• Journal of the Korean Wood Science and Technology
• /
• v.38 no.4
• /
• pp.316-322
• /
• 2010

The research attempted to develop a wood adhesive based on waste cooking oil, using ozonification technology for the chemical structure modification. The waste cooking oil (WCO) was reacted with $O_3$ for different times; 1 h, 2 h, and 3 h. The chemical structure modifications of the ozonized WCOs were examined by Fourier transform Infrared (FT-IR) spectrum. The FT-IR spectrum of WCO had an absorbance peak at 3,010 $cm^{-1}$ that was the characteristic peak of the unsaturated double bonds. As ozone treatment time increased, the peak of the double bond was disappeared and carboxyl peak appeared at 1,700 $cm^{-1}$. Especially, the double bond of 3 hrs-ozonized WCO was vanished almost. In results of the dry bonding strengths of the 3 hrs-ozonized WCO mixed with polymeric methylene diphenyl diisocyanate (pMDI) were the strengths of weight ratio of 3hrs-ozonized WCO : pMDI, 1 : 0.5, 8.08 kgf/$cm^2$, 1 : 0.75, 9.53 kgf/$cm^2$ 1 : 1, 44.16 kgf/$cm^2$, 1 : 2, 58.08 kgf/$cm^2$, 1 : 3, 61.41 kgf/$cm^2$, and 1 : 4, 46.95 kgf/$cm^2$. Therefore, it was found that the optimum equivalent ratio was formed at the ratio of 1 : 2 or 1 : 3. Under wetting the bonding strength of 1 : 3 ratio was appeared higher than that of 1 : 2 ratio, while the results obtained from hot-water and cyclic boiling shear test were similar.

• Composites Research
• /
• v.30 no.5
• /
• pp.316-322
• /
• 2017

Carbon fiber is a material with excellent mechanical, electrical and thermal properties, which is widely used as a composite material made of a polymer matrix. However, this composite material has a weak point of interlaminar delamination due to weak interfacial bond with polymer matrix compared with high strength and elasticity of carbon fiber. In order to solve this problem, it is essential to use reinforcements. Due to excellent mechanical properties, graphene have been expected to have large improvement in physical properties as a reinforcing material. However, the aggregation of graphene and the weak interfacial bonding have resulted in failure to properly implement reinforcement effect. In order to solve this problems, dispersibility will be improved. In this study, functionalization of graphene nanoplatelet was proceeded with melamine and mixed with epoxy polymer matrix. The carbon fiber reinforced polymer composites were fabricated using the prepared graphene nanoplatelet/epoxy and flexural properties and interlaminar shear strength were measured. As a result, it was confirmed that the dispersibility of graphene nanoplatelet was improved and the mechanical properties of the composite material were increased.

• Journal of the Korea Concrete Institute
• /
• v.28 no.5
• /
• pp.535-544
• /
• 2016

This paper aims at examining the effects of sustained load and elevated temperature on the time-dependent deformation of a carbon fiber reinforced polymer (CFRP) sheets bonded to concrete as well as the pull-off strength of single-lap shear specimens after the sustained loading period using digital images. Elevated temperature during the sustained loading period resulted in increased slip of the CFRP composites, whereas increased curing time of the polymer resin prior to the sustained loading period resulted in reduced slip. Pull-off tests conducted after sustained loading period showed that the presence of sustained load resulted in increased pull-off strength and interfacial fracture energy. This beneficial effect decreased with increased creep duration. Based on analysis of digital images, results on strain distributions and fracture surfaces indicated that stress relaxation of the epoxy occurred in the 30 mm closest to the loaded end of the CFRP composites during sustained loading, which increased the pull-off strength provided the failure locus remained mostly in the concrete. For longer sustained loading duration, the failure mode of concrete-CFRP bond region can change from a cohesive failure in the concrete to an interfacial failure along the concrete/epoxy interface, which diminished part of the strength increase due to the stress relaxation of the adhesive.

• Journal of the Microelectronics and Packaging Society
• /
• v.13 no.1 s.38
• /
• pp.23-29
• /
• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.3
• /
• pp.17-26
• /
• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

• Restorative Dentistry and Endodontics
• /
• v.27 no.1
• /
• pp.44-53
• /
• 2002

목적 : 최근 개발된 bonding agent 중 일부는 다양한 함량의 filler를 포함하고 있으며 filler의 첨가는 bonding agent의 기계적인 물성을 향상시킴으로써 접착력의 향상에 기여한다는 주장이 있다. 본 연구에서는 다양한 함량의 filler를 포함한 adhesive를 실험적으로 만들어, filler의 함량이 전단접착강도에 미치는 영향을 살펴보고 임상적으로 가장 적절한 filler의 함량을 알아보고자 하였다. 또 adhesive의 간접인장강도를 측정하여 adhesive의 기계적인 물성과 접착력과의 상관관계를 알아보았다. 방법 : 발거된 건전한 70개의 대구치를 투명 레진에 매몰하고 상아질면을 노출시켰다. 3M사의 Scotchbond Multipurpose의 etchant와 primer를 제조사의 지시대로 적용하고 1$\mu\textrm{m}$크기의 barium glass filler를 0, 5, 10, 15, 20, 30, 45wt% 포함하도록 실험적으로 제작한 adhesive를 도포한 후 레진을 충전하여 시편을 완성하였다. Instron으로 0.5mm/min의 속도에서 전단접착강도를 측정하고 그 단면을 입체현미경으로 관찰하여 파절의 양상을 확인하였다. Filler함량에 따른 adhesive의 후경을 측정하기 위해 상기한 방법으로 시편을 제작하여 주사 전자현미경으로 관찰한 후 Sigmascan을 이용하여 그 후경을 측정하였다. 또, 지름 4mm 높이 6mm의 원통형 시편을 제작하여 Instron로 간접인장강도의 측정을 시행하였다. 얻어진 결과는 Kruskal-Wallis test와 Mann-Whitney test를 시행하여 분석하였으며, 상관관계를 분석을 위해 Pearson Product Moment Correlation Coefficient를 구하였다. 결과 : 1) Filler함유량에 따라 전단접착강도는 유의할 만한 차이를 보였다(p<0.05). 2) Filler함량의 증가에 따라 전단접착강도는 유의하게 증가하여 15% 수준에서 가장 높은 갈(19.9$\pm$1.38Mpa)을 보였으며 20% 이상의 수준에서는 유의하게 감소하였다(p<0.05). 3) Adhesive의 간접인장강도는 20% 수준까지는 증가하는 양상을 보였으나 통계적 유의성은 없었으며(p>0.05), 30% 이상에서는 유의할 만한 감소를 보였다(p<0.05). 4) Adhesive의 후경은 0% 수준에서 5.97$\pm$1.23$\mu\textrm{m}$부터 45%수준에서 73.37$\pm$11.7$\mu\textrm{m}$까지 유의하게 증가하였다(p<0.05). 5) Filler함량에 따른 Adhesive의 간접인장강도와 전단접착강도는 상관관계가 없었다.

• Journal of the Korean Wood Science and Technology
• /
• v.35 no.6
• /
• pp.13-22
• /
• 2007

This study was carried out to scrutinize possibility of manufacturing pitch pine (Pinus rigida) glued laminated timber in order to add values of pitch pine trees. Also, it was investigated to improve bending performance of pitch pine glulam. Pitch pine was imported as one of major plantation species in Korean peninsula. Machine stress rated grades of pitch pine lumber mostly ranged between E7 and E9. which grades were more or less inferior to producing high quality glulam. However, the adhesive properties between pitch pine and pitch pine, and between pitch pine and Japanese larch (Larix kaempferi Carr.), such as shear bond strength, wood failure rate and de-lamination rate of bonded layer submerged in cold and boiling water, were higher than Korean Standard criteria. These properties are essential for manufacturing glulam with single species or multiple species. The modulus of rupture (MOR) of pitch pine glulam exceeded the criterion of Korean Standard for glulam strength grade but modulus of elasticity (MOE) was lower than the criterion. On the other hand, the bending performances (MOR and MOE) were improved 20 percent by mixing with Japanese larch laminar. It is effective to arrange higher quality Japanese larch laminar at the outer layer of glulam for improving bending performances. In conclusion, it is possible to use low quality pitch pine as laminar of structural glulam for adding values of pitch pine.

• Journal of Korea Technical Association of The Pulp and Paper Industry
• /
• v.29 no.1
• /
• pp.73-83
• /
• 1997

Most of the materials used in various industrial fields and also in our daily life are multi-component materials or composite materials, and it is well known that there are many cases where adhesion between the constituents within the bonded systems plays an important role. There are various types of performance evaluation tests for the bonded materials, among which tests for evaluating the bond performance under various conditions may be regarded as the most interesting ones for those engaged in work related to adhesion. I have studied on the mechanism of adhesion form the rheological standpoint with my colleagues, including some students from Korea, and I am very happy to be able to have a talk on some of our research works. In Japan, the so-called "adhesives" are usually classified into two categories;adhesives and pressure sensitive adhesives (PSA). Adhesives are the materials which solidify after bonding and are after used as the structural adhesives because the adhesive strength is comparatively strong. On the other hand, the pressure sensitive adhesives never solidify and are used as PSA tapes, labels or decals. About the adhesives, we have examined the dependence of adhesive strength(shear, tensile, peel) upon both temperature and rate of deformation, and found out some empirical rules which are applicable to most of the adhesive systems. We have also developed a simplified theory of adhesion, which is deseribed in terms of mechanical equivalent mode1 and a few failure criteria. Although some of the common rules can be accounted for according to this theory, it must be pointed out that a fracture mechanical approach ms inevitable especially in the region where the meehanical relaxation time of the adhesive is extremely large [W. W. Lim and H. Mizumachi]. About the pressure sensitive adhesives, we have studied on the PSA performance (peel, tack, holding power) as a function of both the viscoelastic properties and surface chemical properties of the materials, and found out some rules, and again we have developed a theory which deseribes the mechanism. And in addition, we have studied on the miscibility between linear polymers and oligomers, because PSA is generally manufactured by blending gums and tackifier resins. Many phase diagrams have been found and some of them have been analyzed on thermodynamic basis, and it became evident that the miscibility is a very important factor in PSA [H. J. Kin and H. Mizumachi]. In this presentation, I want to emphasize the fact that the adhesion performance is closely related to the structure/property of the adhesives.adhesives.

• Journal of the Earthquake Engineering Society of Korea
• /
• v.10 no.1 s.47
• /
• pp.41-49
• /
• 2006

Through the 1982 Urahawa-ohi and the 1995 Kobe earthquakes, a number of bridge columns were observed to develop a flexural-shear failure due to the bond slip as a consequence of premature termination of the column longitudinal reinforcement. Because the seismic behavior of RC bridge piers is largely dependent on the performance of the plastic hinge legion of RC bridge piers, it is desirable that the seismic capacity of RC bridge pier is to evaluate as a curvature ductility. The provision for the lap splice of longitudinal steel was not specified in KHBDS(Korea Highway Bridge Design Specification) before the implementation of 1992 seismic design code, but the lap splice of not more than 50%, longitudinal reinforcement was newly allowed in the 2005 version of the KHBDS. The objective of this research is to investigate the distribution and ductility of the curvature of RC bridge column with the lap splice of longitudinal reinforcement in the plastic hinge legion. Six (6) specimens were made in 600 mm diameter with an aspect ratio of 2.5 or 3.5. These piers were cyclically subjected to the quasi-static loads with the uniform axial load of $P=0.1f_{ck}A_g$. According to the slip failure of longitudinal steels of the lap spliced specimen by cyclic loads, the curvatures of the lower and upper parts of the lap spliced region were bigger and smaller than the corresponding paris of the specimen without a lap splice, respectively. Therefore, the damage of the lap spliced test column was concentrated almost on the lower part of the lap spliced region, that appeared io be failed in flexure.

• Journal of the Korea Concrete Institute
• /
• v.22 no.2
• /
• pp.149-158
• /
• 2010

Recently, numerous construction techniques for repairing and strengthening methods for above ground or air exposed concrete structure have been developed. However repairing and strengthening methods for underwater structural members under continuous loading, such as piers and steel piles need the further development. Therefore, this study develops an aqua epoxy, which can be used for repairing and strengthening of structural members located underwater. Moreover, using the epoxy material and strengthening fibers, a fiber reinforced composite sheet called Aqua Advanced FRP (AAF) for underwater usage is developed. To verify and to obtain properties of the material and the performance of AAF, several tests such as pull-off strength test, bond shear strength test, and chemical resistance test, were carried out. The results showed that the developed aqua epoxy does not easily dissolve in wet conditions and does not create any residual particle during hardening. In spite of underwater conditions, it showed the superior workability, because of the high viscosity over 30,000 cps and adhesion capacity over 2 MPa, which are nearly equivalent to those used in dry conditions. In case of the chemical resistance test, the developed aqua epoxy and composite showed the weight change of about 0.5~1.0%, which verifies the superior chemical resistance.