• Restorative Dentistry and Endodontics
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• v.28 no.1
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• pp.1-10
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• 2003

This study investigated the influence of IRM on marginal microleakage of 5th generation adhesives. Class V cavities with gingival margins in dentin were prepared on both buccal and lingual surfaces of 60 extract-ed human molar teeth. Prepared teeth were randomly divided into six groups. Group 1 and 4 received no temporary restoration with IRM. Group 2 and 5 were covered with IRM mixed at P/L ratio(10g/1g). Group 3 and 6 were covered with IRM mixed at P/L ratio(10g/2g). The temporary restorations were removed mechanically with an ultrasonic scaler after one-week storage in distilled water. The cavities were restored using one of two adhesives and composites ; Single Bond/Filtek Z 250(Croup 1, 2 and 3), UniFil Bond/UniFil F(Group 4, 5 and 6). Following one day storage in distilled water, the restored teeth were thermocycled for 500 cycles(between $5^{\circ}C{\;}and{\;}55^{\circ}C$) and immersed in 2 % methylene blue for dye penetration testing. The results were analysed using Kruskal-Wallis Test, Mann-Whitney and Wilcoxon signed ranked test at a significance level of 0.05. The results of this study were as follows 1. Ranking of mean microleakage scores at the enamel margins was Group 10.05) 4. At the dentin margins, the microleakage of the group not pretreated with IRM was lower than that of the group pretreated with IRM. And the microleakage of UniFil Bond was lower than that of Single Bond. 5. Compared with microleakages between the enamel and dentin margins of each groups, Group 1, 2, 3, 4, 5 and 6 at dentin margin were higher microleakage than those at enamel margin. There were significant difference between enamel and dentin microleakage of Group 2 and 3(p<0.05).

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.77-77
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• 2000

Titanium oxide (TiO2) thin films have valuable properties such as a high refractive index, excellent transmittance in the visible and near-IR frequency, and high chemical stability. Therefore it is extensively used in anti-reflection coating, sensor, and photocatalysis as electrical and optical applications. Specially, TiO2 have a high dielectric constant of 180 along the c axis and 90 along the a axis, so it is highlighted in fabricating dielectric capacitors in micro electronic devices. A variety of methods have been used to produce patterned self-assembled monolayers (SAMs), including microcontact printing ($\mu$CP), UV-photolithotgraphy, e-beam lithography, scanned-probe based micro-machining, and atom-lithography. Above all, thin film fabrication on $\mu$CP modified surface is a potentially low-cost, high-throughput method, because it does not require expensive photolithographic equipment, and it produce micrometer scale patterns in thin film materials. The patterned SAMs were used as thin resists, to transfer patterns onto thin films either by chemical etching or by selective deposition. In this study, we deposited TiO2 thin films on Si (1000 substrateds using titanium (IV) isopropoxide ([Ti(O(C3H7)4)] ; TIP as a single molecular precursor at deposition temperature in the range of 300-$700^{\circ}C$ without any carrier and bubbler gas. Crack-free, highly oriented TiO2 polycrystalline thin films with anatase phase and stoichimetric ratio of Ti and O were successfully deposited on Si(100) at temperature as low as 50$0^{\circ}C$. XRD and TED data showed that below 50$0^{\circ}C$, the TiO2 thin films were dominantly grown on Si(100) surfaces in the [211] direction, whereas with increasing the deposition temperature to $700^{\circ}C$, the main films growth direction was changed to be [200]. Two distinct growth behaviors were observed from the Arhenius plots. In addition to deposition of THe TiO2 thin films on Si(100) substrates, patterning of TiO2 thin films was also performed at grown temperature in the range of 300-50$0^{\circ}C$ by MOCVD onto the Si(100) substrates of which surface was modified by organic thin film template. The organic thin film of SAm is obtained by the $\mu$CP method. Alpha-step profile and optical microscope images showed that the boundaries between SAMs areas and selectively deposited TiO2 thin film areas are very definite and sharp. Capacitance - Voltage measurements made on TiO2 films gave a dielectric constant of 29, suggesting a possibility of electronic material applications.

• Restorative Dentistry and Endodontics
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• v.30 no.6
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• pp.442-449
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• 2005

The purpose of the present study was to evaluate the relationship between the amount of cuspal deflection and linear polymerization shrinkage in resin composite and polyacid modified resin composite, For cuspal defelction and shrinkage measurement, Dyract AP, Compoglass F, Z100, Surefil. Pyramid, Synergy Compact, Heliomolar and Heliomolar HB were used. For measuring polymerization shrinkage, a custom made linometer (R&B, Daejon, Korea) was used The amount of shrinkage among materials was compared using One-way ANOVA analysis and Tukey's test at the $95\%$ of confidence level For measuring cuspal deflection of teeth, standardized MOD cavities were prepared in extracted maxillary premolars. After a self-etching adhesive was applied, cavities were bulk filled with one of the felling materials. Fifteen teeth were used for each material. Cuspal deflection was measured by a custom made cuspal-deflection measuring device. One-way ANOVA analysis and Tukey's test were used to determine differences between the materials at the $95\%$ of confidence level, Correlation of polymerization shrinkage and cuspal deflection were analyzed by regression analysis. The amount of polymerization shrinkage from least to greatest was Heliomolar, Surefil < Heliomolar HB < Z100, Synergy Compact < Dyract AP < Pyramid, Compoglass F (p<0.05). The amount of cuspal deflection from least to greatest was Z100, Heliomolar, Heliomolar HB, Synergy Compact Surefil < Compoglass F < Pyramid, Dyract AP (p < 0.05). The amount of polymerization shrinkage and cuspal deflection showed a correlation (p<0.001).

• Journal of dental hygiene science
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• v.13 no.3
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• pp.330-338
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• 2013

In order to explore microleakage in class V cavity based on different kinds of several dentin adhesive and composite resin, 2 kinds of composite resin was restored and exposed after applying 4 kinds of dentin adhesives. Deposited in methylene blue solution for 4 hours and cut in parallel with tooth longitudinal axis. By observing dye penetration level of enamel and dentin margins of each restored resin following conclusion was obtained. 1. In composite resin Filtek Z350XT Universal (3M/ESPE Dental Products, USA) in enamel margin, Easy Bond (3M/ESPE Dental Products) showed the lowest microleakage and this leakage was represented to be high in the order of Single Bond 2 (3M/ESPE Dental Products), Scotchbond Multi-Purpose (3M/ESPE Dental Products) and Cearfil SE Bond (Kuraray Medical Inc., Japan). In case of Filtek Z350XT Flowable (3M/ESPE Dental Products), Scotchbond Multi-Purpose showed the lowest microleakage and this leakage was represented to be high in the order of Single Bond 2, Clearfil SE Bond and Easy Bond. 2. In case of Filtek Z350XT Universal in dentin margin, Easy Bond showed the lowest microleakage and this leakage was represented to be high in the order of Scotchbond Multi-Purpose, Single Bond 2 and Clearfil SE Bond. In case of Filtek Z350XT Flowable, Scotchbond Multi-Purpose and Single Bond showed the lowest microleakage and this leakage was represented to be high in the order of Clearfil SE Bond and Easy Bond. 3. In all the groups excepting S-U group (Single Bond 2+Filtek Z350XT Universal), enamel margin showed more higher microleakage than that of dentin margin. 4. There was a difference between enamel and dentin margin among each group but it was not significant statistically (p>0.05). When summarizing this result, it is considered that composite resin and dentin adhesive could be applied selectively and particularly in case of applying 1-step self-etching dentin adhesive, this method would be advantageous for manipulation convenience and shortening of operation time.