• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.345-350
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• 2002

In this study, researchers classifying the artificial flaws in semiconductor packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method fur entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2005년도 춘계학술대회 논문집
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• pp.91-96
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• 2005

In this study, researchers developed the estimative algorithm for artificial defects in semiconductor packages and performed it by pattern recognition technology. For this purpose, the estimative algorithm was included that researchers made software with MATLAB. The software consists of some procedures including ultrasonic image acquisition, equalization filtering, Self-Organizing Map and Backpropagation Neural Network. Self-Organizing Map and Backpropagation Neural Network are belong to methods of Neural Networks. And the pattern recognition technology has applied to classify three kinds of detective patterns in semiconductor packages: Crack, Delamination and Normal. According to the results, we were confirmed that estimative algorithm was provided the recognition rates of $75.7\%$ (for Crack) and $83_4\%$ (for Delamination) and $87.2\%$ (for Normal).

• JSTS:Journal of Semiconductor Technology and Science
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• 제13권2호
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• pp.114-126
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• 2013

In this paper, we present a set of methodologies to model the electromagnetic susceptibility (EMS) testing of I/O buffers for mobile system memory based on the bulk current injection (BCI) method. An efficient equivalent circuit model is developed for the current injection probe, line impedance stabilization network (LISN), printed circuit board (PCB), and package. The simulation results show good correlation with the measurements and thus, the work presented here will enable electromagnetic susceptibility analysis at the integrated circuit (IC) design stage.

• International Journal of Precision Engineering and Manufacturing
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• 제5권3호
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• pp.11-18
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• 2004

In this paper, the classification of artificial defects in semiconductor packages is studied by using pattern recognition technology. For this purpose, the pattern recognition algorithm includes the user made MATLAB code. And preprocess is made of the image process and self-organizing map, which is the input of the back-propagation neural network and the dimensionality reduction method, The image process steps are data acquisition, equalization, binary and edge detection. Image process and self-organizing map are compared to the preprocess method. Also the pattern recognition technology is applied to classify two kinds of defects in semiconductor packages: cracks and delaminations.

• 한국정밀공학회지
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• 제27권6호
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• pp.32-38
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• 2010

Laser material processing technology is adopted in several industry as alternative process which could overcome weakness and problems of present adopted process, especially semiconductor and display industry. In semiconductor industry, laser photo lithography is doing at front-end level, and cutting, drilling, and marking technology for both wafer and EMC mold package is adopted. Laser cleaning and de-flashing are new rising technology. There are 3 kinds of main display industry which use laser technology - TFT LCD, AMOLED, Touch screen. Laser glass cutting, laser marking, laser direct patterning, laser annealing, laser repairing, laser frit sealing are major application in display industry.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.721-726
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• 2005

In this study, researchers classifying the artificial flaws in semiconductor. packages are performed by pattern recognition technology. For this purposes, image pattern recognition package including the user made software was developed and total procedure including ultrasonic image acquisition, equalization filtration, binary process, edge detection and classifier design is treated by Backpropagation Neural Network. Specially, it is compared with various weights of Backpropagation Neural Network and it is compared with threshold level of edge detection in preprocessing method for entrance into Multi-Layer Perceptron(Backpropagation Neural network). Also, the pattern recognition techniques is applied to the classification problem of defects in semiconductor packages as normal, crack, delamination. According to this results, it is possible to acquire the recognition rate of 100% for Backpropagation Neural Network.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.86.3-86
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• 2001

Hall effect sensor using 7um, 1.7 ohm-cm or 10um, 3.5 ohm-cm Bipolar process was successfully developed. The Hall sensor consists of various patterns, such as regular shapes, rectangles, diamond, hexagon and cross shapes to optimize offset voltage and sensitivity for proper applications. In order to measure offset voltage in chip scale the Agilent company´s 4156C and Nano-Voltage Meter were used and the best structure in offset voltage was finally selected by using ceramic package. The patterns appear to be the quadri-rectangular patterns entirely and three-parallelogram patterns. The measured offset voltages were found to be about 173-365uV. Meanwhile, in ...

• 한국융합학회논문지
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• 제8권11호
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• pp.15-20
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• 2017

최근 IT 산업의 발전으로 다양한 분야에서 컴퓨터 융합 기술에 대한 관심이 높아지고 있다. 특히 반도체 분야에서 생산 공정에 반도체 소자의 결함을 검사하기 위하여 카메라와 컴퓨터를 융합한 비전 시스템을 많이 사용하고 있다. 이러한 영상 관련 시스템들은 데이터를 처리하는 과정에서 열화 현상이 발생하기에 주유한 요인인 잡음을 제거하기 위한 다양한 연구가 이루어지고 있다. 이에 본 논문에서는 BGA 패키지 소자를 대상으로 양산 과정에서 결함을 사전에 인식하여 불량을 검출하기 위하여 영상 데이터의 잡음제거에 많이 사용하고 있는 가우시안 필터, 미디언 필터, 평균 필터를 이용한 측정 시스템을 제안한다. 제안 시스템을 BGA 패키지 생산 공정에 적용하면 신속하게 양품과 불량을 판정할 수 있어 생산성이 향상될 것으로 기대된다.

• 마이크로전자및패키징학회지
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• 제21권3호
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• pp.7-17
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• 2014

Power electronics modules are semiconductor components that are widely used in airplanes, trains, automobiles, and energy generation and conversion facilities. In particular, insulated gate bipolar transistors(IGBT) have been widely utilized in high power and fast switching applications for power management including power supplies, uninterruptible power systems, and AC/DC converters. In these days, IGBT are the predominant power semiconductors for high current applications in electrical and hybrid vehicles application. In these application environments, the physical conditions are often severe with strong electric currents, high voltage, high temperature, high humidity, and vibrations. Therefore, IGBT module packages involves a number of challenges for the design engineer in terms of reliability. Thermal and thermal-mechanical management are critical for power electronics modules. The failure mechanisms that limit the number of power cycles are caused by the coefficient of thermal expansion mismatch between the materials used in the IGBT modules. All interfaces in the module could be locations for potential failures. Therefore, a proper thermal design where the temperature does not exceed an allowable limit of the devices has been a key factor in developing IGBT modules. In this paper, we discussed the effects of various package materials on heat dissipation and thermal management, as well as recent technology of the new package materials.

• 반도체디스플레이기술학회지
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• 제18권1호
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• pp.10-14
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• 2019

In this study, we synthesized two $Y_3Al_5O_{12}:Ce^{3+}$ phosphors ($7{\mu}m$-sized and $2{\mu}m$-sized YAG) with different sizes by controlling particles sizes of starting materials of the phosphors for white LED. In the smaller one ($2{\mu}m$-sized YAG), its photoluminescence intensity in the reflective mode was 63 % that of the bigger one ($7{\mu}m$-sized YAG); the quantum efficiencies were 93 % and 70 % for the smaller and the bigger ones. Two kinds of white LED packages with the same color coordinates were fabricated with a blue package (chip size $53{\times}30$) and two phosphors. The luminous flux of the white LED package with the smaller YAG phosphor was 92 % of that with the bigger one, indicating that the quantum efficiency of phosphor dispersed inside LED package was higher than that of the pure powder. It was consistently confirmed by the optical simulation (LightTools 6.3). It is notable according to the optical simulation that the white LED with the smaller phosphor showed 24 % higher luminous efficiency. If the smaller one had the same quantum efficiency as the bigger one (~93 %). Therefore, it can be suggested that the higher luminous efficiency of white LED can be possible by reducing the particle size of the phosphor along with maintaining its similar quantum efficiency.