Temperature Distribution According to the Structure of a Conductive Layer during Joule-heating Induced Encapsulation for Fabrication of OLED Devices (OLED 소자 제조를 위한 주울 가열 봉지 공정 시 도전층 구조에 따르는 열분포)
-
- Journal of Surface Science and Engineering
- /
- v.46 no.4
- /
- pp.162-167
- /
- 2013