• Korean Journal of Materials Research
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• v.13 no.1
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• pp.1-5
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• 2003

Uniform polycrystalline $CoSi_2$layers have been grown in situ on a polycrystalline Si substrate at temperature near $625^{\circ}C$ by reactive chemical vapor deposition of cyclopentadienyl dicarbonyl cobalt, Co(η$^{5}$ -C$_{5}$ H$_{5}$ )(CO)$_2$. The growth behavior and thermal stability of $CoSi_2$layer grown on polycrystalline Si substrates were investigated. The plate-like CoSi$_2$was initially formed with either (111), (220) or (311) interface on polycrystalline Si substrate. As deposition time was increasing, a uniform epitaxial $CoSi_2$layer was grown from the discrete $CoSi_2$plate, where the orientation of the$ CoSi_2$layer is same as the orientation of polycrystalline Si grain. The interface between $CoSi_2$layer and polycrystalline Si substrate was always (111) coherent. The growth of the uniform $CoSi_2$layer had a parabolic relationship with the deposition time. Therefore we confirmed that the growth of $CoSi_2$layer was controlled by diffusion of cobalt. The thermal stability of $CoSi_2$layer on small grain-sized polycrystalline Si substrate has been investigated using sheet resistance measurement at temperature from $600^{\circ}C$ to $900^{\circ}C$. The $CoSi_2$layer was degraded at $900^{\circ}C$. Inserting a TiN interlayer between polycrystalline Si and $_CoSi2$layers improved the thermal stability of $CoSi_2$layer up to $900^{\circ}C$ due to the suppression of the Co diffusion.

• Proceedings of the Korean Vacuum Society Conference
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• 1993.07a
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• pp.102-102
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• 1993

• Journal of the Korean Ceramic Society
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• v.27 no.5
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• pp.698-701
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• 1990

The necessary conditions for the growth of high quality Bi12SiO20 single crystals by the Czochralski method have been determined. The interface of melt and crystal was transformed convex to concave above 7 rpm. For growth <001> and <111> directions, facet morphology exhibited 4-fold and 6-fold symmetry. When the crystal of <001> growth direction was broadened, minor facet {110} was developed outstandingly.

• Applied Chemistry for Engineering
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• v.9 no.7
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• pp.990-997
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• 1998

In this work, the $SiO_2$ films on the silicon substrate with different orientations were first prepared by the low temperature process using the ECR plasma diffusion as a function of microwave power and oxidation time. Before and after thermal treatment, the surface morphology, Si/O ratio from physicochemical properties, and the electrical properties of the oxide films were also investigated. The oxidation rate increased with microwave power, while surface morphology showed the nonuniform due to etching. The film quality, therefore, was lowered with increasing the defect by etching and the content of positive oxide ions in the oxide films from bulk by higher self-DC bias. The content of positive oxide ions in the oxide films with different Si orientations showed Si(100) < Si(111) < poly Si. The defects in $Si/SiO_2$ interface of $SiO_2$ film could be decreased by annealing, while $Q_{it}$ and $Q_f$ were independent of thermal treatment and the dependent on concentration of reactive oxide ions and self-DC bias of substrate. At microwave power of 300, and 400 W, the high quality $SiO_2$ film that had lower surface roughness and defect in $Si/SiO_2$ interface was obtained. The value of interface trap density, then, was ${\sim}9{\times}10^{10}cm^{-2}eV^{-1}$.

• Journal of the Korean Vacuum Society
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• v.2 no.2
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• pp.199-208
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• 1993

The effect of nucleation free energy related to Si surface states on diamond film growth behavior has been studied. Ar first, the three kinds of diamond thin films (A, B, C) were deposited on various Si substrates (A-Si, B-Si, C-Si) whose surfaces were polished with 1 ${\mu}m$ diamond paste, 6 ${\mu}m$ Al_2O_3$ powder and 12 ${\mu}m$ Al_2O_3$ powder respectively. And then, relative nucleation free energy calculated is ${\Delta}G_{A-Si}<{\Delta}G_{B-Si}<{\Delta}G_{C-Si}$. Although there are some difference in grain size, shape and nucleated size, the thin films on A-Si and B-Si were diamond including a small amount of DLC which was confirmed by AES, SEM, XRD, and RHEED. Namely, the diamonds of films (B) were not nucleated in scratches but in dents and larger in grain size compare with the film (C) of which diamond sere nucleated not only scratches but also dents. And, the sphere diamond which is not general shape was grown on C-Si. After all, the sphere was turned out to be the diamond including much graphite as a result of the AES in situ depth profiling. Consequently, the diamond shape and quality grown on Si were Changed from the crystal which the (100) and (110) planes were predominent to the crystal in which (111) plane was predominent, and newt to sphere shape diamond including much graphite according as the nucleation free energy increases.

• Korean Journal of Materials Research
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• v.8 no.12
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• pp.1182-1189
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• 1998

High quality $TiN/TiSi_2$-bilayers were formed on the Si(100) substrate at room temperature and at $600^{\circ}C$ first by coevaporation of stoichiometric Si and Ti(Si:Ti = 2:1) fellowed by Ti reactive deposition in N, gas ambient, and in situ annealing in ultrahigh vacuum. Stoichiometric $Ti_{0.}N_{0.5}$, films with (111) texture and $C54-TiSi_2$ films were grown by annealing at temperatures above $700^{\circ}C$. $TiN/C54-TiSi_2$/Si(100) interface was clear and flat without agglomoration, and $CS4-TiSi_2$ film was epitxailly grown. The sheet resistance of the $TiN/TiSi_2$- bilayer decreased as the annealing temperature increased and about $2.5\omega/\textrm{cm}^2$ was obtained from the sample annealed over $700^{\circ}C$.

• Journal of the Korean Ceramic Society
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• v.38 no.4
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• pp.365-369
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• 2001

플라즈마 화학증착법(PECVD)에 의해 실리콘 (100) 기판 위에 3C-SiC막을 증착하였다. 증착반응시 유입가스비, R$_{x}$[=CH$_4$/(CH$_4$+H$_2$)]에 따른 증착막의 결정성에 대해 검토하였다. 증착된 3C-SiC막의 결정성은 R$_{x}$ 값이 감소할수록 더욱 향상되었으며, 형성된 결정상은 (111) 면으로 최대의 우선배향성을 가졌다. Nanoindentation 방법을 이용하여 3C-SiC막의 압입깊이에 따른 경도 및 탄성계수를 측정하였으며, 유입가스비(R$_{x}$)의 변화에 따라서 막의 경도 및 탄성계수가 뚜렷이 변화하였다.

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.141-147
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• 2003

Silicon carbide thin film was deposited in APCVD and LPCVD system with 1,3-DSB precursor 1,3-DSB is the single precursor to deposit SiC on Si at low temperature. SiC film was deposited at $850^{\circ}C$ lower than ordinary temperature ($1000~1200^{\circ}C$) in CVD process. SiC thin film glowed to high oriented (111) plane in APCVD system. In LPCVD system, SiC film groved to preferred (220) plane at same temperature. This discrepancy between preferred planes can be described by the difference of deposition mechanism. Amorphous phase and crystal defect were observed in APCVD system with the main growth mechanism of mass transport limited region. But in LPCVD system, we got the SIC film of uniform, faceted structure and high quality.

• Journal of the Korean Ceramic Society
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• v.36 no.9
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• pp.937-945
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• 1999

In an effort to protect a RBSC(reaction -bonded SiC) tube SiC films from methyltrichlorosilane(MTS) by low pressure chemical vapor deposition were deposited in hydrogen atmosphere on the RBSC(reaction-bonded SiC) substrates over a range of input gas ratio(${\alpha}=P_{H2}/P_{MTS}=Q_{H2}/Q_{MTS}$=1 to 10) and deposition temperatures(T=1050~1300$^{\circ}C$). At the temper-ature of 1250$^{\circ}C$ the growth rate of SiC films increased and then decreased with decreasing the input gas ratio. The microstructure of SiC films was changed from granular type structure exhibiting (111) preferred orientation in the high input gas ratios to faceted columnar grain structure showing (220) in the low input gas ratios. The similar microstructure change was obtained by increasing the deposition temperature. These results were closely related to a change of deposition mechanism. Double layer structure having granular type and faceted ciolumnar grain structure from the manipulation of mechanism. Double layer structure having granular type and faceted columnar grain structure from the manipulation of the input gas ratio without changing the deposition temperatue was successfully fabricated through in -site process.

• Proceedings of the Korea Crystallographic Association Conference
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• 2003.05a
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• pp.23-23
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• 2003

Cu 단결정과 다결정 Cu 막대(rod)를 시료로 하여 구부린 완전결정(bent perfect crystal, BPC)을 이용한 중성자 단색기의 특성을 평가함으로써 단결정 회절 및 집합조직 측정장치인 4축 단결정 회절장치(FCD)에 BPC 단색기를 적용할 수 있는지 시험하였다. 측정은 한국원자력연구소의 연구용 원자로인 하나로의 571 수평공에 구성된 test station에서 수행하였다. 단색기와 시료 사이의 거리는 3000mm, 시료와 검출기 사이는 600mm, 단색화빔 인출각도(2θ/sub M/)는 44.6°로 고정하여 FCD와 거의 같은 배치를 구현하였다 직사빔의 단면분포와 강도는 저효율 2차원 위치민감형 검출기(2-D PSD)를 이용하여 확인하였다. 이 검출기는 검출면적 90x90㎟, 공간 분해능 1.2mm, 검출효율 약 1%인 저효율 검출기이다. 회절빔은 검출면적 190x190㎟, 검출효율은 1Å에서 60%인 고효율 2-D PSD를 이용하여 측정하였다. Cu 단결정 측정에 사용한 ePC 단색화 결정은 200×40×3.4㎣ 크기의 Si(220) 슬랩이며, 비대칭 기하로 Si(331)면을 사용하여 파장 λ=0.954Å으로 중성자빔을 단색화시켰다. BPC-Si를 구부려 슬랩의 곡률반경을 변화시키면서 단색기-시료-검출기가 평행배치일 때 Cu(200), (220), (400), (420)면의 rocking curve를 측정하여 각 조건에서의 분해능과 강도를 평가하였다. BPC 단색기를 집합조직 측정에 적용할 수 있는지 시험하기 위하여 다결정 Cu 막대(직경 4.5mm, 길이 18mm)를 시료로 선택하였다. 207x30x3.0㎣ 크기의 Si 슬랩을 단색화 결정으로 사용하였다. 이 슬랩은 다양한 결정면을 이용한 특별한 기하를 구현할 수 있도록 Si(111)면에서 10° 벗어난 면을 절단한 것이다. 비대칭 기하로 Si(311)면을 사용하여 파장 λ=1.253Å의 단색화된 중성자빔으로 측정하였다 BPC-Si를 구부려 슬랩의 곡률반경을 변화시키면서 단색기-시료-검출기가 평행파 반평행배치일 때 Cu(111), (200), (220), (311), (331), (420)면의 회절선을 측정하여 각 조건에서 분해능과 강도를 평가하였다.