• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.3
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• pp.331-340
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• 2012

In the deep sub-micron ICs, growing amounts of on-die memory and scaling effects make embedded memories increasingly vulnerable to reliability and yield problems. Spare columns are often included in memories to repair defective cells or bit lines during production test. In many cases, the repair process will not use all spare columns. Schemes have been proposed to exploit these unused spare columns to store additional check bits which can be used to reduce the miscorrection probability for triple errors in single error correction-double error detection (SEC-DED). These additional check bits increase the dimensions of the parity check matrix (H-matrix) requiring extra area overhead. A method is proposed in this paper to efficiently fill the extra rows of the H-matrix on the basis of similarity of logic between the other rows. Optimization of the whole H-matrix is accomplished through logic sharing within a feasible operating time resulting in reduced area overhead. A detailed implementation using fuse technology is also proposed in this paper.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.71-71
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• 2003

Hot embossing has been widely accepted as an alternative to photolithography in generating patterns on polymeric substrates. The optimization of embossing process should be accomplished based on polymer substrate materials. In this paper, the effect of polymer substrates on nano scale hot embossing process was studied. Silicon molds with nano size patterns were fabricated by e-beam direct writing. Molds were coated with self-assembled monolayer (SAM) of (1, 1, 2.2H -perfluorooctyl)-trichlorosilane to reduce the stiction between mold and substrates. For an embossing, pressure of 55, 75 bur, embossing time of 5 min and temperature of above transition temperature were peformed. Polymethylmethacrylates (PMMA) with different molecular weights of 450,000 and 950,000, MR-I 8010 polymer (Micro Resist Technology) and polyaliphatic imide copolymer were applied for hot embossing process development in nano size. These polymers were spun coated on the Si wafer with the thickness between 150 and 200 nm. The nano size patterns obtained after hot embossing were observed and compared based on the polymer properties by scanning electron microscopy (SEM). The imprinting uniformity dependent on the Pattern density and size was investigated. Four polymers have been evaluated for the nanoimprint By optimizing the process parameters, the four polymers lead to uniform imprint and good pattern profiles. A reduction in the friction for smooth surfaces during demoulding is possible by polymer selection.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.10
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• pp.1696-1702
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• 2008

This paper proposes a voltage compensation device direct control strategy to realize the distributed, autonomous voltage control of the distribution system, which based on voltage data collected from customers of the remote site under the ubiquitous-based distribution system. In the proposed method, The ULTC and the SVR(Step Voltage Regulator)s compensate autonomously the voltage for self-compensation area based on the voltage data furnished from the ubiquitous device of customers. Also, the SVRs overcome the limit of single-operation of ULTC by the interlocking operation with the ULTC and enhance the voltage compensation capability for the customer. In particular, an optimization design method and a fuzzy design method are compared to determine the effective control method of the voltage compensator under the ubiquitous-based on-line operation environments. In fuzzy method, the tap of voltage compensator is defined as output member. Finally, the proposed two methods are implemented in Visual C++ MFC, the effectiveness is proved by simulation based on the worst virtual voltage data. Also, an optimal voltage compensation strategy is determined under on-line environments based on analyzed results.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.11
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• pp.2441-2446
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• 2009

Wireless Sensor Network collects a data from the specific area and the control is composed of small sensor nodes. Like this sensors to after that is established at the beginning are operated with the battery, the operational duration until several years must be continued from several months and will be able to apply the resources which is restricted in efficiently there must be. In this paper RHC (rounting history cache) applies in Directed Diffusion which apply a data central concept a reliability and an efficiency in data transfer course set. RHC algorithms which proposes each sensor node updated RHC of oneself with periodic and because storing the optimization course the course and, every event occurrence hour they reset the energy is wasted the fact that a reliability with minimization of duplication message improved.

• Journal of Applied Reliability
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• v.16 no.3
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• pp.224-230
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• 2016

Purpose: Military maintenance involves corrective and preventive actions carried out to keep a system in or restore it to a predetermined condition. This research develops an optimal maintenance cycle for aviation oil testing equipment with acceptable reliability level and minimum maintenance cost. Methods: The optimal maintenance policy in this research aims to satisfy the desired reliability level at the lowest cost. We assume that the failure process of equipment follows the power law non-homogeneous Poisson process model and the maintenance system is a minimal repair policy. Estimation and other statistical procedures (trend test and goodness of fit test) are given for this model. Results: With time varying failure rate, we developed reliability-based maintenance cost optimization model. This model will reduce the ownership cost through adopting a proactive reliability focused maintenance system. Conclusion: Based on the analysis, it is recommended to increase the current maintenance cycle by three times which is 0.5 year to 1.5 years. Because of the system's built-in self-checking features, it is not expected to have any problems of preventative maintenance cycle.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.71-78
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• 2012

This paper describes trends in conventional scaling compared with advanced technologies such as 3D integration (3DI) and bumpless through-silicon via (TSV) processes, as well as the characteristics of CMOS (Complementary Metal Oxide Semiconductor) Logic device after thinning the wafers to less than $10{\mu}m$. Each module process including thinning, stacking, and TSV, is optimized for 3D Wafer-on-Wafer (WOW) application. Optimization results are discussed with valuable data in detail. Since vertical wiring of bumpless TSV can be connected directly to the upper and lower substrates by self-alignment, bumps are not necessary when TSV interconnects are used.

• Journal of the Korean Institute of Intelligent Systems
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• v.15 no.1
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• pp.6-11
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• 2005

In this paper, we propose a new fuzzy clustering scheme that optimizes the initial structure and the parameters to improve the performance of a intelligent systems. The proposed method keeps the good properties of clustering, and improves the total systems' performance at the same time, Especially, the proposed algorithm not only keeps robust to change threshold value in the optimization process, but also improves the performance of a system through the process of the self-organizing and the converging intelligent systems in its structure of cluster. In experiments, the superiority of the proposed scheme is presented by comparing its performance with other methods.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.67-73
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• 2002

The development of high performance HTS wire is a key factor for various electrical applications of coils and cables. The purpose of this paper is to review and consider the main manufacturing technologies of HTS wire and its current status. A lot of efforts have been focused on the optimization of PIT parameters for Bi-2223/Ag wire. According to this, long Bi-2223 wires having Ic of 130 A were recently produced and their mass production has been underway in US. The current status performance of Bi-2223 wire is supposed to be used in power transmission cable because of its lower self-field property. Y-123 second generation conductor is extensively being developed throughout the world and many fabrication processes are competed with each other. 30 m-long Y-123 wire with Ic of 0.8 MA/$\textrm{cm}^2$ was recently fabricated using IBAD and PLD techniques in Japan. This result offers promise of scalable processing of practical multi-layer coated conductor.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.6
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• pp.687-693
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• 2011

Spring-mass models have been widely accepted to explain the basic dynamics of human gait. Researchers found that the leg stiffness increased with gait speed to increase energy efficiency. However, the difference of leg stiffness change with gait speed between the young and the elderly has not been verified yet. In this study, we calculated the lower limb stiffness of the elderly using walking model with an axial spring. Vertical stiffness was defined as the ratio of the vertical force change to the vertical displacement change. Seven young and eight elderly subjects participated to the test. The subjects walked on a 12 meter long, 1 meter wide walkway at four different gait speeds, ranging from their self-selected speed to maximum speed randomly. Kinetic and kinematic data were collected using three force plates and motion capture cameras, respectively. The vertical stiffness of the two groups increased as a function of walking speed. Maximum walking speed of the elderly was slower than that of the young, yet the walking speed correlated well with the optimal stiffness that maximizes propulsion energy in both groups. The results may imply that human may use apparent limb stiffness to optimize energy based on spring-like leg mechanics.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.2
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• pp.119-127
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• 2004

Butterfly valves are popularly used in service in the industrial and water works pipeline systems with large diameter because of its lightweight, simple structure and the rapidity of its manipulation. Sometimes cavitation can occur. resulting in noise, vibration and rapid deterioration of the valve trim, and do not allow further operation. Thus, the monitoring of cavitation is of economic interest and is very importance in industry. This paper proposes a condition monitoring scheme using statistical feature evaluation and support vector machine (SVM) to detect the cavitation conditions of butterfly valve which used as a flow control valve at the pumping stations. The stationary features of vibration signals are extracted from statistical moments. The SVMs are trained, and then classify normal and cavitation conditions of control valves. The SVMs with the reorganized feature vectors can distinguish the class of the untrained and untested data. The classification validity of this method is examined by various signals that are acquired from butterfly valves in the pumping stations and compared the classification success rate with those of self-organizing feature map neural network.