• 신재생에너지
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• 제9권2호
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• pp.23-29
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• 2013

Furnace and laser is currently the most important doping process. However furnace is typically difficult appling for selective emitters. Laser requires an expensive equipment and induces a structural damage due to high temperature using laser. This study has developed a new atmospheric pressure plasma source and research atmospheric pressure plasma doping. Atmospheric pressure plasma source injected Ar gas is applied a low frequency (a few 10 kHz) and discharged the plasma. We used P type silicon wafers of solar cell. We set the doping parameter that plasma treatment time was 6s and 30s, and the current of making the plasma is 70 mA and 120 mA. As result of experiment, prolonged plasma process time and highly plasma current occur deeper doping depth and improve sheet resistance. We investigated doping profile of phosphorus paste by SIMS (Secondary Ion Mass Spectroscopy) and obtained the sheet resistance using generally formula. Additionally, grasped the wafer surface image with SEM (Scanning Electron Microscopy) to investigate surface damage of doped wafer. Therefore we confirm the possibility making the selective emitter of solar cell applied atmospheric pressure plasma doping with phosphorus paste.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.29.1-29.1
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• 2009

Fabrication of good quality P-type GaN remained as a challenge for many years which hindered the III-V nitrides from yielding visible light emitting devices. Firstly Amano et al succeeded in obtaining P-type GaN films using Mg doping and post Low Energy Electron Beam Irradiation (LEEBI) treatment. However only few region of the P-GaN was activated by LEEBI treatment. Later Nakamura et al succeeded in producing good quality P-GaN by thermal annealing method in which the as deposited P-GaN samples were annealed in N2 ambient at temperatures above $600^{\circ}C$. The carrier concentration of N type and P-type GaN differs by one order which have a major effect in AlGaN based deep UV-LED fabrication. So increasing the P-type GaN concentration becomes necessary. In this study we have proposed a novel method of activating P-type GaN by electrochemical potentiostatic method. Hydrogen bond in the Mg-H complexes of the P-type GaN is removed by electrochemical reaction using KOH solution as an electrolyte solution. Full structure LED sample grown by MOCVD serves as anode and platinum electrode serves as cathode. Experiments are performed by varying KOH concentration, process time and applied voltage. Secondary Ion Mass Spectroscopy (SIMS) analysis is performed to determine the hydrogen concentration in the P-GaN sample activated by annealing and electrochemical method. Results suggest that the hydrogen concentration is lesser in P-GaN sample activated by electrochemical method than conventional annealing method. The output power of the LED is also enhanced for full structure samples with electrochemical activated P-GaN. Thus we propose an efficient method for P-GaN activation by electrochemical reaction. 30% improvement in light output is obtained by electrochemical activation method.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.41-43
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• 1999

Among the feffoelectric thin films that have been widely investigated for ferroelectric random access memory (FRAM) applications, SrBi$_2$Ta$_2$$O_{9}$ thin film is appropriate to memory capacitor materials for its excellent fatigue endurance. However, very few studies on etch properties of SBT thin film have been reported although dry etching is an area that demands a great deal of attention in the very large scale integrations. In this study, the a SrBi$_2$Ta$_2$$O_{9}$ thin films were etched by using magnetically enhanced inductively coupled Ar/CHF$_3$ plasma. Etch properties, such as etch rate, selectivity, and etched profile, were measured according to gas mixing ratio of CHF$_3$(Ar$_{7}$+CHF$_3$) and the other process conditions were fixed at RF power of 600 W, dc bias voltage of 150 V, chamber pressure of 10 mTorr. Maximum etch rate of SBT thin films was 1750 A77in, under CHF$_3$(Ar+CHF$_3$) of 0.1. The selectivities of SBT to Pt and PR were 1.35 and 0.94 respectively. The chemical reaction of etched surface were investigated by X-ray photoelectron spectroscopy (XPS) analysis. The Sr and Ta atoms of SBT film react with fluorine and then Sr-F and Ta-F were removed by the physical sputtering of Ar ion. The surface of etched SBT film with CHF$_3$(Ar+CHF$_3$) of 0.1 was analyzed by secondary ion mass spectrometer (SIMS). Scanning electron microscopy (SEM) was used for examination of etched profile of SBT film under CHF$_3$(Ar+CHF$_3$) of 0.1 was about 85˚.85˚.˚.

• 조명전기설비학회논문지
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• 제27권6호
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• pp.95-99
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• 2013

Furnace is currently the most important doping process using POCl3 in solar cell. However furnace need an expensive equipment cost and it has to purge a poisonous gas. Moreover, furnace typically difficult appling for selective emitters. In this study, we developed a new atmospheric pressure plasma source, in this procedure, we research the atmospheric pressure plasma doping that dopant is phosphoric acid($H_3PO_4$). Metal tube injected Ar gas was inputted 5 kV of a low frequency(scores of kHz) induced inverter, so plasma discharged at metal tube. We used the P type silicon wafer of solar cell. We regulated phosphoric acid($H_3PO_4$) concentration on 10% and plasma treatment time is 90 s, 150 s, we experiment that plasma current is 70 mA. We check the doping depth that 287 nm at 90 s and 621 nm at 150 s. We analysis and measurement the doping profile by using SIMS(Secondary Ion Mass Spectroscopy). We calculate and grasp the sheet resistance using conventional sheet resistance formula, so there are 240 Ohm/sq at 90 s and 212 Ohm/sq at 150 s. We analysis oxygen and nitrogen profile of concentration compared with furnace to check the doped defect of atmosphere.

• Nuclear Engineering and Technology
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• 제45권2호
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• pp.211-218
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• 2013

Large quantities of irradiated graphite waste from graphite-moderated nuclear reactors exist and are expected to increase in the case of High Temperature Reactor (HTR) deployment [1,2]. This situation indicates the need for a graphite waste management strategy. Of greatest concern for long-term disposal of irradiated graphite is carbon-14 ($^{14}C$), with a half-life of 5730 years. Fachinger et al. [2] have demonstrated that thermal treatment of irradiated graphite removes a significant fraction of the $^{14}C$, which tends to be concentrated on the graphite surface. During thermal treatment, graphite surface carbon atoms interact with naturally adsorbed oxygen complexes to create $CO_x$ gases, i.e. "gasify" graphite. The effectiveness of this process is highly dependent on the availability of adsorbed oxygen compounds. The quantity and form of adsorbed oxygen complexes in pre- and post-irradiated graphite were studied using Time of Flight Secondary Ion Mass Spectrometry (ToF-SIMS) and Xray Photoelectron Spectroscopy (XPS) in an effort to better understand the gasification process and to apply that understanding to process optimization. Adsorbed oxygen fragments were detected on both irradiated and unirradiated graphite; however, carbon-oxygen bonds were identified only on the irradiated material. This difference is likely due to a large number of carbon active sites associated with the higher lattice disorder resulting from irradiation. Results of XPS analysis also indicated the potential bonding structures of the oxygen fragments removed during surface impingement. Ester- and carboxyl-like structures were predominant among the identified oxygen-containing fragments. The indicated structures are consistent with those characterized by Fanning and Vannice [3] and later incorporated into an oxidation kinetics model by El-Genk and Tournier [4]. Based on the predicted desorption mechanisms of carbon oxides from the identified compounds, it is expected that a majority of the graphite should gasify as carbon monoxide (CO) rather than carbon dioxide ($CO_2$). Therefore, to optimize the efficiency of thermal treatment the graphite should be heated to temperatures above the surface decomposition temperature increasing the evolution of CO [4].

• 대한기계학회논문집B
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• 제28권8호
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• pp.976-983
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• 2004

In high-density hard disk drives, the slider should be made to fly close to the magnetic recording disk to generate better signal resolution and at an increasingly high velocity to achieve better data rate. The slider disk interaction in CSS (contact-start-stop) mode is an important source of particle generation. Contamination particles in the hard disk drive can cause serious problems including slider crash and thermal asperities. We investigated the number and the sizes of particles generated in the hard disk drive, operating at increasing disk rotational speeds, in the CSS mode. CNC (condensation nucleus counter) and PSS (particle size selector) were used for this investigation. In addition, we examined the particle components by using SEM (scanning electron microscopes), AES (auger electron spectroscopy), and TOF-SIMS (time of flight-secondary ions mass spectrometry). The increasing disk rotational speed directly affected the particle generation by slider disk interaction. The number of particles that were generated increased with the disk rotational speed. The particle generation rate increased rapidly at motor speeds above 8000 rpm. This increase may be due to the increased slider disk interaction. Particle sizes ranged from 14 to 200 nm. The particles generated by slider disk interaction came from the lubricant on the disk, coating layer of the disk, and also slider surface.

• 대한기계학회논문집B
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• 제36권10호
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• pp.1019-1023
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• 2012

본 연구에서는 새로운 알루미늄 유도 결정화 공정을 제안하였다. 알루미늄 박막에 직접 3 A의 정전류를 인가하여 $1cm{\times}1cm$ 넓이의 두께 200 nm 비정질 실리콘 박막을 수십 초 내에 결정화하는 방법이다. 결정화된 다결정 실리콘 박막은 520 $cm^{-1}$ 에서의 라만 분광 피크를 통해 확인할 수 있었다. 공정 후, 알루미늄이 식각된 다결정 실리콘 박막은 다공성 구조임을 SEM 을 통하여 확인할 수 있었다. 또 한, 이차이온질량분석(secondary ion mass spectroscopy)에서 알루미늄 농도가 $10^{21}cm^{-3}$으로 헤비 도핑된 것을 확인 할 수 있었으며, 실시간으로 측정된 열화상 카메라의 결과를 통해 결정화는 820 K 근처에서 일어나는 것을 확인할 수 있었다.

• 한국진공학회지
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• 제22권5호
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• pp.238-244
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• 2013

태양전지 제조공정에서 열처리로 레이저를 사용하는 도핑공정은 태양전지의 성능을 결정짓는 중요한 요소이다. 그러나 퍼니스를 이용하는 공정에서는 선택적으로 고농도(Heavy) 도핑영역을 형성하기가 어렵다. 레이저를 사용한 선택적 도핑의 경우 고가의 레이저 장비가 요구되어지며, 레이저 도핑 후 고온의 에너지로 인한 웨이퍼의 구조적 손상 문제가 발생된다. 본 연구는 저가이면서 코로나 방전 구조의 대기압 플라즈마 소스를 제작하였고, 이를 통한 선택적 도핑에 관한 연구를 하였다. 대기압 플라즈마 제트는 Ar 가스를 주입하여 수십 kHz 주파수를 인가하여 플라즈마를 발생시키는 구조로 제작하였다. P-type 웨이퍼(Cz)에 인(P)이 shallow 도핑 된(120 Ohm/square) PSG (Phosphorus Silicate Glass)가 제거되지 않은 웨이퍼를 사용하였다. 대기압 플라즈마 도핑 공정 처리시간은 15 s와 30 s이며, 플라즈마 전류는 40 mA와 70 mA로 처리하였다. 웨이퍼의 도핑프로파일은 SIMS (Secondary Ion Mass Spectroscopy)측정을 통하여 분석하였으며, 도핑프로파일로 전기적 특성인 면저항(sheet resistance)을 파악하였다. 도펀트로 사용된 PSG에 대기압 플라즈마 제트로 도핑공정을 처리한 결과 전류와 플라즈마 처리시간이 증가됨에 따라 도핑깊이가 깊어지고, 면저항이 향상하였다. 대기압 플라즈마 도핑 후 웨이퍼의 표면구조 손상파악을 위한 SEM (Scanning Electron Microscopy) 측정결과 도핑 전과 후 웨이퍼의 표면구조는 차이가 없음을 확인하였으며, 대기압 플라즈마 도핑 폭도 전류와 플라즈마 처리시간이 증가됨에 따라 증가하였다.

• 대한전자공학회논문지SD
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• 제38권12호
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• pp.8-13
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• 2001

$CeO_2$ 박막은 강유전체 메모리 디바이스 응용을 위한 금속-강유전체-절연체-실리콘 전계효과 트랜지스터 구조에서의 강유전체 박막과 실리콘 기판 사이의 완충층으로서 제안되어지고 있다. 본 논문에서는 $CeO_2$ 박막을 유도 결합 플라즈마를 이용하여 $Cl_2$/Ar 가스 혼합비에 따라 식각하였다. 식각 특성을 알아보기 위한 실험조건으로는 RF 전력 600 W, dc 바이어스 전압 -200 V, 반응로 압력 15 mTorr로 고정하였고 $Cl_2$($Cl_2$+Ar) 가스 혼합비를 변화시키면서 실험하였다. $Cl_2$/($Cl_2$+Ar) 가스 혼합비가 0.2일때 $CeO_2$ 박막의 식각속도는 230 ${\AA}$/min으로 가장 높았으며 또한 $YMnO_3$에 대한 $CeO_2$의 선택비는 1.83이였다. 식각된 $CeO_2$ 박막의 표면반응은 XPS와 SIMS를 통해서 분석하였다. XPS 분석 결과 $CeO_2$ 박막의 표면에 Ce와 Cl의 화학적 반응에 의해 CeCl 결합이 존재함을 확인하였고, 또한 SIMS 분석 결과로 CeCl 결합을 확인하였다. $CeO_2$ 박막의 식각은 Cl 라디칼의 화학적 반응의 도움을 받으며 Ce 원자는 Cl과 반응을 하여 CeCl과 같은 혼합물로 $CeO_2$ 박막 표면에 존재하며 이들 CeCl 혼합물은 Ar 이온들의 충격에 의해 물리적으로 식각 되어진다.

• 한국진공학회지
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• 제2권2호
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• pp.188-198
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• 1993

두께가 6~10 nm인 게이트 산화막의 계면에 염소(Cl)를 도입시킨 n-MOS capacitor 및 n-MOSFET을 제잘하여 물성적인 방법(SIMS, ESCA)과 전기적인 방법에 의해서 소자의 특성을 분석, 평가하였다. Last step TCA법을 이용하여 성장시킨 산화막은 No TCA법으로 성장시킨 것보다 mobility가 7% 정도 증가하였고, 결함 밀도도 감소하였다. Time-zero-dielectric-breakdown(TZDB)으로 측정한 결과, Cl를 도입한 막의 파괴 전계(breakdon field)는 18 MV/cm인데, 이것은 Cl을 도입하지 않은 것보다 약 0.6 MV/cm 정도 높은 값이다. 또한 time-dependent-dielectric-breakdown(TDDB) 결과로부터 수명이 20년 이상인 것으로 평가되었고, hot carrier 신뢰성 측정으로부터 평가한 소자의 수명도 양호한 것으로 나타났다. 이상의 결과에서 Cl을 계면에 도입시킨 게이트 산화막을 가진 소자가 좋은 특성을 나타내고 있으므로 Last step TCA법을 종래의 산화막 성장 방법 대신에 사용하면 MOSFET 소자의 새로운 게이트 절연막 성장법으로서 대단히 유용할 것으로 생각된다.