• 제목/요약/키워드: Schottky diode parameter

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DC 순방향 바이어스 인가조건에서 Schottky 다이오드의 SPICE 모델 파라미터 추출 방법에 관한 연구 (The Study on the SPICE Model Parameter Extraction Method for the Schottky Diode Under DC Forward Bias)

  • 이은구
    • 전기학회논문지
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    • 제65권3호
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    • pp.439-444
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    • 2016
  • The method for extracting the SPICE model parameter of Schottky diode under DC forward bias is proposed. A method for improving the accuracy of the SPICE model parameter at various temperatures is proposed. Three analysis steps according to the magnitude of the current is used in order to extract the parameters effectively. At each analysis step, initial parameters are calculated by using the current-voltage equations and the Levenberg-Marquardt analysis is proceeded. To verify the validity of the proposed method, the SPICE model parameters for the BAT45 and FSV1045 under DC forward bias is extracted. Schottky diode currents obtained from the proposed method shows the average relative error of 6.1% and 9% compared with the measured data for the BAT45 and FSV1045 sample at various temperatures.

대향 타겟 스퍼터링법으로 제작한 SiC SBD의 전기적 특성 (Electrical Characteristics of the SiC SBD Prepared by using the Facing Targets Sputtering Method)

  • 이진선;강태영;김경환
    • 반도체디스플레이기술학회지
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    • 제14권1호
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    • pp.27-30
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    • 2015
  • SiC based Schottky barrier diodes were prepared by using the facing targets sputtering method. In this research, 4H-SiC polytypes of SiC were adopted and Molybdenum, Titanium was employed as the Schottky metal of the metal-semiconductor contacts. Both structures showed the rectifying nature in their forward and reverse J-V characteristic curve and the ideality factors calculated from these plots that were close to unity were represented the nearly ideal behavior. Difference of Schottky barrier height between prepared devices was also corresponding with the electrical characteristics of themselves. Therefore the suitability of the facing targets sputtering method for fabrication of Schottky diodes could be suggested from these results.

Schottky barrier 다이오드의 외부 기생 소자 및 내부 소자 추출에 관한 연구 (A Study on Extracting the Parasitic and Intrinsic Parameters of Equivalent Circuit for Schottky Barrier Diode)

  • 조동준;김영훈;최민수;양승인;전용구
    • 한국전자파학회:학술대회논문집
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    • 한국전자파학회 2000년도 종합학술발표회 논문집 Vol.10 No.1
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    • pp.248-251
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    • 2000
  • 본 논문에서는 SIEMENS사의 BAS125 소자의 I-V curve에서 RF신호를 고려하여 파라미터를 추출하였으며, 바이어스에 독립적인 외부소자를 추출하고, 바이어스에 종속적인 접합캐패시터를 S-parameter를 fitting하여 추출하였다.

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ICP-CVD로 성장된 SiC 박막위에 다양한 금속으로 제작된 Schottky diode의 특성 분석 (Characterization of Schottky diodes fabricated by various metals on SiC thin film grown by ICP-CVD)

  • 고석일;김용상
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2000년도 추계학술대회 논문집 학회본부 C
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    • pp.440-442
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    • 2000
  • We have successfully fabricated SiC Schottky diodes using Al, Ni, Ti metallization systems. Schottky barrier height and other parameter have been measured by using I-V and C-V technique. The measured barreir heights depend on the metal and measurement techniques used. The barrier heights were 1.85eV(Al), 1.63eV(Ni), 0.97eV(Ti). The Ideality factors were 1.16(Al), 1.07(Ni), 1.05(Ti). Thermal stress tests were performed.

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근역장 측정용 프로브의 설계 및 제작 (Probe Design and Fabrication for Measuring Near Field)

  • 김병찬;최형도;이애경;이형수
    • 한국전자파학회논문지
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    • 제13권2호
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    • pp.164-169
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    • 2002
  • 본 논문에서는 300~3000 MHz 의 주파수 영역에서 동작하는 근역장 측정 프로브를 설계하여 제작하였다. 설계 파라미터는 프로브에 대한 등가회로를 이용하여 추출하였으며 S파라미터를 이용한 수치해석을 통해 그 특성을 예측하였다. 제작된 프로브는 3.25 mm 길이의 다이폴 안테나와 제로 바이어스 쇼트키 다이오드, 고저항 전송 선으로 구성되어 있으며 TEM 셀을 이용하여 성능을 확인하였다.

GaAs MESFET을 이용한 MIC 게이트 Mixer의 설계 및 제작 (Design and Fabrication of a MIC Gate Mixer Using GaAs MESFET)

  • 박한규;김남수
    • 대한전자공학회논문지
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    • 제23권6호
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    • pp.868-873
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    • 1986
  • The Schottky barrier diode has been used as an element of the mixer inspite of its conversion loss. In this paper the use of a GaAs MESFET is shown as a device of mixer, and the conversion gain is obtained. Also, input matching circuits aredesigned by s-parameter and fabricated on a dielectric teflon epoxy fiber glass substrate. According to the results, the conversion gain is 9 dB at the signal frequency of 4 GHz and the intermediate frequency of 1.217GHz.

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High Security FeRAM-Based EPC C1G2 UHF (860 MHz-960 MHz) Passive RFID Tag Chip

  • Kang, Hee-Bok;Hong, Suk-Kyoung;Song, Yong-Wook;Sung, Man-Young;Choi, Bok-Gil;Chung, Jin-Yong;Lee, Jong-Wook
    • ETRI Journal
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    • 제30권6호
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    • pp.826-832
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    • 2008
  • The metal-ferroelectric-metal (MFM) capacitor in the ferroelectric random access memory (FeRAM) embedded RFID chip is used in both the memory cell region and the peripheral analog and digital circuit area for capacitance parameter control. The capacitance value of the MFM capacitor is about 30 times larger than that of conventional capacitors, such as the poly-insulator-poly (PIP) capacitor and the metal-insulator-metal (MIM) capacitor. An MFM capacitor directly stacked over the analog and memory circuit region can share the layout area with the circuit region; thus, the chip size can be reduced by about 60%. The energy transformation efficiency using the MFM scheme is higher than that of the PIP scheme in RFID chips. The radio frequency operational signal properties using circuits with MFM capacitors are almost the same as or better than with PIP, MIM, and MOS capacitors. For the default value specification requirement, the default set cell is designed with an additional dummy cell.

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