• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.05a
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• pp.251-254
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• 2006

In this paper, cutting qualifies and fracture strength of silicon dies by laser dicing are investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bending test and is compared with the die strength by mechanical sawing. As a results, die strength by the laser dicing shows a decrease of 50% in compared with die strength by the mechanical sawing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.373-374
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• 2012

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.102-102
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• 1998

• Korean Journal of Materials Research
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• v.19 no.5
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• pp.288-292
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• 2009

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.3
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• pp.32-38
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• 2005

Electrical discharge machining is the method of using thermal energy by electrical discharge. Generally, if the material of workpiece has conductivity even though very hard materials and complicated shape which are difficult to cut such as quenching steel, cemented carbide, diamond and conductive ceramics, the EDM process is favorable one of possible machining processes. But, the process is necessarily required of finish cut and heat treatment because of slow cutting speed, no mirror surface, brittleness and crack due to the residual stress for manufactured goods. In this experimental thesis, the super EDM drilling was developed for high precision semiconductor die steel and for minimization of leadframe width. It was possible to development of EDM drilling machine for high precision semiconductor die with the electrode guide and its modelling and stress analysis. The development of electrode with the copper pipe type was conducted to drill the hole from the diameter of 0.1mm to 3.0mm with the error of from 0.02mm to 0.12mm. From the SEM and EDX analysis, the entrance of the EDM drill was found the resolidification of not only the component of tungsten but also the component of copper.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.6
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• pp.123-132
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• 1999

This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from pasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64). Transference of data between AutoCAD and I-DEAS Master Series Drafting is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of five modules, which are input and shape treatment, production feasibility check, strip-layout, data-conversion and die-layout modules. The process planning and Die design system is designed by considering several factors, such as complexities of blank geometry, punch profiles, and the availability of a press equipment and standard parts. This system provides its efficiecy for strip-layout, and die design for lead frame, semiconductor.

• Journal of the Semiconductor & Display Technology
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• v.5 no.3 s.16
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• pp.5-10
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• 2006

This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.

• Journal of the Semiconductor & Display Technology
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• v.18 no.3
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• pp.12-18
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• 2019

The protective double layer polymer coatings on silica optical fibers are realized by wet-on-wet liquid coating process and they play an important role in final quality of mass produced optical fibers. This numerical study aims to analyze the effects of secondary coating die design parameters by employing two dimensional axisymmetric model of coating cup and coating die geometry and computational fluid dynamics simulations which include temperature dependent viscosity of polymer coating liquids and viscous dissipation heating. Under high speed fiber drawing conditions and pressurized coating liquid supply, the effects of converging die angle are investigated in order to appreciate the change of coating liquid flow patterns such as flow recirculation zone near coating die as well as primary and secondary coating layer thicknesses. The auxiliary coating die to converging coating die is also tested and the results find that this concept is advantageous in achieving stable double layer coatings on silica glass fiber.

• Journal of the Semiconductor & Display Technology
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• v.12 no.2
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• pp.19-25
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• 2013

Extrusion is one of the most important operations in the polymer-processing industry. Balancing the distribution of flow through a die to achieve a uniform velocity distribution is the primary objective and one of the most difficult tasks of extrusion die design. If the manifold in a coat-hanger die is not properly designed, the exit velocity distribution may be not uniform; this can affect the thickness across the width of the die. Yet, no procedure is known to optimize the coat hanger die with respect to an even velocity profile at the exit. While optimizing the exit velocity distribution, the constraint optimization used in this work with allowable pressure drop in the die; according to this constraint we can control the pressure in the die. The computational approach incorporates three-dimensional finite element simulations software STAR-CCM+. These simulations are used with numerical optimization to design polymer coat hanger dies with pressure drop, uniform velocity and temperature variation across the die exit.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.353-359
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• 1988

In this paper, the design and implementation of a multi-processor based die bonder machine for the semiconductor will be described. This is a final research results carried out for two years from June, 1986 to July, 1988. The mechanical system consists of three subsystems such as bonding head module, wafer feeding module, and lead frame feeding module. The overall control system consists of the following three subsystems each of which employs a 16 bit microprocessor MC 68000 : (i) supervisory control system, (ii) visual recognition / inspection system and (iii) the display system. Specifically, the supervisory control system supervises the whole sequence of die bonder machine, performs a self-diagnostics while it controls the bonding head module according to the prespecified bonding cycle. The vision system recognizes the die to inspect the die quality and deviation / orientation of a die with respect to a reference position, while it controls the wafer feeding module. Finally, the display system performs a character display, image display ans various error messages to communicate with operator. Lead frame feeding module is controlled by this subsystem. It is reported that the proposed control system were applied to an engineering sample and tested in real-time, and the results are sucessful as an engineering sample phase.