• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.55 no.1
• /
• pp.16-19
• /
• 2006

The characteristic of negative differential resistance(NDR) is decreased current when the applied voltage is increased. The NDR is potentially very useful in molecular electronics device schemes. Here, we investigated the NDR characteristic of self-assembled 4,4'-di(ethynylphenyl)-2'-nitro-1-benzenethiolate, which has been well known as a conducting molecule. Self-assembly monolayers(SAMs) were prepared on Au(111), which had been thermally deposited onto $pre-treatment(H_2SO_4:H_2O_2=3:1)$ Si. The Au substrate was exposed to a 1 mM/1 solution of 1-dodecanethiol in ethanol for 24 hours to form a monolayer. After thorough rinsing the sample, it was exposed to a 0.1 ${\mu}M/l$ solution of 4.4'-di(ethynylphenyl)-2'-nitro-1-(thioacetyl)benzene in dimethylformamide(DMF) for 30 min and kept in the dark during immersion to avoid photo-oxidation. After the assembly, the samples were removed from the solutions, rinsed thoroughly with methanol, acetone, and $CH_2Cl_2,$ and finally blown dry with N_2. Under these conditions, we measured electrical properties of self-assembly monolayers(SAMs) using ultra high vacuum scanning tunneling microscopy(UHV-STM). The applied voltages were from -2 V to +2 V with 298 K temperature. The vacuum condition was $6{\time}10^{-8}$ Torr. As a result, we found the NDR voltage of the 4,4'-di(ethynylphenyl)-2'-nitro-1-benzenethiolate were $-1.61{\pm}0.26$ V(negative region) and $1.84{\pm}0.33$ V(positive region). respectively.

• Journal of the Korean Vacuum Society
• /
• v.9 no.3
• /
• pp.267-272
• /
• 2000

Electroplating Cu was deposited on Si(100) wafer after seed Cu was deposited by sputtering first. TaN was deposited as a diffusion barrier before depositing the seed Cu. Electroplating Cu thin films show highly (111)-oriented microstructure for both before and after annealing at $450^{\circ}C$ for 30min and no copper silicide was detected in the same samples, which indicates that TaN barrier layer blocks well the Cu diffusion into silicon substrate. After annealing the electroplating Cu film up to $450^{\circ}C$, the Cu film became columnar from non-columnar, its grain size became larger about two times, and also defects density of stacking faults, twins and dislocations decreased greatly. Thus the heat treatment will improve significantly electromigration property caused by the grain boundary in the Cu thin films.

• Proceedings of the KIEE Conference
• /
• 1999.07d
• /
• pp.1928-1930
• /
• 1999

This paper describes on the growth of a ${\mu}c$-Si:H film on low cost substrate like glass by Hot Wire CVD method. The ${\mu}c$-Si:H film, prepared in 50mTorr pressure, $1800^{\circ}C$ wire temperature, and $H_2/SiH_4$ 10 showed three clear peaks. (111), (220), and (311) in X-ray spectroscopy. The crystallite size and crystalline volume fraction, calculated from Raman spectroscopy, was about 6nm and 70%, respectively. The FTIR transmission spectra of the film showed a different absorption peak with a-Si:H film around $2000-2100cm^{-1}$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.20 no.2
• /
• pp.101-105
• /
• 2007

We have synthesized silicon nanowires by using RFCVD(Radio Frequency Chemical Vapor Deposition) system on Au deposited p-type Si(100) wafers, and investigated their physical and electrical properties. The silicon nanowires had been grown in the atmospheres of $H_{2},\;N_{2}\;and\;SiH_{4}$ at 10 Torr at the substrate temperatures of $700{\pm}5^{\circ}C\;and\;810{\pm}5^{\circ}C$ respectively. FE-SEM analysis revealed that diameters of the silicon nanowires are $50{\sim}60nm$ with the length of several ${\mu}m$. XRD analysis showed that the growth direction of the nanowires is Si[111]. Field emission characteristics showed that the turn-of voltages at the current of $0.01\;mA/cm^{2}$ are $10\;V/{\mu}m\;and\;8.5\;V/{\mu}m$ for the wires grown at $700{\pm}5^{\circ}C\;and\;810{\pm}5^{\circ}C$, respectively.

• Journal of the Microelectronics and Packaging Society
• /
• v.7 no.2
• /
• pp.37-42
• /
• 2000

The comparative study of texture of Al/Ti thin films deposited on low-dielectric polymer and $SiO_2$substrates has been investigated. Fifty-nm-thick Ti films and 500-nm-thick Al-1%Si-0.5%Cu (wt%) films were deposited sequentially onto low-k polymers and $SiO_2$by using a DC magnetron sputtering system. The texture of Al thin film was determined using X-ray diffraction (XRD) theta-2theta ($\theta$-2$\theta$) and rocking curve and the microstructure of Al/Ti films on low-k polymer and $SiO_2$substrates was characterized by cross-sectional transmission electron microscopy (TEM). Both the $\theta$-2$\theta$ method and rocking curve measurement suggest that Al/Ti thin films deposited on $SiO_2$have stronger texture than those deposited on low-k polymer. The texture of Al thin films strongly depended on that of Ti films. Cross-sectional TEM revealed that grains of Ti films on $SiO_2$substrates had grown perpendicular to the substrate, while the grains of Ti alms on SiLK substrates were formed randomly. The lower degree of (111) texture of Al thin films on low-k polymer was due to Ti underlayer.

• Journal of the Korean Ceramic Society
• /
• v.37 no.11
• /
• pp.1097-1104
• /
• 2000

MOD(Metal-Organic-Decomposition)법에 의해 $Y_2$O$_3$버퍼층에 Pt/TiO$_2$/SiO$_2$/Si 기판 위에 제조한 후, 그 표면 위에 졸-겔 방법으로 YMnO$_3$박막을 형성하였다. 기판의 종류와 수화조건 변화가 YMnO$_3$박막의 결정화 거동에 미치는 영향을 고찰하였으며, 또한 $Y_2$O$_3$버퍼층 유.무에 따른 Mn의 산화상태를 확인하고 이에 따른 유전특성 변화를 연구하였다. $Y_2$O$_3$버퍼층을 삽입하지 않고 직접 기판 위에 형성한 YMnO$_3$박막의 결정상은 기판의 종류 및 Rw 변화에 관계없이 orthorhombic 구조임이 확인되었다. 반면, $Y_2$O$_3$버퍼층 위에 형성된 YMnO$_3$박막의 경우에는 Rw($H_2O$/alkoxide mole ratio)가 0~6 범위 내에서 낮아질술고 hexagonal 결정상 성장에 유리하였으며, 또한 Pt(111)/TiO$_2$/SiO$_2$/Si 기판이 Ptd(200)/TiO$_2$/SiO$_2$/Si에 비하여 결정상 형성에 용이하였다. $Y_2$O$_3$버퍼층은 YMnO$_3$결정상 내에서 $Mn^{4+}$ 이온형성을 억제함으로써 누설전류밀도가 크게 감소되는 효과를 주었으며, 동시에 강유전 특성을 지닌 hexagonal 결정상 형성에 유리하게 작용하였다. 결론적으로, $Y_2$O$_3$는 Pt가 코팅된 Si 기판 위에 YMnO$_3$박막 제조시 그 강유전 특성을 향상시켜주는 우수한 버퍼층 재료임을 확인하였다.

• Korean Journal of Materials Research
• /
• v.5 no.2
• /
• pp.169-177
• /
• 1995

The diffusion barrier property of 100-nm-thick titanium nitride (TiN) film between Cu and Si was investigated using sheet resistance measurements, etch-pit observation, x-ray diffractometry, Auger electron spectroscopy, and transmission electron microscopy. The TiN barrier fails due to the formation of crystalline defects (dislocations) and precipitates (presumably Cu-silicides) in the Si substrate which result from the predominant in-diffusion of Cu through the TiN layer. In contrast with the case of Al, it is identified that the TiN barrier fails only the in-diffusion of Cu because there is no indication of Si pits in the Si substrate. In addition, it appears that the stuffing of TiN does not improve the diffusion barrier property in the Cu/TiN/Si structure. This indicates that in the case of Al, the chemical effect that impedes the diffusion of Al by the reaction of Al with $TiO_{2}$ which is present in the grain boundaries of TIN is very improtant. On the while, in the case of Cu, there is no chemical effect because Cu oxides, such as $Cu_{2}O$ or CuO, is thermodynamically unstable in comparison with $TiO_{2}$. For this reason, it is considered that the effect of stuffing of TiN on the diffusion barrier property is not significant in the Cu/ TiN/Si structure.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.24 no.12A
• /
• pp.2002-2007
• /
• 1999

In this paper, the n-channel poly-Si thin-film transistors (poly-Si TFT's) formed by solid phase crystallization (SPC) on glass were investigated by measuring the electrical properties of poly-Si films, such as I-V characteristics, mobility, leakage current, threshold voltage, and subthreshold slope. It is done to decide to be applied on TFT-LCD with large-size and high density. In n-channel poly-Si TFT with 2, 10, 25$\mu\textrm{m}$ of channel length, the field effect mobilities are 111, 126 and 125 $\textrm{cm}^2$/V-s and leakage currents are 0.6, 0.1, and 0.02 pA/$\mu\textrm{m}$, respectively. Low threshold voltage and subthreshold slope, and good ON-OFF ratio are shown, as well. Thus, the poly-Si TFT’s used by SPC are expected to be applied on TFT-LCD with large-size and high density, which can integrate display panel and peripheral circuit on a large glass substrate.

• Journal of the Korean Magnetics Society
• /
• v.6 no.5
• /
• pp.323-328
• /
• 1996

NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) trilayers were formed on the $4^{\circ}$ tilt-cut Si(111) substrate by rf magnetron sputtering method. With a Cu($50\;{\AA}$) underlayer, NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) trilayers developed in-plane magnebc anisotropy and in-plane perpendicular alignment of easy axes in two magnetic components of NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) trilayers has been found. The easy axis of Co layer consisbng of NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$) trilayers turned out to be along $4^{\circ}$ tilt Si <112> direcbon and that of NiFe layer along Si <110> direction. [NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$)]/Cu($50\;{\AA}$)/Si(111, $4^{\circ}$ tiIt-cut) trilayers showed about 2.2 % MR ratio at room temperature and large plateau in MR curves, which are more improved MR characteristics than those in [NiFe($60\;{\AA}$)/Cu($60\;{\AA}$)/Co($30\;{\AA}$)]/Cu($50\;{\AA}$)/glass trilayers with no appreciable magnetic anisotropy.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.52 no.10
• /
• pp.447-450
• /
• 2003

This paper presents a process optimization of antireflection (AR) coating on crystalline Si solar cells. Theoretical and experimental investigations were performed on a double-layer AR (DLAR) coating of MgF$_2$/CeO$_2$. We investigated CeO$_2$ films as an AR layer because they have a proper refractive index of 2.46 and demonstrate the same lattice constant as Si substrate. RF sputter grown CeO$_2$ film showed strong dependence on a deposition temperature. The CeO$_2$ deposited at 40$0^{\circ}C$ exhibited a strong (111) preferred orientation and the lowest surface roughness of 6.87 $\AA$. Refractive index of MgF$_2$ film was measured as 1.386 for the most of growth temperature. An optimized DLAR coating showed a reflectance as low as 2.04% in the wavelengths ranged from 0.4${\mu}{\textrm}{m}$ to 1.1${\mu}{\textrm}{m}$. We achieved the efficiencies of solar cells greater than 15% with 3.12% improvement with DLAR coatings. Further details on MgF$_2$, CeO$_2$ films, and cell fabrication parameters are presented in this paper.