• Journal of Sensor Science and Technology
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• v.19 no.4
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• pp.306-312
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• 2010

We have detected deoxynivalenol(DON) using a metal-oxide-semiconductor field-effect-transistor(MOSFET)-based biosensor. The MOSFET-based biosensor is fabricated by a standard complementary metal-oxide-semiconductor(CMOS) process, and the biosensor's electrical characteristics were investigated. The output of the sensor was stabilized by employing a reference electrode that applies a fixed bias to the gate. Au which has a chemical affinity for thiol was used as the gate metal to immobilize a self-assembled monolayer(SAM) made of 16-mercaptohexadecanoic acid(MHDA). The SAM was used to immobilize anti-deoxynivalenol antibody. The carboxyl group of the SAM was bound to the anti- deoxynivalenol antibody. Anti-deoxynivalenol antibody and deoxynivalenol were bound by an antigen-antibody reaction. In this study, it is confirmed that the MOSFET-based biosensor can detect deoxynivalenol at concentrations as low as 0.1 ${\mu}g$/ml. The measurements were performed in phosphate buffered saline(PBS; pH 7.4) solution. To verify the interaction among the SAM, antibody, and antigen, surface plasmon resonance(SPR) measurements were performed.

• International Journal of Oral Biology
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• v.37 no.4
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• pp.181-188
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• 2012

As the demand for large-scale analysis of gene expression using DNA arrays increases, the importance of the surface characterization of DNA arrays has emerged. We compared the efficiency of molecular biological applications on solid-phases with different surface polarities to identify the most optimal conditions. We employed thiol-gold reactions for DNA immobilization on solid surfaces. The surface polarity was controlled by creating a self-assembled monolayer (SAM) of mercaptohexanol or hepthanethiol, which create hydrophilic or hydrophobic surface properties, respectively. A hydrophilic environment was found to be much more favorable to solid-phase molecular biological manipulations. A SAM of mercaptoethanol had the highest affinity to DNA molecules in our experimetns and it showed greater efficiency in terms of DNA hybridization and polymerization. The optimal DNA concentration for immobilization was found to be 0.5 ${\mu}M$. The optimal reaction time for both thiolated DNA and matrix molecules was 10 min and for the polymerase reaction time was 150 min. Under these optimized conditions, molecular biology techniques including DNA hybridization, ligation, polymerization, PCR and multiplex PCR were shown to be feasible in solid-state conditions. We demonstrated from our present analysis the importance of surface polarity in solid-phase molecular biological applications. A hydrophilic SAM generated a far more favorable environment than hydrophobic SAM for solid-state molecular techniques. Our findings suggest that the conditions and methods identified here could be used for DNA-DNA hybridization applications such as DNA chips and for the further development of solid-phase genetic engineering applications that involve DNA-enzyme interactions.

• Korean Chemical Engineering Research
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• v.46 no.6
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• pp.1069-1074
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• 2008

In this work, we made a study for the 3D SAM formation of octanethiol, decanethiol, and dodecanethiol on copper nanoparticles and we verified stability of the copper particle depending on the ratio of dodecanethiol to copper. The reaction was performed in a one-phase system under nitrogen atmosphere and the thiolated copper particles could be obtained by centrifugation. We could confirm that the nanoparticles consisted of a spherical shape of 3~6 nm from TEM images. FT-IR, XPS and TGA results showed that alkanethiols were chemisorbed via thiol group and the packing density of the alkanethiols on copper surface increased with the alkyl chain lengths. XRD patterns gave us useful information about superlattice formations. Finally, $Cu_2O$ was formed when the molar ratio of dodecanethiol to copper is less than unity and copper nanoparticles formed more compact 3D SAMs when the molar ratio of dodecanethiol to copper was 1.25.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1511-1513
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• 2005

The polymer-light emtting diodes(PLEDs) were comprised a design of OLED array, process develop by using ITO thin glass, and fabrication of PDMS stamp by using nanocontact printing. In the study, we describe a different approach for building OLEDs, which is based on physical lamination of thin metal electrodes supported by a PDMS stamp layer against an electroluminescent organic. We develop that devices fabricated in this manner have better performance than those constructed with standard processing techniques. The lamination approach avoids forms of disruption that can be introduced at the electrode organic interface by metal evaporation and has a reduced sensitivity to pinhole or partial pinhole defects. Also, it is easy to build patterned PLED with feature sizes into the nanometer regime. This method provides a new route to PLED for applications ranging from high performance displays to storage and lithography systems, and PLED can used for organic electronics and flexible display.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.71-71
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• 2003

Hot embossing has been widely accepted as an alternative to photolithography in generating patterns on polymeric substrates. The optimization of embossing process should be accomplished based on polymer substrate materials. In this paper, the effect of polymer substrates on nano scale hot embossing process was studied. Silicon molds with nano size patterns were fabricated by e-beam direct writing. Molds were coated with self-assembled monolayer (SAM) of (1, 1, 2.2H -perfluorooctyl)-trichlorosilane to reduce the stiction between mold and substrates. For an embossing, pressure of 55, 75 bur, embossing time of 5 min and temperature of above transition temperature were peformed. Polymethylmethacrylates (PMMA) with different molecular weights of 450,000 and 950,000, MR-I 8010 polymer (Micro Resist Technology) and polyaliphatic imide copolymer were applied for hot embossing process development in nano size. These polymers were spun coated on the Si wafer with the thickness between 150 and 200 nm. The nano size patterns obtained after hot embossing were observed and compared based on the polymer properties by scanning electron microscopy (SEM). The imprinting uniformity dependent on the Pattern density and size was investigated. Four polymers have been evaluated for the nanoimprint By optimizing the process parameters, the four polymers lead to uniform imprint and good pattern profiles. A reduction in the friction for smooth surfaces during demoulding is possible by polymer selection.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.30-34
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• 2008

The transfer assembly (or transfer printing) technique is a promising method for fabricating multi-scale structures on various substrates including semiconductors and polymers, and has been applied to fabrication of flexible devices with superior performance to conventional organic flexible devices. The mechanical behaviors of the structures fabricated by the transfer assembly is a very important information for design and reliability evaluation purpose, but the measurement of the behaviors is difficult since their critical-dimensions are very tiny. In this study, Au films with nano-scale thickness were fabricated on a silicon substrate and their mechanical properties were measured using micro-tensile test. The Au films on the silicon substrate were then transferred to a PDMS substrate using the transfer assembly technique. Self-assembled monolayer (SAM) with a thiol group was used to enhance the transfer of Au films, and the mechanical behaviors were characterized using wrinkle-based test. The test results from micro-tensile and wrinkle-based test are compared to each other, and their implication to the transfer assembly technique is discussed.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.357.1-357.1
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• 2014

Superhydrophobic WOx nanowire (NW) arrays were fabricated using a thermal evaporation and surface chemistry modification methods by self-assembled monolayer (SAM). As-prepared non-wetting WOx NWs surface shows water contact angle of $163.2^{\circ}$ and has reliable stability in underwater conditions. Hence the superhydrophobic WOx NWs surface exhibits silvery surface by total reflection of water layer and air interlayer. The stability analysus of underwater superhydrophobicity of WOx NWs arrays was conducted by changing hydrostatic pressure and surface energy of WOx NWs arrays. The stability of superhydrophobicity in underwater conditions decreased exponentially as hydrostatic pressure applied to the substrates increased3. In addition, as surface energy decreased, the underwater stability of superhydrophobic surface increased sharply. Specifically, sueprhydrophobic stability increased exponentially as surface energy of WOx NWs arrays was decreased. Based on these results, the models for explaining tendencies of superhydrophobic stability underwater resulting from hydrostatic pressure and surface energy were designed. The combination of fugacity and Laplace pressure explained this exponential decay of stability according to hydrostatic pressure and surface energy. This study on fabrication and modeling of underwater stability of superhydrophobic W18O49 NW arrays will help in designing highly stable superhydrophobic surfaces and broadening fields of superhydrophobic applications even submerged underwater.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.601-601
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• 2013

Superhydrophobic W18O49 nanowire (NW) arrays were synthesizedusing a thermal evaporation and surface chemistry modification methods by self-assembled monolayer (SAM). As-prepared non-wetting W18O49 NWs surface shows water contact angle of $163.2^{\circ}$ and has reliable stability in underwater conditions. Hence the superhydrophobic W18O49 NWs surface exhibits silvery surface by total reflection of water layer and air interlayer. The stability analysus of underwater superhydrophobicity of W18O49 NWs arrays was conducted by changing hydrostatic pressure and surface energy of W18O49 NWs arrays. The stability of superhydrophobicity in underwater conditions decreased exponentially as hydrostatic pressure applied to the substrates increased3. In addition, as surface energy decreased, the underwater stability of superhydrophobic surface increased sharply. Specifically, sueprhydrophobic stability increased exponentially as surface energy of W18O49 NWs arrays was decreased. Based on these results, the models for explaining tendencies of superhydrophobic stability underwater resulting from hydrostatic pressure and surface energy were designed. The combination of fugacity and Laplace pressure explained this exponential decay of stability according to hydrostatic pressure and surface energy. This study on fabrication and modeling of underwater stability of superhydrophobic W18O49 NW arrays will help in designing highly stable superhydrophobic surfaces and broadening fields of superhydrophobic applications even submerged underwater.

• Journal of the Korean Ceramic Society
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• v.40 no.3
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• pp.213-218
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• 2003

Band gap energies of SrTiO$_3$(STO) thin film on glass substrates were studied in terms of annealing temperature. The STO thin film was fabricated by our newly developed method based on the combination of the Self-Assembled Monolayer(SAM) technique and the Liquid Phase Deposition(LPD) method. The as-deposited film demonstrated a direct band gap energy of about 3.65 eV, which further increased to 3.73 eV and 3.78 eV by annealing at 40$0^{\circ}C$ and 50$0^{\circ}C$, respectively. The band gap energy saturated at about 3.70 eV for the crystallized film which was obtained by annealing at 600-$700^{\circ}C$. The relatively large band gap energies of our crystallized films were due to the presence of minor amorphous phase, grain boundaries and oxygen vacancies generated by annealing in air.

• Corrosion Science and Technology
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• v.22 no.6
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• pp.399-407
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• 2023

This study investigated the formation of oxide films on 6061 aluminum (Al) alloy and their impacts on corrosion resistance efficiency by regulating anodization voltage. Despite advantageous properties inherent to Al alloys, their susceptibility to corrosion remains a significant limitation. Thus, enhancing corrosion resistance through developing protective oxide films on alloy surfaces is paramount. The first anodization was performed for 6 h with an applied voltage of 30, 50, or 70 V on the 6061 Al alloy. The second anodization was performed for 0.5 h by applying 40 V after removing the existing oxide film. Resulting oxide film's shape and roughness were analyzed using field emission-scanning electron microscopy (FE-SEM) and atomic force microscopy (AFM). Wettability and corrosion resistance were compared before and after a self-assembled monolayer (SAM) using an FDTS (1H, 1H, 2H, 2H-Perfluorodecyltrichlorosilane) solution. As the first anodization voltage increased, the final oxide film's thickness and pore diameter also increased, resulting in higher surface roughness. Consequently, all samples exhibited superhydrophilic behavior before coating. However, contact angle after coating increased as the first anodization voltage increased. Notably, the sample anodized at 70 V with superhydrophobic characteristics after coating demonstrated the highest corrosion resistance performance.