• Journal of the Korea Institute of Information and Communication Engineering
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• v.5 no.1
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• pp.144-149
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• 2001

There are many types of seam tracking methods actually used in industrial spot. Lately, Non-contact sensor technics are mostly used because non-contact sensor has more advantage than contact sensor in many parts. This paper also concerned about fiber sensor a kind of non-contact sensor. X-Y robot and fiber sensor scan the seam tracking to be weld. After scanning, X-Y robot moves the first working point of being scanned and welding starts automatically. It makes an experiment on some types of Seam tracking like straight line tracking, leaned line tracking and curved line tracking to confirm how well the fibers sensor tracks the seam pass to be weld. And the seam pass that had been tracked was welded by inverter $CO_2$ voiding machine.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2000.10a
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• pp.558-561
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• 2000

There are many types of seam tracking methods actually used in industrial spot. Lately, Non-contact sensor technics are mostly used because non-contact sensor has more advantage than contact sensor in many parts. This paper also concerned about fiber sensor a kind of non-contact sensor. X-Y robot and fiber sensor scan the seam tracking to be weld. After scanning, X-Y robot moves the first working point of being scanned and welding starts automatically. It makes an experiment on some types of Seam tracking like straight line tracking, leaned line tracking and curved line tracking to confirm how well the fibers sensor tracks the seam pass to be weld. And the seam pass that had been tracked was welded by inverter CO2 welding machine.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.6
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• pp.9-18
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• 2001

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.1306-1309
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• 1997

Fabric hand feeling is an important property used in apparel industry. This paper shows a sensing method to output a fiber whisker's stick slip vibration by scanning it on the fabric. Then the vibration waveforms are transformed to the Symmetrized Dot Pattern images. Experimental results show that SDP images of fiber whisker's stik slip is potentially useful to the detection of fabric hand feeling values.

• Proceedings of the KSRS Conference
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• v.1
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• pp.386-389
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• 2006

The sea surface wind speed (SSWS) derived by microwave radiometer can be contaminated by change of microwave brightness temperature owing to the angle between the sensor azimuth and the wind direction (Relative Wind Direction). We attempt to correct the contamination to the SSWS derived by Advanced Microwave Scanning Radiometer (AMSR) on Advanced Earth Observing Satellite II (ADEOS-II), by applying the method proposed by Konda and Shibata (2004). The improvement of accuracy of the SSWS estimation amounts to roughly 60% of the error caused by the RWD effect.

• Journal of the Korean Society of Safety
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• v.16 no.4
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• pp.7-13
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• 2001

Wire electrical discharge machining experiments in conducted to investigate characteristics of acoustic emission (AE) and electrical discharge energy due to current peak (I$_{p}$), pulse on time($\tau$/on/). The AE signals are obtained with a sensor attached to workpiece side. Machining states are identified with scanning electron microscopy and residual stress analyzer. It is demonstrated that the residual stress provide reliable informations about the machining states. Moreover, machining states can be detected successfully using both the residual stress and AE count rate.e.

• Journal of Biomedical Engineering Research
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• v.16 no.1
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• pp.43-48
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• 1995

A high speed optic scanner capable of 16 frames/sec imaging has been developed for the realization of the infrared thermal Imaging system with a single element infrared sensor. The high speed optic scanner is composed of a rotating polygon mirror for horizontal scanning, a flat mirror mounted on a galvanometer for vertical scanning, and a spherical mirror. It has been experimentally found that the optic scanner is capable of 16 framesllsec imaging with the frame matrix size of 256 x 64.

• Korean Journal of Construction Engineering and Management
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• v.25 no.3
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• pp.68-82
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• 2024

The planning stage of laser scanning is crucial for acquiring high-quality 3D source data. It involves assessing the target space's environment and formulating an effective measurement strategy. However, existing practices often overlook on-site conditions, with decisions on scanner deployment and scanning locations relying heavily on the operators' experience. This approach has resulted in frequent modifications to scanning locations and diminished 3D data quality. Previous research has explored the selection of optimal scanner locations and conducted preliminary reviews through simulation, but these methods have significant drawbacks. They fail to consider scanner inaccuracies, do not support the use of multiple scanners, rely on less accurate 2D drawings, and require specialized knowledge in 3D modeling and programming. This study introduces an optimization technique for laser scanning planning using 3D simulation to address these issues. By evaluating the accuracy of scan data from various laser scanners and their positioning for scanning a retaining wall structure in a small-scale building, this method aids in refining the laser scanning plan. It enhances the decision-making process for end-users by ensuring data quality and reducing the need for plan adjustments during the planning phase.

• Proceedings of the KSRS Conference
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• 1998.09a
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• pp.301-306
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• 1998

Korea Aerospace Research Institute (KARI) is developing a Korea Multi-Purpose Satellite I (KOMPSAT-I) which accommodates Electro-Optical Camera (EOC), Ocean Scanning Multi-spectral Imager (OSMI), and Space Physics Sensor (SPS). The satellite has the weight of about 500kg and will be operated on the 10:50 AM sun-synchronized orbit with the altitude of 685 km. The satellite will be launched in 1999 and its lifetime is expected to be over 3 years. The main mission of EOC is the cartography to provide the images from a remote earth view for the production of 1/25000-scale maps of KOREA. EOC collects 510 ~ 730 nm panchromatic imagery with the ground sample distance(GSD) of 6.6 m and the swath width of 17 km by push broom scanning. EOC also can scan $\pm$45 degree across the ground track using body pointing method. The primary mission of OSMI is worldwide ocean color monitoring for the study of biological oceanography. It will generate 6 band ocean color images with 800 km swath width and 1km GSD by whiskbroom scanning. OSMI is designed to provide on-orbit spectral band selectability in the spectral range from 400 nm to 900 nm through ground command. This flexibility in band selection can be used for various applications and will provide research opportunities to support the next generation sensor design. SPS consists of High Energy Particle Detector (HEPD) and ionosphere Measurement Sensor (IMS). HEPD has missions to characterize the low altitude high-energy Particle environment and to study the effects of radiation environment on microelectronics. IMS measures densities and temperature of electrons in the ionosphere and monitors the ionospheric irregularities at the KOMPSAT orbit.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1231-1235
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• 2004

The needs of micro scale thermal detecting technique are increasing in biology and chemical industry. For example, Thermal finger print, Micro PCR(polymer chain reaction), ${\mu}TAS$ and so on. To satisfy these needs, we developed a DTSA(Diode Temperature Sensor Array) for detecting and controlling the temperature on small surface. The DTSA is fabricated by using VLSI technique. It consists of 32 ${\times}$ 32 array of diodes (1,024 diodes) for temperature detection and 8 heaters for temperature control on a 8mm ${\times}$ 8mm surface area. The working principle of temperature detection is that the forward voltage drop across a silicon diode is approximately proportional to the inverse of the absolute temperature of diode. And eight heaters ($1K{\Omega}$) made of poly-silicon are added onto a silicon wafer and controlled individually to maintain a uniform temperature distribution across the DTSA. Flip chip packaging used for easy connection of the DTSA. The circuitry for scanning and controlling DTSA are also developed