• Journal of Welding and Joining
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• 제17권1호
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• pp.124-132
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• 1999

Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

• 한국산학기술학회논문지
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• 제22권1호
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• pp.327-332
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• 2021

패키지레벨에서 반도체의 신뢰성 검사는 테스트 소켓에 반도체 칩 패키지를 탑재시킨 상태에서 테스트가 진행되며, 테스트 소켓은 기본적으로 반도체 칩 패키지의 형태에 따라서 그 모양이 결정되는 것이 일반적이다. 또한, 반도체 칩 패키지의 리드와 소켓 리드의 기계적인 접촉에 의해 테스트 장비와 연결하는 매개체의 역할을 하며, 신호전달 과정에서 신호의 손실을 최소화하여 반도체에 검사신호를 잘 전달할 수 있도록 하는 기능이 핵심이다. 본 연구에서는 이웃하고 있는 전기 전달 경로의 상호 영향성을 검사 할 수 있는 기술을 적용함으로써 수명 검사와 정밀 측정뿐만 아니라 이웃하고 있는 전기 전달 경로의 구조를 포함하여 단 한 번의 접촉을 통해 100개미만의 실리콘 테스트 소켓의 합선 테스트가 가능하도록 개발하였다. 개발된 장치의 테스트 결과 99%이상의 테스트 정밀도와 0.66이하의 동시 검사속도 특성을 나타내었다.

• 한국초전도ㆍ저온공학회논문지
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• 제8권2호
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• pp.29-32
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• 2006

An advanced superconducting fault current limiter (SFCL) using $high-T_c$ superconducting (HTS) wire has been developed. The SFCL has a non-inductively wound magnet for reducing loss in normal state. Two types of non-inductively wound magnets, the solenoid type and the pancake type, were designed and manufactured by using Bi-2223 wire in this research. Short-circuit tests of the magnets were performed in sub-cooled $LN_2$ cooling system of 65 K. The magnets are thermally more stable and have a higher critical current in 65 K sub-cooled $LN_2$ cooling system than in 77 K saturated one. Because the resistivity of matrix at 65 K is lower than the resistivity at 77 K, the magnets generate a small resistance to reduce the fault current when the quench occurs. The magnets could limit the fault current to low current level with such a small resistance. The current limiting characteristic of the magnets was analyzed from the test result. The solenoid type was wound in parallel to make it non-inductive. The pancake type was also connected in parallel to be compared with the solenoid type in the same condition. The solenoid type was found to have a good thermal stability compared with the pancake type. It also had as large resistance as the pancake type to limit the fault current in sub-cooled $LN_2$ cooling system.

• 한국전기전자재료학회논문지
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• 제35권4호
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• pp.398-406
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• 2022

In order to increase the electrochemical performance of thermal battery anode, LIFT anode having the same weight but a larger lithium content in electrodes was fabricated by mixing lithium, iron and titanium. By applying these electrodes, a single cell and a thermal battery were prepared, and the effect of LIFT anode on electrochemical performance was evaluated. The LIFT-applied single cell presented a better cell performance than LIFe-applied single cell at 500℃ and 550℃. The discharge performance of LIFT-applied single cell, which included the operating time (787s), specific capacity (1,683 Asg^-1), and electrode utilization (80.7%), was improved collectively compared to the LIFe applied single cell (736s, 1,245 As g^-1, and 74.6%) at 500℃. As the discharge progressed, the internal resistance of LIFT anode decreased, because the lithium migration path was formed due to the presence of large titanium particles among iron particles. These results were analyzed in terms of the microstructure of electrode using SEM. Energy density of LIFT-applied single cell also increased by 10% to 142.1 Wh kg^-1 compared to that of LIFe-applied single cell (127.4 Wh kg^-1). In addition, the LIFT-applied single cell presented a stable discharge performance for 6,500s without a short circuit which could occur by molten lithium under an open circuit voltage condition with a high pressure (4 kgf cm^-2). As observed in the high temperature thermal battery performance tests, the voltage and specific capacity of LIFT-applied thermal battery are superior to those of LIFe-applied thermal batteries, indicating that the energy density of LIFT-applied thermal batteries should remarkably increase.

• 마이크로전자및패키징학회지
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• 제12권2호
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• pp.167-174
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• 2005

전자 부품의 크기가 점점 줄어들고 고집적화됨에 따라 전자 패키지 내부에 사용되는 금속간 간격이 줄어들고 있다. 이에 더하여 고온 고습한 환경에서 금속간에 전압이 인가되면 금속의 이온화가 촉진, 금속으로 이루어진 필라멘트가 형성되어 결국 절연파괴에 이르게 된다. 이러한 현상이 electrochemical migration(ECM)이다. 이에 인쇄회로기판을 사용하여 ECM 특성 평가를 수행하였다. 항온/항습조건($85^{\circ}C,\;85{\%}RH$)에서 PCB의 $300 {\mu}m$의 단자간격을 가진 through-hole via 표면에서 발생하는 ECM 현상은 CAF가 절연파괴의 주된 메커니즘이었다. solder를 구성하는 Sn과 Pb 조성 분석을 통해 Pb 의 이온 이동도가 Sn의 이온 이동도보다 큰 것을 알 수 있었으며 이는 급격한 양극용해 거동을 보이는 pure Pb의 분극거동과 상관관계가 있는 것으로 사료된다. 또한 시간에 따른 절연파괴시간 시험을 통하여 ECM에 의한 절연파괴시간이 인가전압에 의존하며 인가전압 의존성 지수값(n)은 2로 나타났다.