance is found to be 18.35 (with Si₃N₄ dielectric film) and 149.51 (without dielectric film), respectively. The transition voltages of the fabricated varactors are almost the same for a bias voltage of about ±5 V and leakage current can be lower three orders of magnitude while the varactors with dielectric films. The tunability of the capacitance ratio makes the AlGaN/GaN MSM-2DEG varactor with a dielectric film highly useful in multirange applications of a surge free preamplier.

• ETRI Journal
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• v.11 no.4
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• pp.84-97
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• 1989

The influence of Zn, Si and Te diffusion on the interdiffusion in $GaAs-Ga_1_-xIN_xAs_1__yP_y$and InP$Ga_1__xIn_xAs_1__yP_y$ heterostructures was studied. The heterostructures were grown by liquid phase epitaxy, and the impurity diffusion into the heterostructures was carried out using metal compound or element sources. The extent of interdiffusion for both group III and V atoms was observed by depth profiling of matrix elements with secondary ion mass spectrometry and Auger electron spectroscopy. Selective enhancement of cation interdiffusion was observed by the concurrent Zn diffusion in both the GaAs based-and InP based-crystals. In contrast to the Zn diffusion, the Si diffusion in the GaAs based-crystal and the Te diffusion in the InP based-crystal enhanced both cation and anion interdiffusion to the same extent. A kick-out mechanism is proposed to explain the selective enhancement of the cation interdiffusion due to Zn, and a single vacancy mechanism is proposed for the interdiffusion due to Si and Te.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.224-224
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• 2010

최근 반도체 나노막대의 구조적, 광학적 특성을 이용한 새로운 개념의 광학 및 전자 소자 개발을 위한 연구가 활발히 진행되고 있다. 기존의 반도체 나노막대는 gold를 촉매로 하여 성장한 것이 대부분이었지만, gold 촉매는 다른 물질에 빠르게 확산되기 때문에 반도체 특성에 좋지 않은 영향을 미친다. 이러한 이유로 aluminum이나 titanium과 같은 물질을 gold 촉매 대신 사용하거나 촉매를 사용하지 않는 성장 방법에 관한 이슈들이 주목받고 있다. 본 연구에서는 금속 촉매 물질을 사용하지 않고 반도체 나노막대 성장을 시도하였다. 금속 촉매 없이 반도체 나노막대를 성장하는 것은 반도체 특성에 악영향을 미치지 않을 뿐더러, 공정 과정이 용이하다는 장점 때문에 최근 많이 시도되고 있다. 본 실험에서는 Molecular Beam Epitaxy (MBE) 방법을 이용하여 (100) GaAs 기판 위에 GaAs 나노막대를 성장하였다. 금속 촉매 없이 반도체 나노막대를 성장하기 위해 에칭된 $SiO_2$ 층을 이용하였다. GaAs 기판 위에 형성된 35nm 두께의 $SiO_2$를 20:1 BOE 용액에서 10초 간 에칭하면 $SiO_2$상에 pinhole을 형성하는데 이것이 gallium과 반응하면 나노막대 성장을 유도하는 seed가 만들어져 촉매를 사용하지 않고도 나노막대 성장이 가능하다. GaAs 나노막대 성장을 위해 BOE 에칭 조건, gallium incubation time 유무, GaAs 나노막대 성장온도, galiium과 arsenic의 성분 비율, GaAs 양 등을 변화시켜 실험하였고 이렇게 성장된 나노막대가 SEM image 상에서 관찰되었다.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1463-1465
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• 1994

The electrical characteristics of $Al/Ta_2O_5/Si$ metal-oxide-semiconductor (MOS) capacitors were studied. $Ta_2O_5$ films on p-type silicon had been prepared by ionized cluster beam epitaxy technique (ICBE). This $Ta_2O_5$ films have low leakage current, high breakdown strength and low flat band shift. In this research, a single crystalline cpitaxial film of $Ta_2O_5$ has been grown on p-Si wafer using an ICBE technique. The native oxide layer ($SiO_2$) on the silicon substrate was removed below $500^{\circ}C$ by use of an accelerated arsenic ion beam, instead of a high temperature deposition. $Ta_2O_5$ films formed by ICBE technique can be received considerable attention for applications to coupling capacitors, gate dielectrics in MOS devices, and memory storage capacitor insulator because of their high dielectric constants above 20 and low temperature process.

• Korean Journal of Crystallography
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• v.12 no.4
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• pp.197-206
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• 2001

A stoichiometric mixture of evaporating materials for AgInS₂ single crystal thin films was prepared from horizontal electric furnace. To obtain the single crystal thin films. AgInS₂ mixed crystal was deposited on thoroughly etched semi-insulating GaAs(100) substrate by the Hot Wall Epitaxy(HWE)system. The source and substrate temperatures were 680℃ and 410℃, respectively. The crystalline structure of the single crystal thin films was investigated by the photoluminescence and double crystal X-ray diffraction(DCXD). The carrier density and mobility of AgInS₂ single crystal thin film mea-sured from Hall effect by van der Pauw method are 9.35×10/sup 16/㎤ and 294㎠/V·s at 293K respectively. The temperature dependence of the energy band gap of the AgInS₂ obtained from the absorption spectra was well described by the Varshni's relation , E/sub g/(T)=2.1365eV-(9.89×10/sup-3/eV/K/)T²(T+2930K). The crystal field and the spin-orbit splitting energies for the valence band of the AgInS₂ have been estimated to be 0.1541eV and 0.0129 eV, respectively, by means of the photocur-rent spectra and the Hopfield quasicubic model. These results indicate that the splitting of the Δso definitely exists in the Γ/sub 5/ states of the valence band of the AgInS₂ /GaAs epilayer. The three photo-current peaks ovserved at 10K are ascribed to the A₁-, B-₁and C₁-exction peaks for n=1.

• Journal of the Korean Ceramic Society
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• v.43 no.6 s.289
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• pp.362-368
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• 2006

Epitaxial $Ba_{0.5}Sr_{0.5}TiO_3$ (BSTO) thin films have been grown on TiN buffered Si (001) substrates by Pulsed Laser Deposition (PLD) method and the effects of substrate temperature and oxygen partial pressure during the deposition on their dielectric properties and crystallinity were investigated. The crystal orientation, epitaxy nature, and microstructure of oxide thin films were investigated using X-Ray Diffraction (XRD) and Transmission Electron Microscopy (TEM). Thin films were prepared with laser fluence of $4.2\;J/cm^2\;and\;3\;J/cm^2$, repetition rate of 8 Hz and 10 Hz, substrate temperatures of $700^{\circ}C$ and ranging from $350^{\circ}C\;to\;700^{\circ}C$ for TiN and oxide respectively. BSTO thin-films were grown on TiN-buffered Si substrates at various oxygen partial pressure ranging from $1{\times}10^{-4}$ torr to $1{\times}10^{-5}$ torr. The TiN buffer layer and BSTO thin films were grown with cube-on-cube epitaxial orientation relationship of $[110](001)_{BSTO}{\parallel}[110](001)_{TiN}{\parallel}[110](001)_{Si}$. The crystallinity of BSTO thin films was improved with increasing substrate temperature. C-axis lattice parameters of BSTO thin films, calculated from XRD ${\theta}-2{\theta}$ scans, decreased from 0.408 m to 0.404 nm and the dielectric constants of BSTO epitaxial thin films increased from 440 to 938 with increasing processing oxygen partial pressure.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.213-213
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• 2013

화합물 반도체 양자점(Quantum dots; QDs)은 높은 효율의 광전자 소자에 적용할 수 있기 때문에 이분야에 대한 연구가 활발히 진행되고 있지만 주로 III-V 족 화합물 반도체에 대한 연구가 주를 이룬 반면 II-VI 족 화합물 반도체에 대한 연구는 아직 미흡하다. 하지만 II-VI 족 화합물 반도체는 III-V 족 화합물 반도체와 비교했을 때 더 큰 엑시톤 결합에너지(exciton binding energy)를 가지는 우수한 특성을 보이고 있으며 이러한 성질을 가지는 II-VI 족 화합물 반도체 중에서도 넓은 에너지 갭을 가지는 $Cd_xZn_{1-x}Te$ 양자점은 녹색 영역대의 광전자 소자로서 활용되고 있다. 현재 대부분의 $Cd_xZn_{1-x}Te$ 양자점 구조는 기판과 완충층 (buffer layer) 사이의 작은 격자 부정합(lattice mismatch) 때문에 GaAs 기판을 이룬 반면 Si기판을 이용한 연구는 미흡하다. 하지만 Si 기판은 GaAs 기판에 비해 값이 싸고, 여러 분야에 응용이 가능하며 대량생산이 가능하다는 이점을 가지고 있어 초고속, 초고효율 반도체 광전소자의 제작을 가능케 할 것으로 기대된다. 또한 양자점의 고효율 광전소자에 응용을 위해서는 Si 기판 위에 양자점의 크기를 효율적으로 조절하는 연구 뿐 아니라 양자점의 크기에 따른 운반자 동역학에 대한 연구도 중요하다. 본 연구에선 분자선 에피 성장법(Molecular Beam Epitaxy; MBE)을 이용하여 Si 기판위에 성장한 $Cd_xZn_{1-x}Te/ZnTe$ 양자점의 크기에 따른 광학적 특성을 연구하였다. 저온 광 루미네센스 (PhotoLuminescence; PL) 측정 결과 양자점의 크기가 증가함에 따라 더 낮은 에너지영역으로 피크가 이동하는 것을 확인하였다. 그리고 시분해 광루미네센스 측정 결과 $Cd_xZn_{1-x}Te/ZnTe$ 양자점의 크기가 증가함에 따라 소멸 시간이 긴 값을 갖는 것을 관찰 하였는데, 이는 양자점의 크기가 증가함에 따라 엑시톤 진동 세기가 감소하였기 때문이다. 또한 온도 의존 광루미네센스 측정 결과 양자점의 크기가 증가함에 따라 열적 활성화 에너지가 증가하는 것을 관찰 하였는데, 이는 양자점의 운반자 구속효과가 증가하였기 때문이다. 이와 같은 결과 Si 기판 위에 성장한 $Cd_xZn_{1-x}Te/ZnTe$ 양자점의 크기에 따른 광학적 특성에 대해 이해 할 수 있었다.