• Journal of the Society of Disaster Information
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• v.10 no.4
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• pp.511-517
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• 2014

Recently, the fire by sheath heater has been occurred frequently on winter season. The sheath heater has simple internal structure and boils water simply. Therefore, the use of sheath heater has been increased. In this study, found the fire hazard property of sheath heater from understanding the fire mechanism through the experiment to get the measure for decreasing the occurrence of fire. For the analysis of the fire hazard property of the sheath heater, performed the test of temperature change and ignition temperature by using current product. On the result of test, the sheath heaters are the most dangerous appliance to arise fire. Water temperature controller attached to sheath heater is not sufficient to prevent overheating it. The sheath heater should have level switch of water and temperature controller for heater itself to shut off the power supply. Because the cause of fire by sheath heater is overheating itself in the situation of lack water.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.7
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• pp.1631-1634
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• 2009

Compositional design and optimization of processing parameters are key factors for controlling and improving the properties of SiC-based electroconductive ceramic composites. Temperature rising time of sheath heater is 1.1 times faster than SiC ceramic heater. Heating insulation of SiC ceramic heater is 2.7 times larger than sheath heater. If SiC ceramic heater is one body type of a product application, contact resistance will decrease. I think that temperature initial rising time is faster than now. The more SiC ceramic heater is used for a long time, the more economic benefit is larger in the view point of heat insulation.

• Journal of the Korean Ceramic Society
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• v.50 no.1
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• pp.57-62
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• 2013

We investigated the thermal and electrical properties of the $B_2O_3-ZnO-Bi_2O_3$ glass system as a sealing material in sheath heater modules. A composition with over 90 wt% $Bi_2O_3$ in the $B_2O_3-ZnO-Bi_2O_3$ system was glassified by controlling the cooling rate. The glass transition temperature and thermal expansion coefficient in bismate glass could be controlled by the minor ingredients of ZnO, $SiO_2$, $BaO_2$, and $K_2O$. The $B_2O_3-ZnO-Bi_2O_3$ glass system bonded well to metal, and bismate glass insulating properties were comparable to those of bismate glass $B_2O_3-ZnO-PbO$ glass system in a sheath heater module.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.3
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• pp.1275-1278
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• 2012

Compositional design and optimization of processing parameters are key factors for controlling and improving the properties of electroconductive ceramic composites. Temperature rising time of sheath heater is 1.1 times faster than SiC ceramic heater. Heating insulation of SiC ceramic heater is 2.7 times larger than sheath heater. If SiC ceramic heater is one body type of a product application, contact resistance will decrease. I think that temperature initial rising time is faster than now. The more SiC ceramic heater is used for a long time, the more economic benefit is larger in the view point of heat insulation.

• Proceedings of the KAIS Fall Conference
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• 2009.05a
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• pp.450-453
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• 2009

Compositional design and optimization of processing parameters are key factors for controlling and improving the properties of SiC-based electroconductive ceramic composites. Compare economic estimation of SiC ceramic heater with sheathe heater are as followings. (1) Temperature rising time of sheath heater is 1.1 times faster than SiC ceramic heater. (2) Heating insulation of SiC ceramic heater is 2.7 times larger than sheath heater. If SiC ceramic heater is one body type of a product application, contact resistance will decrease. I think that temperature initial rising time is faster than now. The more SiC ceramic heater is used for a long time, the more economic benefit is larger in the view point of heat insulation.

• Journal of Korean Institute of Fire Investigation
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• v.4 no.1
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• pp.62-69
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• 2004

The purpose of this study on the sheath heater having high occurrence of fires in a small work place because of not having the safety device, was to find out the characteristics required in the field examination of the fires in the courses of investigation. The results of the experiments conducted and reviewed on the basis of the fire cases whose conditions of the ignition possibility were divided into A, E, C and D are as follows: When the sheath heater without safety device is left on the condition of the heat accumulation of which the temperature rapidly rise, and then ignite the inflammables of the surroundings. In such cases, it was characterized that the color change trace appeared even if no short trace was discovered in the power line.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.57 no.4
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• pp.408-411
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• 2008

As to this research is new structure of the semiconductor substrate heating apparatus. The fast thermoresponsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. For this, it adheres closely to the substrate, in which the photosensitive film is coated and the heating plate layer, adhering closely to the floor side of a substrate the mica layer which adheres closely to the floor side of the upper heating plate layer in order to minimize an insulation and heat loss, and the lower part of the mica layer and it is comprised of the floor plate layer. The heating plate layer forms the continued groove portion over the floor side whole. The sheath heater for heating a substrate is inserted with the groove portion and the heating plate layer is comprised. It is confirmed that by using the new substrate heating structure, the temperature change of the heating plate against the time is observed. Then, there is the electric power saving effect of about 40% in comparison with the existing method.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.58 no.1
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• pp.67-71
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• 2009

This research is a new structure of the semiconductor substrate heating apparatus in which the assembly and expansion are possible. The fast thermo-responsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. There is no problem with the deformation interpreted in the state where it assembles the block of a several of the simulation result structure, the safety, and the stress. In addition, it is confirmed that building a large-size heating block is possible since the temperature deflection of the manufactured plate is lower than the standard value.

• Proceedings of the Safety Management and Science Conference
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• 2012.11a
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• pp.425-430
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• 2012

• Proceedings of the Materials Research Society of Korea Conference
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• 2006.05a
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• pp.32.2-32.2
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• 2006