• The Journal of Korean Institute for Practical Engineering Education
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• v.4 no.2
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• pp.91-97
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• 2012

The automated visual inspection system (machine vision system) for quality assurance is an important factory automation equipment in the manufacturing industries, such as display, semiconductor, etc. The world market of the machine vision components is expected 18 billon dollars in 2015. Therefore, there is a lot of demand for the machine vision engineers. However, there are no technical training courses for machine vision technologies in vocational schools, colleges and universities. In this paper, we propose a technical training program for the machine vision technology. The total time of training is 30 to 60 hours and the training program can operate flexibly by student's major, a priori knowledge and education level.

• Journal of Practical Engineering Education
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• v.6 no.1
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• pp.37-42
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• 2014

The automated visual inspection system (machine vision system) for quality assurance is important factory automation equipment in the manufacturing industries, such as display, semiconductor, etc. There is a lot of demand for the machine vision engineers. However, there are no technical training courses for machine vision technologies in vocational schools, colleges and universities. In this paper, we present the implementation of line scan camera based equipment for technical training of the automated visual inspection system. The training system consists of the X-Y stage which is widely used in machine vision industries and its variable image resolution are set to $10-30{\mu}m$. Additionally, this training system can attach the industrial illumination, either the direct illuminator or coaxial illuminator, for verifying the effect of illuminations. This means that the trainee can have a practical training in various equipment conditions and the training system is similar to the automated visual inspection system in industries.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.8
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• pp.38-45
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• 2016

The objective of this research is to develop a method of improving MEP facility management based on 3D reverse engineering. Recently, 3D image scanning-based reverse engineering has been implemented in the fields of architecture, construction and (manufacturing). In the case where there are many objects and the MEP system is complicated, 3D reverse engineering is applied in semiconductor factories, because facility maintenance works cause the 2D drawing to be different from the original one. The 3D point cloud data obtained from 3D image scanning contains accurate data and can increase the efficiency of complicated MEP facility maintenance works. For this purpose, the present research studied the technology trends and analyzed the process of 3D reverse engineering. Based on the results, a method of improving MEP facility management is established and its effects described.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.17 no.10
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• pp.967-975
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• 2007

A rotordynamic analysis was performed with a dry vacuum pump, which is a major equipment in modern semiconductor and LCD manufacturing processes. The system is composed of screw rotors, lobes picking air, helical gears, driving motor, and support rolling element bearings of rotors and motor. The driving motor-screw rotor system has a rated speed of 6,300 rpm, and was modeled utilizing a rotordynamic FE method for analysis, which was verified through 3-D FE analysis and experimental modal analysis. As loadings on the bearings due to the gear action were significant in the system considered, each resultant bearing load was calculated by considering the generalized forces of the gear action as well as the rotor itself. Each resultant bearing loading was used in calculating each stiffness of rolling element bearings. Design goals are to achieve wide separation margins of lateral and torsional critical speeds, and favorable unbalance responses of the rotor in the operating range. Then, a complex rotordynamic analysis of the system was carried out to evaluate its forward synchronous critical speeds, whirl natural frequencies and mode shapes, unbalance responses under various unbalance locations, and torsional interference diagram. Results show that the entire system is well designed in the operating range. In addition, the procedure of rotordynamic analysis for dry vacuum pump rotor-bearing system was proposed and established.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.523-523
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• 2012

As the wafer geometric requirements continuously complicated and minutes in tens of nanometers, the expectation of real-time add-on sensors for in-situ plasma process monitoring is rapidly increasing. Various industry applications, utilizing plasma impedance monitor (PIM) and optical emission spectroscopy (OES), on etch end point detection, etch chemistry investigation, health monitoring, fault detection and classification, and advanced process control are good examples. However, process monitoring in semiconductor manufacturing industry requires non-invasiveness. The hypothesis behind the optical monitoring of plasma induced ion current is for the monitoring of plasma induced charging damage in non-invasive optical way. In plasma dielectric via etching, the bombardment of reactive ions on exposed conductor patterns may induce electrical current. Induced electrical charge can further flow down to device level, and accumulated charges in the consecutive plasma processes during back-end metallization can create plasma induced charging damage to shift the threshold voltage of device. As a preliminary research for the hypothesis, we performed two phases experiment to measure the plasma induced current in etch environmental condition. We fabricated electrical test circuits to convert induced current to flickering frequency of LED output, and the flickering frequency was measured by high speed optical plasma monitoring system (OPMS) in 10 kHz. Current-frequency calibration was done in offline by applying stepwise current increase while LED flickering was measured. Once the performance of the test circuits was evaluated, a metal pad for collecting ion bombardment during plasma etch condition was placed inside etch chamber, and the LED output frequency was measured in real-time. It was successful to acquire high speed optical emission data acquisition in 10 kHz. Offline measurement with the test circuitry was satisfactory, and we are continuously investigating the potential of real-time in-situ plasma induce current measurement via OPMS.

• Journal of the Korean Institute of Intelligent Systems
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• v.11 no.3
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• pp.215-222
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• 2001

Neural network based models of semiconductor manufacturing processes have been shown to offer advantages in both accuracy and generalization over traditional methods. However, model development is often complicated by the fact that back-propagation neural networks contain several adjustable parameters whose optimal values unknown during training. These include learning rate, momentum, training tolerance, and the number of hidden layer neurOnS. This paper presents an investigation of the use of genetic algorithms (GAs) to determine the optimal neural network parameters for the modeling of plasma-enhanced chemical vapor deposition (PECVD) of silicon dioxide films. To find an optimal parameter set for the neural network PECVD models, a performance index was defined and used in the GA objective function. This index was designed to account for network prediction error as well as training error, with a higher emphasis on reducing prediction error. The results of the genetic search were compared with the results of a similar search using the simplex algorithm.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.11
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• pp.1584-1590
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• 2017

This paper presents a implementation method of reliable speed limitation controller considering motor parameter variation in high speed operation. In spinning process of drum washing machine, speed increase has to be limited when unallowable imbalance mass is detected. Otherwise, severe noise and vibration can happen because noise and vibration are proportional to imbalance mass. To detect imbalance mass, d-axis current magnitude is used. However, we have to compensate for back-emf and power supply variation by means of detecting them because d-axis current is affected by both of them. On the other hand, we have to carefully estimate back-emf because back-emf is affected by stator resistance variation and inverter voltage error. Stator resistance variation can happen by manufacturing process for mass production or temperature variation in running. And there are inverter voltage errors between command voltage from micro-computer to inverter and real voltage from inverter to motor because of rising and falling time delay and turn-on resistance of power semiconductor switch. To solve this problem, we propose 2-step align current injection method which is to inject step-wise current right before starting. By this method, we can simply obtain stator resistance by ratio of voltage without inverter voltage error and current, and we can measure inverter voltage error. So we can obtain more exact model current, and then by simple calculation with compensation gain, we can estimate more accurate motor back-emf. We show that this method works well. It is verified through experiments.

• Clean Technology
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• v.17 no.3
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• pp.250-258
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• 2011

Thermal plasma has been presented for the decomposition of perfluorocompounds (PFCs) which are extensively used in the semiconductor manufacturing and display industry. We developed pilot-scale equipment to investigate the large scale treatment of PFCs and called it a "thermal plasma scrubber". PFCs such as $CF_4$, $C_2F_6$, $SF_6$, and $NF_3$ used in experiments were diluted with $N_2$. There were two different types of experiment setup related to the water spray direction inside the thermal plasma scrubber. The first type was that the water was sprayed directly into the gas outlet located at the exit of the reaction section. The second type was that the water was sprayed on the wall of the quenching section. More effective decomposition took place when the water was sprayed on the quenching section wall. For $C_2F_6$, $SF_6$, and $NF_3$ the maximum destruction and removal efficiency was nearly 100%, and for $CF_4$ was up to 93%.

• The KSFM Journal of Fluid Machinery
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• v.19 no.4
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• pp.35-38
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• 2016

A PFA lined ball valve, which is machined with fluorinated resin PFA to its inner part for improving corrosion resistance, non-stickness, heat-resistance, has been widely used in semiconductor/LCD manufacturing processes with the high purity chemicals as working fluid. Due to the safety concerns, the experiments for measuring the flow coefficient of a PFA lined ball valve should be conducted with water at room temperature according to IEC standards. However, it is required to know the real flow coefficient with the real working fluid, because the flow coefficient is critical to correctly design valves in piping system. In this study, we calculated the flow coefficient of a PFA lined ball valve 40A with hydrochloric acid ($40^{\circ}C$ 36% HCl) as the working fluid using a commercial CFD package, ANSYS CFX v15. The computational results had a good agreement with the measured data and showed a little difference between water and hydrochloric acid as the working fluid of a PFA lined ball valve.

• Korean Chemical Engineering Research
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• v.49 no.4
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• pp.485-490
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• 2011

Tetrafluoromethane($CF_4$) has been used as etching and chamber cleaning gases for semiconductor manufacturing processes. These gases need to be removed efficiently because of their strong absorption of infrared radiation and long atmospheric lifetime which causes the global warming effect. We have developed a waterjet gliding arc plasma system in which plasma is combined with waterjet and investigated optimum operating conditions for efficient $CF_4$ destruction through enlarging discharge region and producing large amount of OH radicals. The operating conditions are waterjet flow rate, initial $CF_4$ concentration, total gas flow rate, specific energy input. Through the parametric studies, the highest $CF_4$ destruction of 97% was achieved at 2.2% $CF_4$, 7.2 kJ/L SEI, 9 L/min total gas flow rate and 25.5 mL/min waterjet flow rate.