• 한국기계가공학회지
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• 제17권4호
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• pp.137-142
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• 2018

Recycled synthetic resin materials produced from waste vinyl and waste plastic contain many foreign substances. Plastic products made from this recycled resin materials containing foreign substances are of poor quality, with reduced the strength and rigidity. Foreign substances include heavy metals, cement, foil, dyed paper and dust. In this study, the scratch-Dies process; which remove foreign sbustances, with precision and automation, through a three-stage mesh filter, is designed. The process is evaluated with finite element analysis according to vibration loading and make. After installing the manufactured equipment, recycled resin was producde, and its heavy metal content was evaluated. Recycled synthetic resin materials were also used plastic products and evaluate their strength. In addition, the change in production was assessed.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1998년도 춘계학술대회논문집
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• pp.151-154
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• 1998

Stainless steel sheets are widely used to produce electrical appliances. But there are various problems occured in forming stainless steel sheets such as scratch, local fracture, earing. So the productivity of electrical appliances made of stainless steel sheets is decreased. And it is very important to improve the formability of stainless steel sheets. In this study, rectangular cup drawing tests have been carried out to obtain optimum process parameters for improving the formablity of stainless steel sheets. In the tests, selected process parameters are materials of dies and punches, lubricating conditions, and blank holding force. From the test results, we suggest the appropriate conditions to be applicable to the actual manufacturing processes.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2007년도 추계학술대회 논문집
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• pp.140-141
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• 2007

The arc ion plating (AIP) technique has been used widely for thin coating in the area of surface engineering. The TiN coating is important in the field of dies, cutting tools and other mechanical parts. When forming the TiN films by AIP technique, the processing parameters such as arc power, bias voltage, working pressure, temperature of substrate and pre-treatment affected the adhesion respectively. The results of scratch test revealed that the adhesion strength was influenced by arc power most strongly. And a sequence of the importance of each parameters has been obtained. The crystal structure and cross-section of TiN films are also be investigated.

• Tribology and Lubricants
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• 제31권2호
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• pp.56-61
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• 2015

In this study, we investigated the effectiveness of an ultrasonic nanocrystal surface modification (UNSM) technique on the mechanical and wear properties of tungsten carbide (WC). The UNSM technique is a newly developed surface modification technique that increases the mechanical properties of materials by severe plastic deformation. The objective of this study was to improve the wear resistance of press die made of WC by applying the UNSM technique. We observed the microstructures of the untreated and UNSM-treated specimens using a scanning electron microscope (SEM), and energy-dispersive X-ray spectroscopy (EDX) was used to investigate the chemical composition. The SEM observations showed the pore size and the number of pores decreased after the UNSM treatment. We assessed the wear behavior of both the untreated and UNSM-treated specimens using a scratch test. The test results showed that the wear resistance of the UNSM-treated specimens increased by about 46% compared with the untreated specimens. This may be attributed to increased hardness, reduced surface roughness, induced compressive residual stress, and refined grain size following the application of the UNSM technique. In addition, we found that the UNSM treatment increased the carbon concentration to 63% from 33%. We expect that implementing the findings of this study will lead to an increase in the life of press dies.

• 응용통계연구
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• 제35권3호
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• pp.407-419
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• 2022

반도체는 제조 공정이 복잡하고 길어 결함이 발생될 때 빠른 탐지와 조치가 이뤄져야 결함으로 인한 손실을 최소화할 수 있다. 테스트 공정을 거쳐 구성된 웨이퍼 빈 맵(WBM)의 체계적인 패턴을 탐지하고 분류함으로써 문제의 원인을 유추할 수 있다. 이 작업은 수작업으로 이뤄지기 때문에 대량의 웨이퍼를 단 시간에 처리하는 데 한계가 있다. 본 논문은 웨이퍼 빈 맵의 정상 여부를 구분하기 위해 계층적 군집 분석을 활용한 새로운 결함 패턴 탐지 방법을 제시한다. 제시하는 방법은 여러 장점이 있다. 군집의 수를 알 필요가 없으며 군집분석의 조율 모수가 적고 직관적이다. 동일한 크기의 웨이퍼와 다이(die)에서는 동일한 조율 모수를 가지므로 대량의 웨이퍼도 빠르게 결함을 탐지할 수 있다. 소량의 결함 데이터만 있어도 그리고 데이터의 결함비율을 가정하지 않더라도 기계학습 모형을 훈련할 수 있다. 제조 특성상 결함 데이터는 구하기 어렵고 결함의 비율이 수시로 바뀔 수 있기 때문에 필요하다. 또한 신규 패턴 발생시에도 안정적으로 탐지한다. 대만 반도체 기업에서 공개한 실제 웨이퍼 빈 맵 데이터(WM-811K)로 실험하였다. 계층적 군집 분석을 이용한 결함 패턴탐지는 불량의 재현율이 96.31%로 기존의 공간 필터(spatial filter)보다 우수함을 보여준다. 결함 분류는 혼합 유형에 장점이 있는 계층적 군집 분석을 그대로 사용한다. 직선형과 곡선형의 긁힘(scratch) 결함의 특징에 각각 주성분 분석의 고유값과 2차 다항식의 결정계수를 이용하고 랜덤 포레스트 분류기를 이용한다.