• Title/Summary/Keyword: Scattering Parameter, Network

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Analysis and Modeling of Clock Grid Network Using S-parameter (S-파라미터를 사용한 클락 그리드 네트워크의 분석과 모델링)

  • Kim, Kyung-Ki
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.44 no.12
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    • pp.37-42
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    • 2007
  • Clock grid networks are now common in most high performance microprocessors. This paper presents a new effective modeling and simulation methodology for the clock grid using scattering parameter. It also shows the effect of wire width and grid size on the clock skew of the grid. The interconnection of the clock grid is modeled by RC passive elements. The results show that the error is within 10 % comparing to Hspice simulation results.

Two-Port Vector Network Analysis System with a Vector Signal Channel (벡터 전압 수신기를 이용한 2-포트 산란 계수 분석 시스템)

  • Lee, Dong-Joon
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.24 no.5
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    • pp.541-548
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    • 2013
  • This paper presents a vector network analysis system for 2-port scattering parameters of microwave devices using some basic microwave instruments/devices such as signal generators, vector voltmeter, directional couplers and frequency mixers. The analytical model and implementation method for scattering parameter measurements - which can replace the vector network analyzers - are presented. The performance of the implemented system is evaluated through 1- and 2-port scattering parameter measurements, respectively. The vector volt signals which determine the scattering parameters are detected in two distinct methods depending on the frequency band of interests; a direct-detection method with a single signal generator and vector voltmeter for relatively low band and a heterodyne method to frequency down-mix associated with an additional signal source as well as frequency mixers for high band are used, respectively. Using these two methods, scattering parameters of UHF and X bands are evaluated and their performances are verified through a comercial vector network analyzer.

Microwave Network Study by Bond Graph Approach. Application to Tow-Port Network Filter

  • Jmal, Sabri;Taghouti, Hichem;Mami, Abdelkader
    • International Journal of Computer Science & Network Security
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    • v.22 no.1
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    • pp.121-128
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    • 2022
  • There are much processing techniques of microwave circuits, whose dimensions are small compared to the wavelength, but the disadvantage is that they cannot be directly applied to circuits working at high and/or low frequencies. In this article, we will consider the bond graph approach as a tool for analyzing and understanding the behavior of microwave circuits, and to show how basic circuit and network concepts can be extended to handle many microwaves analysis and design problems of practical interest. This behavior revealed in the scattering matrix filter, and which will be operated from its reduced bond graph model. So, we propose in this paper, a new application of bond graph approach jointly with the scattering bond graph for a high frequency study.

The Response to Impulse Signal on Three Phase Transformer using Vector Network Analyzer (벡터 회로망 분석기 측정을 기반으로 한 3상 변압기의 시간영역 펄스 신호에 대한 응답 분석)

  • Kim, Kwangho;Jung, Jongman;Nah, Wansoo
    • KEPCO Journal on Electric Power and Energy
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    • v.1 no.1
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    • pp.79-84
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    • 2015
  • Transformer is widely used element on power system and industrial area. Especially the transformers installed at power system are exposed to an environment of arbitrary changed. Thus the prediction of degradation and the analysis of response to impulse are important. To conduct those works, the electrical characteristics of system should be analyzed, effectively. But the analysis of electrical characteristic in electric machine level such as pole and pad-mounted transformer is almost no, thus commercial VNA (Vector Network Analyzer) is used to getting the response in wide frequency range. However, the output power of VNA is usually under 10mW, so verification for effectiveness of measuring electrically large component should be conducted, firstly. Next, after getting total S-parameter of transformer, predicting impulse response can be performed in time-domain with circuit simulator. In this paper, it is introduced that verification effectiveness of VNA using transfer function from SFRA (Sweep Frequency Response Analyzer), firstly. Next, total S-parameter, six by six matix form, was built using measured 2 port S-parameter from vector network analyzer. To get the response to impulse which is defined by IEC 60060-1, time-domain simulation is conducted to ADS (Advenced Design System) circuit simulator.

Measurement of Multi-Port S-Parameters using Four-Port Network Analyzer

  • Kim, Jongmin;Luong, Duc Long;Nah, Wansoo;Kim, SoYoung
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.13 no.6
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    • pp.589-593
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    • 2013
  • An efficient measurement methodology is proposed to construct the scattering parameters of a multi-port device using a four-port vector network analyzer (VNA) without the external un-terminated ports. By using the four-port VNA, the reflected waves from the un-terminated ports could be minimized. The proposed method significantly enhances the accuracy of the S-parameters with less number of measurements compared to the results of classical renormalization technique which uses two-port VNA. The proposed method is validated from the measured data with the coupled 8-port micro-strip lines.

Reliability Evaluation of RF Power Amplifier for Wireless Transmitter

  • Choi, Jin-Ho
    • Journal of information and communication convergence engineering
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    • v.6 no.2
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    • pp.154-157
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    • 2008
  • A class-E RF(Radio Frequency) power amplifier for wireless application is designed using standard CMOS technology. To drive the class-E power amplifier, a class-F RF power amplifier is used and the reliability characteristics are studied with a class-E load network. The reliability characteristic is improved when a finite-DC feed inductor is used instead of an RF choke with the load. After one year of operating, when the load is an RF choke the output current and voltage of the power amplifier decrease about 17% compared to initial values. But when the load is a finite DC-feed inductor the output current and voltage decrease 9.7%. The S-parameter such as input reflection coefficient(S11) and the forward transmission scattering parameter(S21) is simulated with the stress time. In a finite DC-feed inductor the characteristics of S-parameter are changed slightly compared to an RF-choke inductor. From the simulation results, the class-E power amplifier with a finite DC-feed inductor shows superior reliability characteristics compared to power amplifier using an RF choke.

Measurements of Dielectric constant and Loss tangent of Microwave Substrates (초고주파 대역에서의 기판의 유전상수 및 손실계수 측정)

  • 이선하;한상민;김영식
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • 2000.11a
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    • pp.238-242
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    • 2000
  • In this paper, the method for dielectric constant and less tangent measurements of microwave substrates using a microstrip line is presented. The two samples of an open-ended line and a short-ended tine are made and complex propagation constant is evaluated from the one-port scattering parameter measurements. This method has been automated fully using a personal computer and a vector network analyzer.

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Analysis of Electromagnetic Wave Scattering Characteristics of Dielectric Barrier Discharge Plasma (유전체 장벽 방전 플라즈마의 전자파 산란 특성 분석)

  • Lee, Soo-Min;Oh, Il-Young;Hong, Yong-Jun;Yook, Jong-Gwan
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.24 no.3
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    • pp.324-330
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    • 2013
  • This paper presented measurement results of scattering characteristics of dielectric barrier discharge (DBD) plasma at atmospheric pressure. In this paper, plasma actuator is fabricated by parallel connecting of basic configuration of DBD plasma actuator, then plasma could be generated by applying 14 kV, 4 kHz of high voltage generator. In order to measure the scattering characteristics of DBD plasma, in this paper, two horn antennas and vector network analyzer are used to compare the S-parameter. Because of the structure of fabricated plasma generator, different result is obtained as antenna polarization changes. When antenna polarization is parallel to electrodes of plasma generator, the scattered field is reduced by 2 dB in maximum. In addition, for parallel polarization case, PEC is set up behind the plasma generator to measure backward scattered field. When the observation angles are $40^{\circ}C$ and $60^{\circ}C$, the amount of reduced scattered field is 2 dB in maximum at 5 GHz.

Estimation of Antenna Correlation Coefficient of N-Port Lossy MIMO Array

  • Saputro, Susilo Ady;Nandiwardhana, Satya;Chung, Jae-Young
    • ETRI Journal
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    • v.40 no.3
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    • pp.303-308
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    • 2018
  • This paper proposes a simple yet accurate method for estimating the antenna correlation coefficient (ACC) of a high-order multiple-input multiple-output (MIMO) antenna. The conventional method employed to obtain the ACC from three-dimensional radiation patterns is costly and difficult to measure. An alternate method is to use the S-parameters, which can be easily measured using a network analyzer. However, this method assumes that the antennas are highly efficient, and it is therefore not suitable for lossy MIMO antenna arrays. To overcome this limitation, we define and utilize the non-coupled radiation efficiency in the S-parameter-based ACC formula. The accuracy of the proposed method is verified by the simulation results of a 4-port highly coupled lossy MIMO array. Further, the proposed method can be applied to N-port arrays by expanding the calculation matrix.

Experimental Characterization and Signal Integrity Verification of Interconnect Lines with Inter-layer Vias

  • Kim, Hye-Won;Kim, Dong-Chul;Eo, Yung-Seon
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.11 no.1
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    • pp.15-22
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    • 2011
  • Interconnect lines with inter-layer vias are experimentally characterized by using high-frequency S-parameter measurements. Test patterns are designed and fabricated using a package process. Then they are measured using Vector Network Analyzer (VNA) up to 25 GHz. Modeling a via as a circuit, its model parameters are determined. It is shown that the circuit model has excellent agreement with the measured S-parameters. The signal integrity of the lines with inter-layer vias is evaluated by using the developed circuit model. Thereby, it is shown that via may have a substantially deteriorative effect on the signal integrity of high-speed integrated circuits.