• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.23-26
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• 2002

Two modes of shock waves propagating in He II (superfluid helium), this is a compression and a thermal shock waves, were studied experimentally by using superconductive temperature sensors, piezo pressure transducers and Schlieren visualization method with an ultra-high-speed video camera (40,500 pictures/sec). The shock waves are induced by a gas dynamic shock wave impingement upon a He II free surface. It is found that the shock Mach number of a transmitted compression shock wave is up to 1.16, and the shock Mach number of a thermal shock wave coincides well with the second sound velocity under each compressed He II state condition. The temperature rise ratio of an induced thermal shock wave to that of an incident gas dynamic shock wave was found to be very small, as small as 0.003 at 1.80K.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.44 no.6
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• pp.463-467
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• 2016

In this paper, acceleration and pressure exerted on a human model were measured under a supersonic condition in a shock tunnel. In order to measure these in an interference-free environment, free-fall technique with an electromagnet and a three-dimensional iron-powdered human model was used. Free-fall experiment was conducted at Mach 4 and the force acting on the model was obtained by calculating the displacement from the flow visualization images.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2008.05a
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• pp.289-292
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• 2008

Highly over-expanded nozzle of the rocket engines will be excited by non-axial forces due to flow separation at sea level operations. Since rocket engines are designed to produce axial thrust to power the vehicle, non-axial static and/or dynamic forces are not desirable. Several engine failures were attributed to the side loads. Present work investigate the unsteady flow in an over-expanded rocket nozzle in order to estimate side load during a shutdown/starting. Numerical computations has been carried out with density based solver on multi-block structured grid. Present solver is explicit in time and unsteady time step is calculated using dual time step approach. AUSMDV is considered as a numerical scheme for the flux calculations. One equation Spalart-Allmaras turbulence model is selected. Results presented here is for two nozzle pressure ratio i.e. 100 and 20. At 100 NPR, restricted shock separation (RSS) pattern is observed while, 20 NPR shows free shock separation (FSS) pattern. Side load is observed during the transition of separation pattern at different NPR.

• Journal of Plant Biotechnology
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• v.5 no.2
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• pp.101-105
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• 2003

To eradicate several viruses such as PVX, PVY, and PLRV which often cause considerable damages to the growth and yields of potatoes, several stems including shoot tips were excised from the potato plants grown for 50 days and electric shock was treated. Shoot tips excised from electric-shocked stems were transferred into the medium supplemented with antiviral compound, ribavirin to examine the combinatorial effect. When treated only with 20 mg/L ribavirin, PVX concentration in the regenerated plant-lets was slowly decreased as repeating sub-culture and finally, it took 32 weeks to reach completely PVX-free stock. With an electric shock treatment (10 mA electric current), all the replicates became free from PVY. However, PLRV was not completely eradicated from 94P70-4 and 93P29-3 lines even by treating with 10 mA electric shock. In this case, both electric shock and antiviral compound treatments in axillary buds from the stem segment were successful in eradicating viral contamination.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.152-158
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• 2016

The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.

• 한국전산유체공학회:학술대회논문집
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• 2001.05a
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• pp.99-104
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• 2001

This paper deals with the development of shock stable scheme that is free from shock instability. Roe's FDS is known to preserve good accuracy but to suffer from shock instability, i.e. the carbuncle phenomenon. As the first step toward the shock stable scheme, Roe's FDS is compared with HLLE scheme to identify the source of shock instability. Then control function f is introduced into the pressure term in Roe's FDS to cure shock instability. Various numerical tests concerned with shock instability are performed to demonstrate the shock stability of the proposed scheme.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2000.02a
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• pp.43-47
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• 2000

Two modes of shock waves, a compression shock wave and a thermal shock wave, propagating in He II have been investigated. The shock waves are at a time generated by the impingement of a gasdynamic shock wave onto a He II free surface in the newly developed superfluid shock tube facility. Superconductive temperature sensors, piezo-type pressure transducers and visualization photograph were used for the measurement of them and the phenomena induced by them were investigated in detail. It is found that the compression by a compression shock wave in He II causes temperature drop because He II has negative thermal expansion coefficient. the thermal shock wave is found to be of a single triangular waveform with a limited shock strength. The waveform is similar to that generated by stepwise strong heating from an electrical heater for relatively long heating time. In the experiments at the temperatures near the lambda temperature, no thermal shock wave is sometimes detected in shock compressed He II. It can be understood that shock compression makes He Ii convert to He I in which no thermal shock wave is excited.

• 한국연소학회:학술대회논문집
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• 2012.11a
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• pp.97-99
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• 2012

A pressure-based BOIK model considering Shock to Detonation Transition(SDT) and damage due to external fragment or bullet stimuli impact on energetic materials and analytical approach for determination of free parameters are proposed. The rate of product mass fraction(${\lambda}$) consists of ignition term that represents the initiation due to shock compression and growth term that describes propagation of detonation wave and strain term representing the morphological deformation induced by external impact.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 1999.10a
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• pp.32-32
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• 1999

초음속 과소 팽창 제트가 경사진 평판에 충돌을 하게 되면 평판의 표면과 노즐출구에서 팽창된 자유제트(Free jet)와의 상호 간섭으로 인해 매우 복잡한 유동 구조가 형성된다. 예를 들면, 수직평판에서 발생되는 판 충격파(Plate shock)는 경사평판에서는 Upper plate shock, Lower plate shock, Intermediate plate shock과 같이 여러 형태로 발생되어 평판에서의 압력분포에 있어 수직일 경우와 다소 다른 경향을 보여준다. 본 연구의 주요 목적은 평판의 경사각을 변화시킬 때 평판 표면에서의 복잡한 유동 현상을 이해하는데 있다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.8
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• pp.611-616
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• 2010

This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.