• Proceedings of the Korean Operations and Management Science Society Conference
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• 2004.10a
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• pp.603-606
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• 2004

본 연구는 반도체 검사공정 중의 하나인 MBT 공정의 Rework 투입정책에 관한 연구이다. MBT 공정에서는 제품의 신뢰성과는 상관없이 설비오류로 인한 불량품이 다량으로 발생한다. 이러한 불량품을 MBT 공정의 재검사 작업인 Rework을 통해 양품으로 전환하게 된다. MBT 공정의 Rework은 FAB 공정 이후의 많은 공정을 거치지 않고 단일공정 진행으로 새로운 양품을 얻을 수 있는 이점을 가진다. 반면에 Rework 비용 및 공정재고비용이 발생하는 특징이 있다. 현재 MBT 공정의 Rework 작업은 정해진 규칙 없이 작업자 경험에 의존하여 진행하며, 제품의 중요도 및 재고량에 따라 투입이 정해진다. 또한 주문 작업의 투입일정과 납기를 고려하지 않은 Rework 작업으로 인해 납기차질이 발생하기도 한다. 본 연구에서는 Rework 작업이 생산계획에 영향을 주지 않는 범위 안에서의 투입계획을 제안한다. 또한 MBT 공정의 Rework 이익인 제조원가 절감이익과 비용인 Rework 비용, 재고비용을 고려한 Rework 제품 투입정책을 제안한다.

• Journal of information and communication convergence engineering
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• v.10 no.3
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• pp.295-299
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• 2012

Defect generation during organic bottom anti-reflective coating (BARC) in the photo lithography process is closely related to humidity control in the BARC coating unit. Defects are related to the water component due to the humidity and act as a blocking material for the etching process, resulting in an extreme pattern bridging in the subsequent BARC etching process of the poly etch step. In this paper, the lower limit for the humidity that should be stringently controlled for to prevent defect generation during BARC coating is proposed. Various images of defects are inspected using various inspection tools utilizing optical and electron beams. The mechanism for defect generation only in the specific BARC coating step is analyzed and explained. The BARC defect-induced gate pattern bridging mechanism in the lithography process is also well explained in this paper.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.87-91
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• 2021

Various Cu ions are discharged into water from various industries, which results in a severe trouble for groundwater, soil, air, and eventually animals and humans. In this work, graphene oxide (GO) is introduced as a Cu removal absorber and the real-time monitoring method is demonstrated. The results show that GO is a very effective material to absorb Cu ions in the solution. In addition, the residual Cu ions in the solution is monitored via optical transmittance method, which well match with Inductively Coupled Plasma Mass Spectrometer (ICP-MS) analysis.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.17-21
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• 2022

In the case of the manufacturing industry that produces high-tech components such as semiconductors and large flat panel displays, the manufacturing space is made into a cleanroom to increase product yield and reliability, and various environmental factors have been managed to maintain the environment. Among them, airborne particle is a representative management item enough to be the standard for actual cleanroom grade, and a sequential particle monitoring system is usually used as one parts of the FMS (Fab or Facility monitoring system). However, this method has a problem in that the measurement efficiency decreases as the length of the sampling tube increases. In this study, in order to solve this problem, a multiple regression model was created. This model can correct the measurement error due to the decrease in efficiency by sampling tube length.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.34 no.8C
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• pp.806-813
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• 2009

This paper presents a modem chip design for high-speed wireless communications. Among the high-speed communication technologies, we design the UWB (Ultra-Wideband) modem SoC (System-on-Chip) Chip based on a MB-OFDM scheme which uses wide frequency band and gives low frequency interference to other communication services. The baseband system of the modem SoC chip is designed according to the standard document published by WiMedia. The SoC chip consists of FFT/IFFT (Fast Fourier Transform/Inverse Fast Fourier Transform), transmitter, receiver, symbol synchronizer, frequency offset estimator, Viterbi decoder, and other receiving parts. The chip is designed using 90nm CMOS (Complementary Metal-Oxide-Semiconductor) procedure. The chip size is about 5mm x 5mm and was fab-out in July 20th, 2009.

• Journal of Korean Institute of Industrial Engineers
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• v.36 no.2
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• pp.125-137
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• 2010

This study focuses on the problem of scheduling wafer lots of several product families in the deposition workstation in a semiconductor wafer fabrication facility. There are multiple identical parallel machines in the deposition workstation, and two types of setups, record-dependent setup and family setup, may be required at the deposition machines. A record-dependent setup is needed to find optimal operational conditions for a wafer lot on a machine, and a family setup is needed between processings of different families. We suggest two-phase heuristic algorithms in which a priority-rule-based scheduling algorithm is used to generate an initial schedule in the first phase and the schedule is improved in the second phase. Results of computational tests on randomly generated test problems show that the suggested algorithms outperform a scheduling method used in a real manufacturing system in terms of the sum of weighted flowtimes of the wafer lots.

• Journal of information and communication convergence engineering
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• v.11 no.4
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• pp.288-292
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• 2013

In this paper, a carbon implant is investigated in detail from the perspectives of performance advantages and side effects for the thick n-type metal-oxide-semiconductor field-effect transistor (n-MOSFET). Threshold voltage ($V_{th}$) adjustment using a carbon implant significantly improves the $V_{th}$ mismatch performance in a thick (3.3-V) n-MOS transistor. It has been reported that a bad mismatch occurs particularly in the case of 0.11-${\mu}m$ $V_{th}$ node technology. This paper investigates a carbon implant process as a promising candidate for the optimal $V_{th}$ roll-off curve. The carbon implant makes the $V_{th}$ roll-off curve perfectly flat, which is explained in detail. Further, the mechanism of hot carrier injection lifetime degradation by the carbon implant is investigated, and new process integration involving the addition of a nitrogen implant in the lightly doped drain process is offered as its solution. This paper presents the critical side effects, such as Isub increases and device performance shifts caused by the carbon implant and suggests an efficient method to avoid these issues.

• Journal of Industrial Technology
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• v.39 no.1
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• pp.27-31
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• 2019

Semiconductor logistics systems are facing difficulties in increasing production as production processes become more complicated due to the upgrading of fine processes. Therefore, the purpose of the research is to design predictive models that can predict traffic during the pre-planning stage, identify the risk zones that occur during the production process, and prevent them in advance. As a solution, we build FABs using automode simulation to collect data. Then, the traffic prediction model of the areas of interest is constructed using deep learning techniques (keras - multistory conceptron structure). The design of the predictive model gave an estimate of the traffic in the area of interest with an accuracy of about 87%. The expected effect can be used as an indicator for making decisions by proactively identifying congestion risk areas during the Fab Design or Factory Expansion Planning stage, as the maximum traffic per section is predicted.

• Journal of the Semiconductor & Display Technology
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• v.22 no.1
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• pp.1-5
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• 2023

Most of the production process is performed in a cleanroom in the case of facilities that produce semiconductor chips or display panels. Therefore, environmental management of cleanrooms is very important for product yield and quality control. Among them, airborne particles are a representative management item enough to be the standard for the actual cleanroom rating, and it is a part of the Fab or Facility monitoring system, and the sequential particle monitoring system is mainly used. However, this method has a problem in that measurement efficiency decreases as the length of the sampling tube increases. In addition, a statistically significant test of deterioration in efficiency has rarely been performed. Therefore, in this study, the statistically significant test between the number of particles measured by InSitu and the number of particles measured for each sampling tube ends(Remote). Through this, the efficiency degradation problem of the sequential particle monitoring system was confirmed by a statistical method.

• Safety and Health at Work
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• v.2 no.3
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• pp.210-217
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• 2011

Objectives: The purpose of this study was to measure the concentration of volatile organic compound (VOC)s originated from the chemicals used and/or derived from the original parental chemicals in the photolithography processes of semiconductor manufacturing factories. Methods: A total of four photolithography processes in 4 Fabs at three different semiconductor manufacturing factories in Korea were selected for this study. This study investigated the types of chemicals used and generated during the photolithography process of each Fab, and the concentration levels of VOCs for each Fab. Results: A variety of organic compounds such as ketone, alcohol, and acetate compounds as well as aromatic compounds were used as solvents and developing agents in the processes. Also, the generation of by-products, such as toluene and phenol, was identified through a thermal decomposition experiment performed on a photoresist. The VOC concentration levels in the processes were lower than 5% of the threshold limit value (TLV)s. However, the air contaminated with chemical substances generated during the processes was re-circulated through the ventilation system, thereby affecting the airborne VOC concentrations in the photolithography processes. Conclusion: Tens of organic compounds were being used in the photolithography processes, though the types of chemical used varied with the factory. Also, by-products, such as aromatic compounds, could be generated during photoresist patterning by exposure to light. Although the airborne VOC concentrations resulting from the processes were lower than 5% of the TLVs, employees still could be exposed directly or indirectly to various types of VOCs.