• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.429-433
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• 1997

High-speed and high-precision are trendy at present in the development of machine tools which are required for various fields of industry such as semiconductor, automobde, mold fabricat~on and so on. High damping capacity of the structure is an iniportant factor to ohtain precise products without vibration during manufacturing caused by rapid trarisportatm and rotation of spindle unit Resin concrete have high potential for machine tool bed due to its good damping characteristics. In this study, the statlc and dynamic characteristics of the machine tool bed were analysed. Also, the hybrid machine tool bed, made of steel base and polyester resin concrete material, was manufactured and its good dynamic characteristics were proved experimentally.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.162-165
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• 2007

TFT-LCD process has two advantages as compared with the semiconductor-process. It is that cycle time is short and number of the final products are small. But it needs complicated inspection / assembly line to be treated manually and much higher labor costs in the TFT-LCD process. Also, It is necessary to build PICS(Production Information and Control System) which is automated and intelligent. In this paper, an automated process of LCD module assembly line that can increase productivity and reduce the cost of production to strengthen the competitiveness corresponding with global market is planned in comparison with its manual/semi-auto. It is noted that The automated line for COG$\sim$FOG process replacing with the existing facilities had the following effects; the productivity is increased to about 1.5 times and labor cost reduced 85%. In addition, whole assembly line can be short and simple.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.12
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• pp.76-82
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• 1997

Chemical mechanical polishing (CMP) has become widely accepted for the planarization of multi-interconnect structures in semiconductor manufacturing. However, perfect planarization is not so easily ahieved because it depends on the pattern sensitivity, the large number of controllable process parameters, and the absence of a reliable process model, etc. In this paper, we realized the planarization of deposited oxide layers followed by metal (W) polishing as a replacement for tungsten etch-back process for via formation. Atomic force microscope (AFM) is used for the evaluation of pattern topography during CMP. As a result, AFM evaluation is very attractive compared to conventional methods for the measurment of planarity. mOreover, it will contribute to analyze planarization characteristics and establish CMP model.

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.3
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• pp.174-180
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• 2009

A new flexible electronics technology, named P-FCB (Planar Fashionable Circuit Board), is introduced. P-FCB is a circuit board technology implemented on the plain fabric patch for wearable electronics applications. In this paper, the manufacturing of P-FCB, and its electrical characteristics such as sheet resistance, maximum current density, and frequency characteristics are reported. The fabrication methods and their electrical characteristics of passive devices such as resistor, capacitor, and inductor in P-FCB are discussed. In addition, how to integrate silicon chip directly to the fabric for the flexible electronics system are described. Finally, examples of P-FCB applications will be presented.

• Proceedings of the Optical Society of Korea Conference
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• 2000.02a
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• pp.224-225
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• 2000

Transparent and hard materials such as sapphire are used for many industrial applications as optical windows, hard materials on mechanical contact against abrasion, and substrate materials for opto-electronic semiconductor devices such as blue LED and blue LD etc. The materials should be cut along the proper shapes possible to be used for each application. In case of blue LED, the blue LED wafer should be cut to thousands of blue LED pieces at the final stage of the manufacturing process. The process of cutting the wafer is usually divided into two steps. The wafer is scribed along the proper shapes in the first step. It is inserted between transparent flexible sheets for easy handling. And then, it is broken and split in the next step. Harder materials such as diamonds are usually used to scribe the wafer, while it has a problem of low depth of scribing and abrasion of the harder material itself. The low depth of scribing can induce failure in breaking the wafer along the scribed line. It was also known that the expensive diamond tip should be replaced frequently for the abrasion. (omitted)

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.12 no.1
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• pp.65-72
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• 2002

Generally, there are laser operating equipments( aligner, stepper) and electronic microscope( SEM, TEM) as a high precision manufacturing and inspection equipment in semiconductor production companies, precision examination and measuring laboratories. Mostly, these equipments are characterized by projection and target part. The relative displacements between projection and target part are dominant roles in vibrational problem in these precision equipments. These relative displacements are determined by the position of incoming vibration and the difference of vibration response in projection and target part. In this study, the allowable vibrational limits are suggested and the vibrational reduction plans are proposed by measurement and analysis of vibration phenomenon in the Clean Room in PDP(plasma display panel) production building. The vibration performance is evaluated by comparison relative displacements between projection and target part before/after the vibration isolation plan.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.621-628
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• 2000

A kinematic ball bar measuring system can analyze the various errors of a machine tool easil rapidly with only one measurement, But it cannot be used to measure the errors of the equipment the semiconductor manufacturing (e.g. chip mounter, PCB router etc.) not to use a cir interpolation. This paper presents the method to apply a kinematic ball bar measuring system tc machines which use merely a linear interpolation Also, the work of measuring and calibratir various errors of a chip mounter with a kinematic bal1 bar measurement system is accomplished

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.6
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• pp.771-780
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• 2016

Detecting a set of longest paths is one of the crucial steps in static timing analysis and optimization. Recently, the process variation during manufacturing affects performance of the circuit design due to nanometer feature size. Measuring the performance of a circuit prior to its fabrication requires a considerable amount of computation time because it requires multi-corner and multi-mode analysis with process variations. An efficient algorithm of detecting the K-most critical paths in multi-corner multi-mode static timing analysis (MCMM STA) is proposed in this paper. The ISCAS'85 benchmark suite using a 32 nm technology is applied to verify the proposed method. The proposed K-most critical paths detection method reduces about 25% of computation time on average.

• Proceedings of the KIEE Conference
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• 2006.04a
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• pp.234-236
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• 2006

Because of its long measurement range and ultra-precise resolution. the heterodyne laser interferometer systems are very common in various industry area such as semiconductor manufacturing. However the periodical nonlinearity property caused from frequency mixing is an obstacle to improve the high measurement accuracy in nanometer scale. In this paper to minimize the effect of nonlinearity, we propose an adaptive nonlinearity compensation algorithm. We first compute compensation parameters using least square (LS) with the capacitance displacement sensor as a reference input. We then update the parameters with recursive LS (RLS) while the values are optimized to modify the elliptical phase into circular one. Through comparison with some experimental results of laser system, we demonstrate the effectiveness of our proposed algorithm.

• Proceedings of the KIEE Conference
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• 2004.04a
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• pp.6-8
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• 2004

Recently, it is increasing to use more Brushless DC Motor with high energy density permanent magnet and semiconductor control unit for complementing the mechanical defect of Brushed DC Motors. For designing of BLDC Motors are required complex parameters like as rated characteristic, Geometries, B-H curve of magnet and steel materials, winding factor, etc. Moreover, design and manufacturing are difficult because of additional control circuits. Generally, Design parameters are gotten by analysis of Motor which is used. And the design parameters are used to design a new motor. But getting the design parameters through the eyes and experience is limited and it takes a long time. In this paper a method is proposed to efficiently analyze motor design parameters through the No load and Load Test, Back EMF Test, Simulation Analysis and Patent Analysis Method for existing BLDC Motor for a cooling Fan in Vehicle.